Electroless Ni-P/Replacement Au plating process with excellent corrosion resistance as an alternative plating process.
For printed circuit boards. An alternative plating process with excellent corrosion resistance using electroless Ni-P/replaceable Au plating.
The electroless Ni-P/replacement Au plating alternative plating process forms a dense and corrosion-resistant Pd coating between the electroless Ni-P plating and the replacement Au plating, resulting in excellent corrosion resistance. Although a Pd coating is formed as an intermediate layer, the solder wettability immediately after plating is almost equivalent to that of electroless Ni-P/replacement Au plating. For more details, please download the catalog or contact us.
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basic information
【Features】 - A dense and corrosion-resistant Pd coating is formed between the electroless Ni-P plating and the replacement Au plating, providing excellent corrosion resistance. - Although a Pd coating is formed as an intermediate layer, the solder wettability immediately after plating is almost equivalent to that of electroless Ni-P/replacement Au plating. - Ideal for printed circuit boards. - Wide-ranging support from research and development to prototyping and mass production. For more details, please download the catalog or contact us.
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Delivery Time
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Applications/Examples of results
【Usage】 ○Printed Circuit Board
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Company information
Sankyo Co., Ltd. takes a solid step forward and delivers the highest quality as a specialist in surface treatment, capable of accurately responding to changes in the times. Through our work in surface treatment, we will continue to provide products that satisfy society (customers) with our proactive efforts in D (meeting customer delivery requirements), Q (stable product quality), and C (rationalization for cost reduction), thereby achieving the prosperity of the company and improving the lives of our employees.
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