It is ideal for the lapping and polishing of wafers such as crystal, quartz, glass, and silicon that require parallelism.
This is an ideal device for lapping and polishing that requires parallelism of wafers made of materials such as crystal, quartz, and silicon, ranging from small 3B to medium 6B and 9B.
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basic information
【Features】 ○ The workpiece moves in four directions (4WAY system only) ○ High precision management and maintenance of parallelism and flatness is possible ○ Minimal burden on the work carrier, reducing wear on the central gear and internal gear, making it ideal for processing ultra-thin materials ● For more details, please contact us.
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Company information
With the arrival of a rapidly information-oriented society, the needs of society have become more diverse, and higher functionality and quality products are being demanded across all industries. In this context, we at Technolize have not forgotten our high goal of "providing precision beyond standards," which has been our motto since our establishment. We have developed various technologies across a range of devices and have provided products based on solid trust. Thanks to this, we have received high evaluations from customers in various fields, and we have gained significant trust for a wide range of products, including wrapping and polishing related equipment, semiconductor-related devices, flat and spherical polishing machines, various tools, as well as silicon wafers, environmental products, and optical communication related devices. As we enter the 21st century, expectations for ultra-high technology are increasing, and at the same time, there are still many challenges that companies will face in addressing environmental issues, reducing all costs, and improving business efficiency. Technolize aims to continue proposing better products and contributing to society in various ways.