MES2024 34th Microelectronics Symposium Invitation to Exhibit at Corporate Booths

It is a board inspection device capable of ultra-fast in-circuit testing at a top-class level in the industry.

We have completely revamped the platform compared to the conventional model, increasing the probe movement speed by up to 50% and dramatically improving contact position accuracy. Our new high-precision, wide-range measurement system, along with the groundbreaking 4-head 6-flying probe mechanism, significantly reduces inspection costs and enhances quality in the assembly process, regardless of substrate variety or production volume. ★You can bring your own substrates for evaluation tests at our demo rooms in Okayama headquarters and Tokyo branch★ We can conduct a series of tests including the creation of inspection programs, inspections using actual substrates, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below.

• Measurement and Inspection

It is a board inspection device capable of ultra-fast in-circuit testing at a top-class level in the industry. (Supported board size for inspection: up to 985×610)

The APT-1340J maintains its basic performance while expanding the compatible board size to W635×D610mm. Additionally, by adding an optional split inspection function, it can inspect long boards up to W985×D610mm. It can accommodate components with a height of 60mm and board weights of up to 10kg, making it suitable for inspecting boards used in automotive, aerospace, and medical devices, as well as power supply boards and probe cards, which are larger and heavier. ★You can bring your boards to our demonstration room at our Okayama headquarters for evaluation testing★ We can conduct a series of tests, including creating inspection programs, inspecting actual boards, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below. *For product information, please download the PDF or feel free to contact us.*

• Measurement and Inspection

This is a flagship model that arranges probe heads above and below, enabling simultaneous in-circuit testing of both sides of the substrate.

Four probes are arranged on the top side of the substrate and two on the bottom side. Each probe can move freely and at high speed, achieving an astonishing inspection speed that is world-class in standard. By using the upper and lower flying probes simultaneously, a combination inspection of up to six probes allows for simultaneous contact inspection at both points on the top and bottom sides of the substrate. This significantly expands the inspection range and further accelerates inspection time. It is equipped with a wealth of features and boasts world-class standards in speed and positioning accuracy. ★You can bring your substrate to our demo room at our Okayama headquarters for evaluation testing★ We can conduct a series of tests including the creation of inspection programs, inspections using actual substrates, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below.

• Measurement and Inspection

The probe heads are arranged above and below, allowing for simultaneous in-circuit testing of both sides of the substrate. (Supported substrate size for inspection: up to 985×610)

The simultaneous use of upper and lower flying probes allows for a combination inspection of up to 6 probes, enabling the inspection of components that can make contact at both points on the top and bottom of the substrate. This model boasts world-class standards in speed and positioning accuracy while expanding the compatible substrate size to W635×D610mm. Additionally, by adding an optional split inspection function, it can also inspect long substrates up to W985×D610mm. It can accommodate component heights of up to 60mm and substrate weights of up to 10kg, making it suitable for inspecting substrates used in automotive, aerospace, and medical devices, as well as power boards and probe cards, which are larger and heavier. ★Evaluation tests can be conducted by bringing in substrates to the demo room at our Okayama headquarters★ A complete testing process is possible, including the creation of inspection programs, testing using actual substrates, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below.

• Measurement and Inspection

We will create new value through the mutual complementarity of ICT and BST.

In-circuit testing with flying probe testers excels at inspecting the electrical characteristics of implemented electronic components in analog circuits. However, components that cannot be probed make electrical testing difficult, and functional testing of digital circuits is challenging. On the other hand, boundary scan testing allows for quick interconnection testing between LSI pins and on-board programming for FPGAs, but it can only test digital circuits around ICs that comply with the boundary scan standard, and it also requires dedicated fixtures for connections. At Takaya Corporation, we possess technology that uses flying probes instead of fixtures that connect 4 to 5 scan-compatible pins and measuring instruments required for boundary scan testing. This allows for boundary scan testing even when the counterpart of a boundary scan-compliant IC is a non-boundary scan-compliant IC or passive components (such as connectors), by enabling the flying probe to function as a virtual boundary scan cell. With a single flying probe tester, it is possible to conduct comprehensive testing of both digital and analog circuits, thereby significantly enhancing testing efficiency compared to before.

• Measurement and Inspection

Fujikou Shuhou Industry Co., Ltd. will hold a free online seminar titled "Introduction to Multi-Laser Wire DED Meltio" on November 26, 2025 (Wednesday). Our company has specialized in laser cladding using powder until 2023. The Meltio, introduced in April 2023, utilizes wire for laser cladding. We will explain the advantages and disadvantages of using wire and powder as supply materials. 【Recommended for】 ■ Those who want to learn about the latest laser cladding technology ■ Those who want to learn about metal 3D printing technology using wire

We will be exhibiting at the "Construction Technology Fair 2025 in Chubu," which will be held at Port Messe Nagoya on December 4th (Thursday) and 5th (Friday) of the 7th year of Reiwa. The Nepurasu Method National Association will showcase the "Nepurasu Method" for ditch renovation. If you have any issues with ditch repair or improvement work, please stop by our booth. We will provide various proposals based on past cases. Additionally, the Nepurasu Method National Association is looking for product manufacturing partners and construction partners in the Chubu region. We welcome companies that want to "manufacture and sell products for the Nepurasu Method" or "try their hand at construction" to visit us. In addition to the ditch renovation method, we will also be displaying newly developed flood control products.

Are you struggling with the time and effort required to process FAX order forms? In this webinar, we will introduce the latest solution that combines the cloud FAX service 'Maito-k Cloud' with AI-OCR 'WisOCR for Order Forms' to streamline order processing. We will digitize FAX order forms received on paper, and AI-OCR will automatically convert them into data. It accommodates different formats for each client and handles issues specific to FAX, such as dirt and tilt, ensuring smooth integration with core systems. <Recommended for those who:> - Are spending too much time processing FAX order forms - Want to promote paperless operations but find FAX processes to be a bottleneck - Are interested in utilizing AI-OCR but lack a clear image of implementation - Are responsible for improving operational efficiency and promoting DX 【Presentation Content】 ■ Session 1 ┃ Intercom Inc. Reduce the burden of FAX operations! Streamline order processing with cloud FAX ■ Session 2 ┃ Panasonic Solution Technology Co., Ltd. Transforming order processing with AI! Data conversion of FAX order forms made easy with AI-OCR

We are pleased to announce a web seminar hosted by our company. 【Generative AI Utilization Seminar: The First Step to Starting with Generative AI Together】 The currently popular generative AI (such as Copilot and ChatGPT) is a new technology that is useful in various everyday and work situations, including writing, information search, and translation. Unlike previous AI, it has evolved to suggest ideas that humans may not think of and to offer greater flexibility in operation. However, many people may feel that it seems "difficult" or "I don't know where to start." In this seminar, we will start with the basics of generative AI and clearly explain practical utilization methods through examples and demonstrations. We will also carefully introduce points to be aware of when using it. After participating, you should be able to take the first step in mastering generative AI as your "partner." Would you like to experience the future of work with your own hands? We look forward to your registration. 【Timetable】 - Basics of Generative AI Utilization - Introduction of FCS Utilization Examples - Demonstration of Office Product Integration Using Copilot - Q&A Session

On November 20, 2025 (Thursday) and December 2, 2025 (Tuesday) from 11:00 to 14:00, our representative, certified public accountant and tax accountant Koichi Yokoyama, will be speaking at a free webinar hosted by Otsuka Shokai. He will explain important points to note regarding the revised Construction Business Act. [Construction Business Act / Public Works Optimization Promotion Act] - Prevention of omissions in the description of construction contracts - Obligation to notify "risk" information before contract signing by the contractor - Mutual exchange of original copies of construction contracts - Digitization of estimates, contracts, and order forms/acceptance letters We are entering an era where contracts must be documented in writing and stored electronically. Paperlogic is fully committed to supporting companies that have begun the transition from paper to digital.