テクノライズ株式会社 List of Products and Services

In order to address the demands for fine processing and diversified ultra-high precision requirements sought in today's processing technology, and while utilizing the current lap and polish processing line to enable further precision pursuit, we will support your development and production line with a bonding device as a necessary work temporary fixation method in the ultra-high precision processing process.

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This is an ideal device for lapping and polishing that requires parallelism of wafers made of materials such as crystal, quartz, and silicon, ranging from small 3B to medium 6B and 9B.

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We provide software suitable for your processing materials, ranging from electronic component materials such as metals and ceramics, optical component materials like sapphire, quartz, and crystal, to CMP processing of semiconductor wafers such as Si and GaAs, and ultra-fine processing like MEMS.

• glue
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• stone

Each product is classified into various grades, accommodating a wide range of products from general flat glass to ultra-high precision optical lenses, and we can provide a rich supply that covers everything from research and development to mass production. (Main raw material: sourced from Estonia)

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With the diverse processing know-how accumulated by our company, we can respond to all technical needs ranging from lap and polish processing, double-sided processing, edge processing, deposition, cutting, etc. Since processing can be done from a quantity of one unit, please feel free to contact us.

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Semiconductors installed in various information and communication devices that form a highly information and communication-oriented society are being developed with cutting-edge technologies by various companies. Our company provides essential tools for advanced technology development, including thin wafers of less than 100μm, dummy wafers for various development experiments, various film-coated products for wafers, TEG products, and prober evaluation supplies. Additionally, we also perform wafer recycling as a means of resource reuse, so please feel free to contact us. *We have materials for solar cells available.

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In order to solve various technical issues, we will utilize the technical know-how gained through technical alliances with manufacturers active in each specialized field to support your company's various technical needs from development to mass production.

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We propose cleaning methods (such as ultrasonic, brushing, high-pressure jet, chemical solutions, UV, etc.) and drying methods that utilize our technical know-how and technology for semiconductor, secondary semiconductor materials, components, metal parts, and more. * Dirt in fine lines and holes is difficult to remove, and drying is also challenging! * Watermarks may appear! * I don't know how to use chemical cleaning methods! Etc.

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In order to address the demands for microfabrication and the diversified ultra-high precision requirements sought in today's processing technology, we will support your development and production line with a bonding device as a necessary work temporary fixation method in the ultra-high precision processing process that enables further precision pursuit while utilizing the current lap and polish processing line.

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It is ideal for film processing (CMP) of silicon wafers and thin plate processing. There are devices compatible with Low-K films, conductive films, and insulating films. Thin plate processing of wafer materials can also be performed with a separate optional device, allowing for the separation of wafers as thin as 30μm and 50μm.

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Equipped with bite elevation control in the plate correction mechanism (facing mechanism). High-precision flatness management through feedback and free curvature R surface management are possible.

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It is ideal for ultra-precision polishing that requires high-precision processing such as magnetic heads, YAG, and lasers. By pursuing the accuracy of plate surface runout and sliding resistance, it achieves a stable processing rate without applying excessive force to the workpiece, while also eliminating the occurrence of scratches during processing. Additionally, the adoption of a facing mechanism and a circulating water cooling system allows for constant management and maintenance of the plate's flatness. Furthermore, with the incorporation of an oscillation mechanism and a forced drive mechanism, it is a lapping device that meets the demands of various fields requiring high precision.

• Acrylic mirror
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