Example of failure analysis of chip resistors

We would like to introduce an example of failure analysis of chip resistors where abnormalities were observed.
Upon investigating the cause of the malfunction of the polishing table, abnormalities were confirmed in the chip resistors on the relevant board. Surface observation revealed abnormalities in the chip resistors, and it appeared that the protective film was melted. Elemental analysis using EDX detected elements such as Al and Pb from the abnormal areas, raising suspicions that the undercoat layer may be exposed.
Next, cross-sectional samples were prepared through mechanical polishing, and analysis was conducted using SEM/EDX, which revealed that the protective film and resistive material appeared to be melted.
It seems that the destruction of the overcoat layer allowed the undercoat layer and other components to be observed from the surface. It is believed that due to a surge or overload, the temperature exceeded the heat resistance, causing the resistive material to melt and resulting in a change in resistance value (leading to an open circuit).


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