Power device failure location / Slice & View three-dimensional reconstruction

We will thoroughly evaluate and verify power devices from all angles.

■Problem-Solving Ability Consulting that leads to solutions with knowledge and technology Supporting customer schedules with quick responses ■Investigative Ability Skills to pinpoint and visualize malfunctioning areas Deep insight and advanced, delicate sample processing techniques ■Specialized Equipment Liquid tank thermal shock testing at up to 180°C Power cycle testing essential for power semiconductors

• Analysis and prediction system
• Other analytical equipment

We will identify and observe the defective areas of power devices such as diodes, MOS-FETs, and IGBTs.

We perform optimal preprocessing for power devices such as diodes, MOS FETs, and IGBTs of all sizes and shapes, and identify and observe defective areas through backside IR-OBIRCH analysis and backside emission analysis. ■ Preprocessing for Analysis - Backside Polishing - Supports various sample forms. Si chip size: 200um to 15mm square ■ Defective Area Identification - Backside IR-OBIRCH Analysis / Backside Emission Analysis - IR-OBIRCH Analysis: Supports up to 100mA/10V and 100uA/25V Emission Analysis: Supports up to 2kV * Covers a wide range of defect characteristics such as low-resistance shorts, micro-leaks, and high-voltage breakdown failures. ■ Pinpoint Cross-Section Observation of Leak Areas - SEM/TEM - Select SEM or TEM observation based on the predicted defects, allowing for pinpoint physical observation and elemental analysis of leak defect areas.

• Other analytical equipment

It is possible to observe cross-sections while observing FIB processing in real time.

A new method for structural analysis of electronics products manufactured with nanoscale precision, such as semiconductor devices, MEMS, and TFTs: We propose cross-beam FIB for cross-sectional observation.

• Analysis and prediction system
• Other analytical equipment

Shorter delivery time than his method! Both shape observation and diffusion layer observation can be performed using FIB-SEM!

Our company conducts "Observation of diffusion layers in semiconductors using FIB-SEM." By creating cross-sections using the FIB method and observing them with SEM, we visualized the diffusion layers of semiconductors and evaluated their shapes. In a case where the differences in built-in potential were visualized using the Inlens detector of the SEM, a difference in the energy of secondary electrons generated in N-type and P-type regions occurred due to the built-in potential. This difference in trajectories is detected by the SEM detector. 【Features】 ■ Both shape observation and diffusion layer observation can be performed using FIB-SEM. ■ Shorter delivery times compared to other methods. ■ Concentrations can be detected up to 10E16. ■ While the PN interface can be visualized, the concentration differences of N+/N- and P+/P- cannot be detected. *For more details, please refer to the PDF document or feel free to contact us.

• Other analytical equipment

We will handle everything from the evaluation of the diffusion layer to physical analysis/chemical analysis for the faulty area!

At Aites Co., Ltd., we offer analysis services for power semiconductors. Since our separation and independence from the Quality Assurance Department of IBM Japan's Yasu Office in 1993, we have cultivated our own unique analysis and analytical techniques. We can handle not only Si semiconductors but also the trending wide bandgap semiconductors. 【Features】 - OBIRCH analysis supports not only Si but also SiC and GaN devices. - FIB processing is possible from either side. - Visualization of the depletion layer formed at the PN junction. - Elemental analysis such as EDS and EELS is also supported. *For more details, please refer to the PDF document or feel free to contact us.

• Other analytical equipment

Cross-section production of soft materials has also been realized! 3D reconstruction is possible with Auto Slice & View!

The introduction of the "FIB-SEM Helios 5 UC" is scheduled to start service in November! We will provide shorter delivery times and reliable feedback than ever before. We will achieve high-throughput cross-sectional observation and analysis of a wide range of materials, from semiconductor devices such as power devices, ICs, solar cells, and light-emitting elements, to electronic components like MLCCs and soft materials. With a high-quality beam of up to 100nA, we can process large areas at high speed, and by finishing the FIB at low acceleration, we can produce high-quality samples with minimal damage layers. 【Main Features of Helios 5 UC】 ■ High-speed, large-area FIB processing ■ Damage layer reduction through low acceleration finishing ■ Cryo-FIB processing ■ 3D imaging ■ Fully automated TEM sample preparation *For more details, please refer to the PDF document or feel free to contact us.

• Other measuring instruments

Caught up in daily input, approval, and checks, I want to improve but can't find the time to consider it. In back offices, which tend to fall into such a "negative loop," it's understood that system implementation can be a breakthrough, but the burden of the implementation itself is often significant, leading to new sources of concern. During the consideration phase, it takes time to request materials and compare demos, and even if the differences are clear, there is no certainty about whether it will fit the company. After implementation, issues often arise in operations, such as not being able to connect to support or having multiple inquiry points that cause confusion. Therefore, while organizing common failure cases, we have summarized key points for practical staff to proceed with a selection that is "smooth," "thorough," and "without regret." Common failure case 1: The purpose is vague, and "systematization" becomes the goal. Common failure case 2: It does not match the company's operations. Common failure case 3: Realizing it is "difficult" after starting to use it. Common failure case 4: Total costs balloon. You can read more without needing to input personal information. Please visit the iBusiness Partners column page! https://ibp-column.sfsite.me/33868

Hotron's vehicle detection sensors allow you to search for products that meet your needs from three categories: "Purpose of Use," "Location of Use," and "Product List." The sensors detect the passage of vehicles and notify you with a rotating light, or switch the display of parking availability. They manage vehicle presence, full parking, and exit warnings in parking lots, contributing to safe driving and smooth operational management within the parking area. They are used in various settings, from coin-operated parking to large-scale parking lots.

We have published an introduction document for the solution "Easy Commuting Expenses," which supports the efficiency of commuting expense management. This document clearly presents the features and benefits of "Easy Commuting Expenses," which enables centralized management of commuting costs, including train, bus, and private car commuting. It streamlines tasks that place a heavy burden on staff, such as determining commuting routes, calculating refunds for commuter passes, responding to fare changes, and managing payment histories, while supporting fair and appropriate commuting expense reimbursements. Additionally, it includes case studies based on the implementation results from over 650 companies nationwide, as well as the effects of cost reduction and operational efficiency. Companies considering a review of commuting expense management or business improvements are encouraged to take a look.

Hotron, which manufactures and sells sensors, provides bed exit sensors for hospitals, nursing, and care facilities. Hotron offers easy-to-understand video guidance on how to use bed exit sensors wirelessly and how to set up device connections! ▼ Video Manual (YouTube) https://www.youtube.com/playlist?list=PLNVA4mTrZDqtJa6MfFRZQxwtfCSnAfxVy 【Bed Exit Sensors】 ○ Non-contact infrared sensor, simply place it - Pole-kun HB-H1 ○ Mat sensor, foldable thin mat - Mat-kun HB-UST ○ Body movement call - Ugo-kun HB-TV3 ○ Body movement call for wheelchairs - Ayumi-chan HB-WTV3 【Options】 ○ Nurse call linked wireless set - Wireless set (transmitter/receiver) HB-RS/HB-RJ ◎ For more information about the products, please contact us or download the catalog.

An article has been published regarding the case study of the attendance management system "KING OF TIME" implemented at Nichirei Industrial Co., Ltd. ~ In the case of Nichirei Industrial ~ The workload related to attendance management has decreased. With the transition from analog tasks to automated aggregation of working hours and granting of annual leave, we can now focus on our work with peace of mind. Particularly regarding the "punching method," we utilize fingerprint and facial recognition. By using biometric authentication, impersonation is not possible, and I believe the accuracy of attendance has significantly improved. Transparency has been ensured. 【Case Overview】 ■Challenges Before Implementation - Handwritten attendance sheets were used, resulting in input tasks to incorporate data into the payroll system. ■Key Points of Implementation - Systematization has reduced input tasks. Biometric authentication prevents impersonation. *For more details, please refer to the related links or feel free to contact us.