Power device failure location / Slice & View three-dimensional reconstruction

We will thoroughly evaluate and verify power devices from all angles.

■Problem-Solving Ability Consulting that leads to solutions with knowledge and technology Supporting customer schedules with quick responses ■Investigative Ability Skills to pinpoint and visualize malfunctioning areas Deep insight and advanced, delicate sample processing techniques ■Specialized Equipment Liquid tank thermal shock testing at up to 180°C Power cycle testing essential for power semiconductors

• Analysis and prediction system
• Other analytical equipment

We will identify and observe the defective areas of power devices such as diodes, MOS-FETs, and IGBTs.

We perform optimal preprocessing for power devices such as diodes, MOS FETs, and IGBTs of all sizes and shapes, and identify and observe defective areas through backside IR-OBIRCH analysis and backside emission analysis. ■ Preprocessing for Analysis - Backside Polishing - Supports various sample forms. Si chip size: 200um to 15mm square ■ Defective Area Identification - Backside IR-OBIRCH Analysis / Backside Emission Analysis - IR-OBIRCH Analysis: Supports up to 100mA/10V and 100uA/25V Emission Analysis: Supports up to 2kV * Covers a wide range of defect characteristics such as low-resistance shorts, micro-leaks, and high-voltage breakdown failures. ■ Pinpoint Cross-Section Observation of Leak Areas - SEM/TEM - Select SEM or TEM observation based on the predicted defects, allowing for pinpoint physical observation and elemental analysis of leak defect areas.

• Other analytical equipment

It is possible to observe cross-sections while observing FIB processing in real time.

A new method for structural analysis of electronics products manufactured with nanoscale precision, such as semiconductor devices, MEMS, and TFTs: We propose cross-beam FIB for cross-sectional observation.

• Analysis and prediction system
• Other analytical equipment

Shorter delivery time than his method! Both shape observation and diffusion layer observation can be performed using FIB-SEM!

Our company conducts "Observation of diffusion layers in semiconductors using FIB-SEM." By creating cross-sections using the FIB method and observing them with SEM, we visualized the diffusion layers of semiconductors and evaluated their shapes. In a case where the differences in built-in potential were visualized using the Inlens detector of the SEM, a difference in the energy of secondary electrons generated in N-type and P-type regions occurred due to the built-in potential. This difference in trajectories is detected by the SEM detector. 【Features】 ■ Both shape observation and diffusion layer observation can be performed using FIB-SEM. ■ Shorter delivery times compared to other methods. ■ Concentrations can be detected up to 10E16. ■ While the PN interface can be visualized, the concentration differences of N+/N- and P+/P- cannot be detected. *For more details, please refer to the PDF document or feel free to contact us.

• Other analytical equipment

We will handle everything from the evaluation of the diffusion layer to physical analysis/chemical analysis for the faulty area!

At Aites Co., Ltd., we offer analysis services for power semiconductors. Since our separation and independence from the Quality Assurance Department of IBM Japan's Yasu Office in 1993, we have cultivated our own unique analysis and analytical techniques. We can handle not only Si semiconductors but also the trending wide bandgap semiconductors. 【Features】 - OBIRCH analysis supports not only Si but also SiC and GaN devices. - FIB processing is possible from either side. - Visualization of the depletion layer formed at the PN junction. - Elemental analysis such as EDS and EELS is also supported. *For more details, please refer to the PDF document or feel free to contact us.

• Other analytical equipment

Cross-section production of soft materials has also been realized! 3D reconstruction is possible with Auto Slice & View!

The introduction of the "FIB-SEM Helios 5 UC" is scheduled to start service in November! We will provide shorter delivery times and reliable feedback than ever before. We will achieve high-throughput cross-sectional observation and analysis of a wide range of materials, from semiconductor devices such as power devices, ICs, solar cells, and light-emitting elements, to electronic components like MLCCs and soft materials. With a high-quality beam of up to 100nA, we can process large areas at high speed, and by finishing the FIB at low acceleration, we can produce high-quality samples with minimal damage layers. 【Main Features of Helios 5 UC】 ■ High-speed, large-area FIB processing ■ Damage layer reduction through low acceleration finishing ■ Cryo-FIB processing ■ 3D imaging ■ Fully automated TEM sample preparation *For more details, please refer to the PDF document or feel free to contact us.

• Other measuring instruments

Based on practical experience in support companies and business companies, SBS Marketing Co., Ltd. provides consulting services related to marketing, sales promotion, and customer acquisition mainly in the BtoB (business-to-business) sector. On September 23, 2025 (Tuesday), they published a page titled "Easier to Optimize the Allocation of Management Resources!? 'Product Portfolio Management (PPM)'". 'Product Portfolio Management' allows for the optimal allocation of management resources by evaluating one's business along two axes: "market growth potential" and "market share," and classifying it into four quadrants. The page explains the benefits that can be realized by utilizing it, the two axes and four quadrants that make it up, and the associated risks. (Page Overview: Excerpts) ■ What is 'Product Portfolio Management'? ■ What can be achieved through 'PPM'? ■ Components of 'PPM' (vertical and horizontal axes) ■ Components of 'PPM' (four quadrants) ■ Two risks associated with 'PPM' (DL content only) ▼ For more details, please visit this page. https://sbsmarketing.co.jp/blog/ppm-2025-09/

An article has been published about the case of introducing the expense reimbursement system "Rakuraku Seisan" at TSP Corporation. ~ In the case of TSP ~ Before the introduction, there were challenges such as dealing with the "paper" sent from various locations and the reliance on specific individuals for the tasks. After the introduction, the input and checking of FB data, which used to take 2 to 3 hours, can now be completed in just 5 minutes. Additionally, the mindset of the accounting department, which was previously reliant on manual entry, has changed. [Case Overview] ■ Challenges before introduction - Dealing with "paper" sent from various locations, reliance on specific individuals ■ Key points of introduction - A robust support system for setup and operation - Easy to start from a small scale both financially and functionally *For more details, please refer to the related links or feel free to contact us.

The facility operating the nurse call system has made the bed exit sensor wireless, allowing it to notify in conjunction with the nurse call. By simply connecting the mat sensor "Foldable Thin Matt-kun," the body movement call "Ugo-kun," and the wheelchair body movement call "Ayumi-chan" to the transmitter HB-RS, you can make the bed exit sensor wireless. The infrared sensor "Just Place Pole-kun" has the transmitter HB-RS built-in. 【Features】 ○ Wireless conversion by simply connecting existing sensors to the transmitter HB-WSK. ○ The bed exit sensor notifies wirelessly in conjunction with the nurse call. ○ Up to 5 transmitters can be registered with one receiver. ○ The communication distance between the transmitter and receiver is approximately 10 meters. ◎ For more details, please contact us or download the catalog.

Full and empty management refers to the real-time display of parking availability and the management of efficient use of parking spaces. By utilizing Hotron's sensors, drivers can quickly discover available parking spaces, achieving efficient parking lot operations. ■ For large parking lots, the "floor management method" and "block management method," which focus on cost reduction, are recommended. Sensors are installed at regular intervals to count the number of vehicles passing through. This method offers the advantage of easy installation and low costs. 【Target Products】 - Vehicle Count Sensor CCS2 - Ultrasonic Sensor HM-UX2/UW2 ■ For smaller scale operations, the "space management method," which installs sensors in each parking space to display availability with high accuracy, is recommended. By ensuring accurate full and empty displays, it helps prevent unnecessary entry of new vehicles and enables safe parking lot operations. 【Target Products】 - Occupancy Detection Sensor HM-UX2/UW2 - Occupancy/Pass Detection Sensor HM-LC6 - Occupancy Detection Sensor HM-LC7/LC7-FLS - Occupancy/Pass Detection Sensor HM-S6 - Occupancy Detection Sensor HM-S8

Castem Co., Ltd. will exhibit at the "Monozukuri World Osaka - Mechanical Components Technology Exhibition" held at Intex Osaka from Wednesday, October 1 to Friday, October 3, 2025. We will showcase lost-wax precision casting and MIM (Metal Injection Molding) products, as well as introduce our new technology, mold-less casting "Digital Cast." In addition to our popular casting demonstrations, we will present case studies on solving issues related to metal parts. Please utilize our "Technical Consultation Booth" to learn about optimal manufacturing methods tailored to your needs, from ultra-small lots to mass production. 【Exhibition Overview】 Dates: October 1 (Wed) - October 3 (Fri), 2025, 10:00 AM - 5:00 PM Venue: Intex Osaka (1-5-102 Nanko-Kita, Suminoe-ku, Osaka City, Osaka Prefecture) Exhibition Booth Number: Hall 6, B Hall 51-1 Pre-registration allows for smooth entry. It is convenient to register via the URL below before your visit. We sincerely look forward to your attendance. https://www.manufacturing-world.jp/osaka/ja-jp/register.html?code=1431877272389396-VEK