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  4. Power device failure location / Slice & View three-dimensional reconstruction
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  • Nov 06, 2024
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Nov 06, 2024

Power device failure location / Slice & View three-dimensional reconstruction

アイテス アイテス
I will introduce the three-dimensional reconstruction of failure locations using the Slice & View function of FIB-SEM. Continuous SEM images of the structure are acquired, and the obtained images are corrected for positional misalignment between SEM images and visualized in three dimensions using 3D construction software (Avizo). By combining the position identification technique for cross-sectioning the failure location with the Slice & View function, it is possible to obtain continuous SEM images that retain the defective state and include information before and after the abnormal area.
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Total solution service for power devices

We will thoroughly evaluate and verify power devices from all angles.

■Problem-Solving Ability Consulting that leads to solutions with knowledge and technology Supporting customer schedules with quick responses ■Investigative Ability Skills to pinpoint and visualize malfunctioning areas Deep insight and advanced, delicate sample processing techniques ■Specialized Equipment Liquid tank thermal shock testing at up to 180°C Power cycle testing essential for power semiconductors

  • Analysis and prediction system
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Failure analysis of power devices

We will identify and observe the defective areas of power devices such as diodes, MOS-FETs, and IGBTs.

We perform optimal preprocessing for power devices such as diodes, MOS FETs, and IGBTs of all sizes and shapes, and identify and observe defective areas through backside IR-OBIRCH analysis and backside emission analysis. ■ Preprocessing for Analysis - Backside Polishing - Supports various sample forms. Si chip size: 200um to 15mm square ■ Defective Area Identification - Backside IR-OBIRCH Analysis / Backside Emission Analysis - IR-OBIRCH Analysis: Supports up to 100mA/10V and 100uA/25V Emission Analysis: Supports up to 2kV * Covers a wide range of defect characteristics such as low-resistance shorts, micro-leaks, and high-voltage breakdown failures. ■ Pinpoint Cross-Section Observation of Leak Areas - SEM/TEM - Select SEM or TEM observation based on the predicted defects, allowing for pinpoint physical observation and elemental analysis of leak defect areas.

  • Other analytical equipment

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Cross beam FIB cross-sectional observation

It is possible to observe cross-sections while observing FIB processing in real time.

A new method for structural analysis of electronics products manufactured with nanoscale precision, such as semiconductor devices, MEMS, and TFTs: We propose cross-beam FIB for cross-sectional observation.

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Observation of diffusion layers in semiconductors using FIB-SEM.

Shorter delivery time than his method! Both shape observation and diffusion layer observation can be performed using FIB-SEM!

Our company conducts "Observation of diffusion layers in semiconductors using FIB-SEM." By creating cross-sections using the FIB method and observing them with SEM, we visualized the diffusion layers of semiconductors and evaluated their shapes. In a case where the differences in built-in potential were visualized using the Inlens detector of the SEM, a difference in the energy of secondary electrons generated in N-type and P-type regions occurred due to the built-in potential. This difference in trajectories is detected by the SEM detector. 【Features】 ■ Both shape observation and diffusion layer observation can be performed using FIB-SEM. ■ Shorter delivery times compared to other methods. ■ Concentrations can be detected up to 10E16. ■ While the PN interface can be visualized, the concentration differences of N+/N- and P+/P- cannot be detected. *For more details, please refer to the PDF document or feel free to contact us.

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Power semiconductor analysis service

We will handle everything from the evaluation of the diffusion layer to physical analysis/chemical analysis for the faulty area!

At Aites Co., Ltd., we offer analysis services for power semiconductors. Since our separation and independence from the Quality Assurance Department of IBM Japan's Yasu Office in 1993, we have cultivated our own unique analysis and analytical techniques. We can handle not only Si semiconductors but also the trending wide bandgap semiconductors. 【Features】 - OBIRCH analysis supports not only Si but also SiC and GaN devices. - FIB processing is possible from either side. - Visualization of the depletion layer formed at the PN junction. - Elemental analysis such as EDS and EELS is also supported. *For more details, please refer to the PDF document or feel free to contact us.

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Announcement of the Introduction of FIB-SEM Helios 5 UC

Cross-section production of soft materials has also been realized! 3D reconstruction is possible with Auto Slice & View!

The introduction of the "FIB-SEM Helios 5 UC" is scheduled to start service in November! We will provide shorter delivery times and reliable feedback than ever before. We will achieve high-throughput cross-sectional observation and analysis of a wide range of materials, from semiconductor devices such as power devices, ICs, solar cells, and light-emitting elements, to electronic components like MLCCs and soft materials. With a high-quality beam of up to 100nA, we can process large areas at high speed, and by finishing the FIB at low acceleration, we can produce high-quality samples with minimal damage layers. 【Main Features of Helios 5 UC】 ■ High-speed, large-area FIB processing ■ Damage layer reduction through low acceleration finishing ■ Cryo-FIB processing ■ 3D imaging ■ Fully automated TEM sample preparation *For more details, please refer to the PDF document or feel free to contact us.

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Related catalog(6)

Total solution service for power devices.

Total solution service for power devices.

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Failure analysis of power devices

Failure analysis of power devices

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Cross-beam FIB cross-sectional observation

Cross-beam FIB cross-sectional observation

PRODUCT
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Observation of diffusion layers in semiconductors using FIB-SEM.

Observation of diffusion layers in semiconductors using FIB-SEM.

PRODUCT
  • E-book viewing
  • Catalog download

Contact this catalog

Power semiconductor analysis services

Power semiconductor analysis services

PRODUCT
  • E-book viewing
  • Catalog download

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Announcement of the introduction of FIB-SEM Helios 5 UC

Announcement of the introduction of FIB-SEM Helios 5 UC

PRODUCT
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HK-2

Recommended for earthquake measures for automatic doors and equipment! Seismic device HK-2.

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Japan is one of the top 10 countries in the world with frequent earthquakes. The 2020 White Paper on Land, Infrastructure, Transport and Tourism has also reported an increase in the probability of major earthquakes occurring. Regarding the Nankai Trough earthquake, the probability of an earthquake with a magnitude of 8 to 9 occurring within the next 30 years is estimated to be 70 to 80%. At Hotron, we recommend the introduction of seismic devices for earthquake countermeasures in buildings and equipment. The seismic device 'HK-2' is a product that automatically performs various controls that have been pre-set when it detects strong shaking equivalent to a seismic intensity of 5 lower or higher. For example, it can automatically execute actions such as: "Open automatic doors and gates to secure evacuation routes and access for emergency vehicles" "Transmit signals to the control room and stop facility equipment" "Unlock the keys to locked lockers" "Automatically play voice guidance" For more details, please download the materials or contact us.

Feb 13, 2026

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Non-contact light beam touch sensor "HA-T Series"

【Catalog now available!】Energy-saving automatic door sensors "HA-T401/HA-T520"

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  • CATALOG

The "HA-T Series" is an energy-saving automatic door sensor that opens only for those who want to enter, whether on a busy street or in a narrow passageway. The automatic door opens simply by bringing your hand close, addressing hygiene concerns even in facilities used by a large number of people. Depending on the application and installation location, you can choose between "Non-vision Mount Type/HA-T401" and "Non-vision Built-in Type/HA-T520." 【Recommended for such places!】 ☑ Entrance facing a busy passageway ☑ Presence of counters or signs near the door ☑ Buildings facing narrow passageways ☑ Buildings that prioritize aesthetics ☑ Hospitals and facilities that consider hygiene ☑ Large facilities with many doors 【Features】 ● Adaptable to various door types with four detection spot settings ● Reduces unnecessary opening and closing to minimize power consumption, contributing to energy-saving effects ● Equipped with a light touch function, allowing the door to open and close simply by waving your hand, ensuring hygiene ● Can also be used as a wide detection range non-vision infrared sensor ◎ For more details, please download the materials or contact us.

Feb 13, 2026

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Research on rust adhesion to SPCC (rust-prone material).

Started research and development aimed at enhancing rust prevention performance.

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  • COMPANY

Seven Corporation has begun research and development related to rust prevention, aiming to expand the functionality of the natural multifunctional aqueous solution "SEA'S 7." This research is being promoted as a collaborative study with the Industrial Technology Research Institute. In recent years, the manufacturing industry has been seeking technologies that balance environmental impact reduction and improved work safety, making rust prevention measures after cleaning a critical issue. This research includes corrosion evaluation using metal test pieces, measurement of weight changes, and durability tests in a circulating water environment, advancing the understanding of rust prevention mechanisms and performance evaluation. In the future, we aim to develop a next-generation SEA'S 7 that incorporates rust prevention functionality in addition to cleaning, disinfection, and deodorization, contributing to the efficiency of manufacturing processes and the reduction of environmental impact.

Feb 13, 2026

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Announcement of the new release of Vertical Aluminum Step Type F.

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  • PRODUCT

We are pleased to announce the launch of the "Vertical Aluminum Step Type F." The "Vertical Aluminum Step Type F" is a new type of aluminum ladder specifically designed for excavation sites, based on the existing "Vertical Aluminum Step." The vertical aluminum step is lightweight due to its aluminum construction, making it easy to transport and set up. Additionally, its modular design allows for flexible height combinations (with connecting parts of 0.7m, 1.0m, and 2.0m). The newly launched Type F retains the features of the previous model while providing even greater convenience. <Features of Type F> ■ The hook adjustment range of the fixed part has been expanded. It can be attached to structures ranging from 20mm to 200mm. ■ The length of the stand pipe can be adjusted. The stand pipe can be stored, making transportation and storage easier. <Release Date> January 5, 2026 <Specifications> - Standard set for Type F: 2.4m *Individual sales of the hanging fixed part and connecting parts are available. *Sales of the previous model (stand pipe fixed type) will also continue.

Feb 13, 2026

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Surprisingly unknown? The difference between "accounting systems" and "document management systems."

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This time, we will explain the differences in roles between the "accounting system" and the "document management system," which are surprisingly not well known, as well as points that are often overlooked in legal compliance. ■ The difference between accounting systems and document management systems is their "scope of coverage." - Accounting System = Management of "money (numbers)" - Document Management System = Management of "evidence (documents)" ■ Documents that are often overlooked in accounting systems The accounting system primarily focuses on "accounting processes." - "Estimates" where no money movement occurs - "Delivery notes" and "purchase orders," which are intermediate points in transactions ⇒ There are cases where these are not saved or managed in the accounting system. This could be considered a deficiency under the Electronic Bookkeeping Act. ■ Supplementing the missing parts with an "independent system" While there are high-function ERP (Enterprise Resource Planning) systems that can manage everything from estimates to invoicing seamlessly, the reality is that the cost can be a significant barrier to implementation. Therefore, there is also the option of managing documents with an independent document management system like paperlogic. Paperlogic is currently offering a free trial. Please feel free to contact us.

Feb 13, 2026

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