It is ideal for ultra-precision polishing that requires high-precision processing such as magnetic heads, YAG, and lasers.
It is ideal for ultra-precision polishing that requires high-precision processing such as magnetic heads, YAG, and lasers. By pursuing the accuracy of plate surface runout and sliding resistance, it achieves a stable processing rate without applying excessive force to the workpiece, while also eliminating the occurrence of scratches during processing. Additionally, the adoption of a facing mechanism and a circulating water cooling system allows for constant management and maintenance of the plate's flatness. Furthermore, with the incorporation of an oscillation mechanism and a forced drive mechanism, it is a lapping device that meets the demands of various fields requiring high precision.
Inquire About This Product
basic information
【Features】 ○ Mirror finishing of various wafers such as silicon, sapphire, GaN, and SiC ○ Flattening processing of vacuum chuck surfaces ○ Parallel plane processing of measurement standards such as optical flats ○ Mirror finishing of metal materials such as SUS and copper ○ Mirror finishing of resin materials such as peak and acrylic ○ Precision mirror finishing of ceramic components ● For more details, please contact us.
Price information
Please feel free to contact us.
Delivery Time
※Please feel free to contact us.
Applications/Examples of results
Please feel free to contact us.
catalog（1）
Download All Catalogs
Company information
With the arrival of a rapidly information-oriented society, the needs of society have become more diverse, and higher functionality and quality products are being demanded across all industries. In this context, we at Technolize have not forgotten our high goal of "providing precision beyond standards," which has been our motto since our establishment. We have developed various technologies across a range of devices and have provided products based on solid trust. Thanks to this, we have received high evaluations from customers in various fields, and we have gained significant trust for a wide range of products, including wrapping and polishing related equipment, semiconductor-related devices, flat and spherical polishing machines, various tools, as well as silicon wafers, environmental products, and optical communication related devices. As we enter the 21st century, expectations for ultra-high technology are increasing, and at the same time, there are still many challenges that companies will face in addressing environmental issues, reducing all costs, and improving business efficiency. Technolize aims to continue proposing better products and contributing to society in various ways.