For printed circuit boards. An alternative to the electroless Ni-P/replacement Au plating process is possible.
The 'Electroless Ni-P/Replacement Au plating process with excellent solder wettability' is an alternative plating process that uses 4Ag, which has similar characteristics to Au, allowing it to be a substitute for the electroless Ni-P/replacement Au plating process. The solder wettability is better immediately after plating than that of the electroless Ni-P/replacement Au plating. For more details, please contact us or download the catalog.
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basic information
【Features】 ○ This is a plating process that uses 4Ag, which has similar properties to Au, allowing for an alternative to the electroless Ni-P/replacement Au plating process. ○ The solder wettability is better immediately after plating compared to the electroless Ni-P/replacement Au plating. ○ Ideal for printed circuit boards. ○ Provides extensive support from research and development to prototyping and mass production. ● For more details, please contact us or download the catalog.
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Applications/Examples of results
【Usage】 ○Printed Circuit Board
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Company information
Sankyo Co., Ltd. takes a solid step forward and delivers the highest quality as a specialist in surface treatment, capable of accurately responding to changes in the times. Through our work in surface treatment, we will continue to provide products that satisfy society (customers) with our proactive efforts in D (meeting customer delivery requirements), Q (stable product quality), and C (rationalization for cost reduction), thereby achieving the prosperity of the company and improving the lives of our employees.