Reduce product costs with high-precision thermal property analysis! (Thermal simulation)
Are you increasing product costs to ensure product design reliability? If optimal thermal measures are not implemented, excessive measures can reduce market competitiveness, while insufficient measures can increase development costs. However, by optimizing temperature margin design, total costs can be reduced (thermal simulation). Our unique method features localized heating of specific parts of the chip, measuring at the PN junction within the heated area. Additionally, by constructing a simulation model that fits the measurement results, the entire system product can predict temperatures using simulation technology. We also offer consulting services, including the creation of libraries and the standardization of heat dissipation measures and thermal management. For more details, please download the catalog or contact us.
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**Features** ○ High Precision → The uniform heat state within the heating area can be confirmed. Measurements can be taken at specific PN junctions within the heating area, allowing for the maximum temperature to be obtained. Accurate ΔT can be determined. → Since there are no confirmed temperature rise areas outside the heating area, power loss is unlikely to occur. ○ Thermal design can be implemented during upstream design → By preventing defects during development, development costs can be reduced. → Products can be supplied without market complaints. ○ Optimal heat dissipation design can be achieved → The unit cost of the product decreases. → Miniaturization becomes possible, increasing market competitiveness. For more details, please download the catalog or contact us.
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Company information
As a development and design company, we promote the development, design, and evaluation of semiconductor peripheral circuits and application products through simulation technology.