Solder Heat Resistance Test (SMD)

By applying chemical etching, ion milling, and FIB processing to mechanical polishing methods, we will analyze various metal joints, starting with lead-free solder.

The joints of electronic components have a significant impact on the overall reliability of the circuit board. Particularly at solder joints, not only the shape but also the observation of the metal structure becomes important.

• Other analytical equipment

We conduct environmental testing, as well as non-destructive observation and electrical characteristic measurements.

At AITES, we use environmental testing equipment that complies with standard specifications such as JIS, JEDEC, and MIL to conduct reliability evaluation testing for various electronics products, components, and materials. We offer a range of tests including electrical testing, non-destructive observation, and power cycle testing. 【Environmental Testing】 ■ Highly Accelerated Life Testing ■ Constant Temperature and Humidity Testing ■ Thermal Shock Testing ■ Liquid Bath Thermal Shock Testing ■ Temperature and Humidity Cycle Testing ■ In-Situ Continuous Measurement Reliability Evaluation Testing Service *For more details, please refer to the PDF document or feel free to contact us.

• Other analytical equipment

We will introduce the pre-treatment for cross-sectional observation using devices such as band saws for sample cutting!

We would like to introduce the pre-treatment for cross-sectional observation (sample cutting and resin embedding) conducted by Aites Co., Ltd. We use cutting equipment suitable for cutting large substrates and thick components, such as the band saw "HOZAN K-100" and the IsoMet "Buehler Low Speed Saw" for sample cutting. With the "HOZAN K-100," samples up to approximately X150mm, Y230mm, and Z70mm in size can be cut. Additionally, after cutting, the samples are embedded in epoxy resin or similar materials, but it is also possible to embed in resin before cutting. 【Product Lineup】 ■ Band Saw ■ IsoMet ■ Multifunctional Diamond Wire Saw *For more details, please refer to the PDF document or feel free to contact us.

• others

Each part is carefully polished by hand, using an efficient process without waste!

Our company specializes in "cross-section polishing of implementation parts and electronic components." To quickly provide cross-section samples suitable for observing various parts, we carefully polish each component by hand, using an efficient process without waste. Please feel free to contact us for more information. 【Features】 ■ Quickly provide cross-section samples suitable for observing various parts ■ Carefully polish each component by hand, using an efficient process without waste *For more details, please refer to the PDF materials or feel free to contact us.

• others

You can closely observe the soldering condition of electronic components on the implementation board and the internal structure of the components!

We conduct "cross-sectional observation of surface-mounted electronic components." Through cross-sectional observation after mechanical polishing, it is possible to closely examine the solder joint condition (presence of cracks or voids) of electronic components on the mounted substrate, as well as the internal structure of the components. For "SOP components," detailed observation can be made from the overall cross-section to the solder connection, and for "aluminum electrolytic capacitors," it is possible to observe the internal structure of the electrolytic capacitor components and their connection to the substrate. 【Features】 ■ SOP (Small Outline Package) components - Detailed observation can be made from the overall cross-section of SOP components to the solder connection. ■ Chip ceramic capacitors - Detailed observation can be made from cracks in the component material to cracks in the solder area. ■ Aluminum electrolytic capacitors - Observation can be made from the internal structure of the electrolytic capacitor components to their connection to the substrate. *For more details, please refer to the PDF document or feel free to contact us.

• others

Hotron Inc. has launched its new product, the "Vehicle Count Sensor CCS3"! This product is a ceiling-mounted sensor that combines infrared and radar technology. It reliably detects vehicles in both directions with a single unit, accommodating traffic during congestion and vehicle passing, thus achieving efficient occupancy management in large parking lots. Additionally, it can be utilized for exit warning purposes in addition to vehicle counting, contributing to the safe and smooth operation of parking facilities. 'Features' - Improved detection performance against changes in road surface during rainy weather by using both infrared and radar. - Equipped with IP67 waterproof and dustproof performance, making it effective even in salt damage areas. - Various settings can be configured from a dedicated app (for Android devices), with current settings easily visible at a glance. - The base dimensions are the same as the previous model "CCS2," allowing for smooth replacement of existing equipment. *For more details, please refer to the product information, catalog download, or contact us.*

The signing methods for electronic contracts (party type and witness type) are directly linked to the strength of their legal effectiveness. In this article, we will outline the reasons why the more stringent "party type" has been difficult to popularize until now. ---【Conclusion of this article】-------------------------------- • There are two signing methods for electronic contracts: "witness type" and "party type," which differ in the strictness of identity verification. • The main reasons why the party type has not spread are the three factors of "effort, cost, and the structural risk of entrusting a private key." • However, with the spread of public personal authentication (JPKI) using My Number cards, these three barriers are beginning to crumble. -------------------------------------------------------- The full text of the article can be accessed from the "Related Links."

Seven Corporation has started offering the "SeveNavi AI Cleaning Diagnosis Service," which supports the organization and improvement of cleaning challenges in manufacturing environments. Organizing cleaning challenges with AI and visualizing the next steps In manufacturing cleaning, various factors need to be considered, including the material of the object, type of dirt, adhesion state, currently used cleaning agents, working time, safety, and equipment conditions. On the other hand, there are also several challenges faced on-site, such as: - Unable to determine if the current cleaning method is appropriate - Wanting to reduce cleaning time and labor - Concerns about the safety of cleaning agents and their impact on materials - Wanting to compare with another cleaning method but unable to set test conditions - Not being able to utilize past cases and knowledge for improvement activities SeveNavi organizes information such as the object, dirt, current cleaning methods, and site photos using AI, clearly presenting the applicability of cleaning methods, points of caution, missing information, and how to proceed with comparative testing. If you have any challenges regarding reviewing current cleaning methods, comparing new cleaning methods, or reducing cleaning time and labor, please feel free to consult with us.

An online seminar will be held for design, purchasing, and DX promotion personnel considering the introduction or switch to new CAD systems, featuring the DWG-compatible 2D CAD "ARES." Participants can review content directly related to business improvement, including a comparison of features and performance with AutoCAD, automation using the CAD-specific AI "A3," automatic generation of DWG drawings from BIM data, and new ways of working in the cloud. ■ Date and Time: September 17, 2026 (Thursday) 13:30 - 15:00 ■ Format: Online (with archive viewing available) ■ Participation Fee: Free ■ Recommended for: - Those considering switching from AutoCAD - Those interested in AI utilization and automation in CAD operations - Those looking to streamline collaboration with BIM - Those seeking an environment where drawings can be edited regardless of location As a viewing benefit, a free "ARES Trinity Utilization Manual" (worth 6,000 yen) will be provided. Additionally, if you apply through the URL in the related links, our company, Keynos Logic, will consistently support you from post-seminar implementation considerations to estimates and support after operation begins. If you are interested in ARES, feel free to start by participating in this seminar.

On August 28, 2026 (Friday), I participated in the "AMD Embedded Computing Summit Tokyo 2026" and showcased a "Gesture Demo" as a partner of AMD. The demonstration introduced a configuration that combines gesture recognition using OpenCV, status reporting with LLM, and one-axis motor control using INtime 7.2 and RSI-ECAT, enabling collaboration between AI, image processing, and real-time control on a single PC. We presented a next-generation PC-based industrial control system that integrates AI, image processing, and real-time control on one PC. <Overview of Demo Participation> https://www.mnc.co.jp/INtime/AMDxINtime/AMDEcsTokyoResults.html <Actual Demo Video> https://youtu.be/JmZke75_y0s <AMD CPU + INtime RTOS Introduction Page> https://www.mnc.co.jp/INtime/AMDxINtime/amdxintime.html #PC #RealTimeOS #IndustrialPC #AI