MES2024 34th Microelectronics Symposium Invitation to Exhibit at Corporate Booths

It is a board inspection device capable of ultra-fast in-circuit testing at a top-class level in the industry.

We have completely revamped the platform compared to the conventional model, increasing the probe movement speed by up to 50% and dramatically improving contact position accuracy. Our new high-precision, wide-range measurement system, along with the groundbreaking 4-head 6-flying probe mechanism, significantly reduces inspection costs and enhances quality in the assembly process, regardless of substrate variety or production volume. ★You can bring your own substrates for evaluation tests at our demo rooms in Okayama headquarters and Tokyo branch★ We can conduct a series of tests including the creation of inspection programs, inspections using actual substrates, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below.

• Measurement and Inspection

It is a board inspection device capable of ultra-fast in-circuit testing at a top-class level in the industry. (Supported board size for inspection: up to 985×610)

The APT-1340J maintains its basic performance while expanding the compatible board size to W635×D610mm. Additionally, by adding an optional split inspection function, it can inspect long boards up to W985×D610mm. It can accommodate components with a height of 60mm and board weights of up to 10kg, making it suitable for inspecting boards used in automotive, aerospace, and medical devices, as well as power supply boards and probe cards, which are larger and heavier. ★You can bring your boards to our demonstration room at our Okayama headquarters for evaluation testing★ We can conduct a series of tests, including creating inspection programs, inspecting actual boards, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below. *For product information, please download the PDF or feel free to contact us.*

• Measurement and Inspection

This is a flagship model that arranges probe heads above and below, enabling simultaneous in-circuit testing of both sides of the substrate.

Four probes are arranged on the top side of the substrate and two on the bottom side. Each probe can move freely and at high speed, achieving an astonishing inspection speed that is world-class in standard. By using the upper and lower flying probes simultaneously, a combination inspection of up to six probes allows for simultaneous contact inspection at both points on the top and bottom sides of the substrate. This significantly expands the inspection range and further accelerates inspection time. It is equipped with a wealth of features and boasts world-class standards in speed and positioning accuracy. ★You can bring your substrate to our demo room at our Okayama headquarters for evaluation testing★ We can conduct a series of tests including the creation of inspection programs, inspections using actual substrates, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below.

• Measurement and Inspection

The probe heads are arranged above and below, allowing for simultaneous in-circuit testing of both sides of the substrate. (Supported substrate size for inspection: up to 985×610)

The simultaneous use of upper and lower flying probes allows for a combination inspection of up to 6 probes, enabling the inspection of components that can make contact at both points on the top and bottom of the substrate. This model boasts world-class standards in speed and positioning accuracy while expanding the compatible substrate size to W635×D610mm. Additionally, by adding an optional split inspection function, it can also inspect long substrates up to W985×D610mm. It can accommodate component heights of up to 60mm and substrate weights of up to 10kg, making it suitable for inspecting substrates used in automotive, aerospace, and medical devices, as well as power boards and probe cards, which are larger and heavier. ★Evaluation tests can be conducted by bringing in substrates to the demo room at our Okayama headquarters★ A complete testing process is possible, including the creation of inspection programs, testing using actual substrates, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below.

• Measurement and Inspection

We will create new value through the mutual complementarity of ICT and BST.

In-circuit testing with flying probe testers excels at inspecting the electrical characteristics of implemented electronic components in analog circuits. However, components that cannot be probed make electrical testing difficult, and functional testing of digital circuits is challenging. On the other hand, boundary scan testing allows for quick interconnection testing between LSI pins and on-board programming for FPGAs, but it can only test digital circuits around ICs that comply with the boundary scan standard, and it also requires dedicated fixtures for connections. At Takaya Corporation, we possess technology that uses flying probes instead of fixtures that connect 4 to 5 scan-compatible pins and measuring instruments required for boundary scan testing. This allows for boundary scan testing even when the counterpart of a boundary scan-compliant IC is a non-boundary scan-compliant IC or passive components (such as connectors), by enabling the flying probe to function as a virtual boundary scan cell. With a single flying probe tester, it is possible to conduct comprehensive testing of both digital and analog circuits, thereby significantly enhancing testing efficiency compared to before.

• Measurement and Inspection

【Exhibition Information】 Exhibition Name: Food Processing Technology Exhibition 2025 Date and Time: November 14, 2025 (Friday) 10:30 AM - 4:30 PM *Free entry and exit, pre-registration required Location: Osaka Industry Creation Center - We will showcase technical products using the factory deodorant "Deofure." - We will display the tofu defoamer "Tofu Up." - Other fragrance technology products will also be exhibited. *For more details, please refer to the materials.

Protech Engineering will exhibit at the "Landslide Disaster Prevention Technology Forum '25 in Toyama," organized by the Japan Society for Slope Disaster Prevention Technology, scheduled to be held on Thursday, October 9, 2025. On that day, we will provide detailed explanations of the following disaster prevention products using models, panels, and various materials. ◆Exhibited Products◆ - Pile-type debris flow and driftwood countermeasures for non-flowing streams / Urban Guard (model display) Additionally, our representative will conduct a technical presentation, so we kindly invite you to attend.

Protech Engineering (Booth Number: 240) will be exhibiting at the "Hokkaido Construction Development Comprehensive Exhibition 2025," scheduled to be held on October 8 (Wednesday) and 9 (Thursday), 2025. On the day of the event, we will provide detailed explanations of the following disaster prevention products using models, panels, and various materials. ◆ Main Exhibited Products ◆ - Energy-absorbing rockfall protection fence / ARC Fence (model display) - Landslide debris protection fence / Slope Guard Fence Type LE (model display) - Pile-type (pile foundation) debris flow and driftwood countermeasure for non-flowing streams / Urban Guard - Avalanche prevention piles / Tri-Pile - Avalanche protection fence / Slope Guard Fence Type LS - High energy-absorbing rockfall protection fence / Macro Fence In addition, we will have a variety of materials on disaster prevention products developed independently by Protech Engineering, so we kindly invite you to visit our booth.

Profect Co., Ltd. will hold a seminar on October 3rd (Friday) themed around the IT Implementation Subsidy 2025 and our developed and sold production management system "TED." This year's IT Implementation Subsidy has seen a significant decrease in the acceptance rate compared to previous years. Many companies are struggling with the situation of having wanted to implement IT tools but being rejected. In this seminar, we will explain why the acceptance rate has dropped, the background behind it, and the key points for being accepted. Additionally, we will introduce our initiatives that have achieved a 100% acceptance rate so far this year and the reasons why our production management system "TED," registered as an IT tool, is chosen. To accommodate busy schedules, this seminar will be held in a hybrid format, allowing for both in-person attendance and online participation via Zoom. Please choose your preferred method of participation according to your convenience. If you are currently considering applying for the IT Implementation Subsidy or are interested in production management, we encourage you to join us. We sincerely look forward to your application.

An international forum aimed at promoting the circular economy and closed-loop economy, "Closed Loop Recycle Forum 2025 (hereinafter referred to as CLRF2025)," will be held for two days from November 25 (Tuesday) to 26 (Wednesday) at The Oriental Terrace in Chuo Ward, Hamamatsu City, Shizuoka Prefecture. In Europe, closed-loop recycling practices are already advancing. We have organized this international forum as a platform to connect the forefront of Europe with Japan's challenges, striving for a future that balances economic viability and environmental sustainability. A total of 12 speakers, including Chairman Kajiwara of the Waste and 3R Research Foundation and Director Kaneko of the Ministry of the Environment's Container and Packaging Recycling Division, along with leading recycling operators and researchers from Japan and Europe, will present advanced examples of the circular economy and closed-loop economy. Furthermore, through discussions on the feasibility and challenges of implementation in Japan, we will explore hints for sustainable business models that companies and local governments should aim for.