MES2024 34th Microelectronics Symposium Invitation to Exhibit at Corporate Booths

It is a board inspection device capable of ultra-fast in-circuit testing at a top-class level in the industry.

We have completely revamped the platform compared to the conventional model, increasing the probe movement speed by up to 50% and dramatically improving contact position accuracy. Our new high-precision, wide-range measurement system, along with the groundbreaking 4-head 6-flying probe mechanism, significantly reduces inspection costs and enhances quality in the assembly process, regardless of substrate variety or production volume. ★You can bring your own substrates for evaluation tests at our demo rooms in Okayama headquarters and Tokyo branch★ We can conduct a series of tests including the creation of inspection programs, inspections using actual substrates, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below.

• Measurement and Inspection

It is a board inspection device capable of ultra-fast in-circuit testing at a top-class level in the industry. (Supported board size for inspection: up to 985×610)

The APT-1340J maintains its basic performance while expanding the compatible board size to W635×D610mm. Additionally, by adding an optional split inspection function, it can inspect long boards up to W985×D610mm. It can accommodate components with a height of 60mm and board weights of up to 10kg, making it suitable for inspecting boards used in automotive, aerospace, and medical devices, as well as power supply boards and probe cards, which are larger and heavier. ★You can bring your boards to our demonstration room at our Okayama headquarters for evaluation testing★ We can conduct a series of tests, including creating inspection programs, inspecting actual boards, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below. *For product information, please download the PDF or feel free to contact us.*

• Measurement and Inspection

This is a flagship model that arranges probe heads above and below, enabling simultaneous in-circuit testing of both sides of the substrate.

Four probes are arranged on the top side of the substrate and two on the bottom side. Each probe can move freely and at high speed, achieving an astonishing inspection speed that is world-class in standard. By using the upper and lower flying probes simultaneously, a combination inspection of up to six probes allows for simultaneous contact inspection at both points on the top and bottom sides of the substrate. This significantly expands the inspection range and further accelerates inspection time. It is equipped with a wealth of features and boasts world-class standards in speed and positioning accuracy. ★You can bring your substrate to our demo room at our Okayama headquarters for evaluation testing★ We can conduct a series of tests including the creation of inspection programs, inspections using actual substrates, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below.

• Measurement and Inspection

The probe heads are arranged above and below, allowing for simultaneous in-circuit testing of both sides of the substrate. (Supported substrate size for inspection: up to 985×610)

The simultaneous use of upper and lower flying probes allows for a combination inspection of up to 6 probes, enabling the inspection of components that can make contact at both points on the top and bottom of the substrate. This model boasts world-class standards in speed and positioning accuracy while expanding the compatible substrate size to W635×D610mm. Additionally, by adding an optional split inspection function, it can also inspect long substrates up to W985×D610mm. It can accommodate component heights of up to 60mm and substrate weights of up to 10kg, making it suitable for inspecting substrates used in automotive, aerospace, and medical devices, as well as power boards and probe cards, which are larger and heavier. ★Evaluation tests can be conducted by bringing in substrates to the demo room at our Okayama headquarters★ A complete testing process is possible, including the creation of inspection programs, testing using actual substrates, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below.

• Measurement and Inspection

We will create new value through the mutual complementarity of ICT and BST.

In-circuit testing with flying probe testers excels at inspecting the electrical characteristics of implemented electronic components in analog circuits. However, components that cannot be probed make electrical testing difficult, and functional testing of digital circuits is challenging. On the other hand, boundary scan testing allows for quick interconnection testing between LSI pins and on-board programming for FPGAs, but it can only test digital circuits around ICs that comply with the boundary scan standard, and it also requires dedicated fixtures for connections. At Takaya Corporation, we possess technology that uses flying probes instead of fixtures that connect 4 to 5 scan-compatible pins and measuring instruments required for boundary scan testing. This allows for boundary scan testing even when the counterpart of a boundary scan-compliant IC is a non-boundary scan-compliant IC or passive components (such as connectors), by enabling the flying probe to function as a virtual boundary scan cell. With a single flying probe tester, it is possible to conduct comprehensive testing of both digital and analog circuits, thereby significantly enhancing testing efficiency compared to before.

• Measurement and Inspection

2025 Drainage Treatment Course We are offering three courses online: Basic Law, Basic Management, and Knowledge Enhancement! This year, the courses are scheduled for May, July, September, November, and January 2025. Applications are currently being accepted. We look forward to your application.

The 34th Environmental Forum will be held on Thursday, June 5, 2025. The Environmental Forum is an event organized by our company in June, which is Environment Month, to encourage many people to think about environmental issues. [Content] Coastal areas that have increased biological productivity and biodiversity due to human involvement are referred to as "satoumi" (satoumi means "sea of the village"). In Part 1, we will introduce what satoumi creation is and how it is developed, using real examples. Additionally, various conservation activities for biodiversity are being carried out in different forms, starting with satoumi creation. In Part 2, we will discuss the current status and future prospects of biodiversity conservation, starting from satoumi. Participation is free of charge. [How to Participate] ZOOM Webinar or Wink Aichi (venue) [Program] 13:30 Opening Remarks 13:45 Part 1: Creating Satoumi Aiming for Coexistence of "People" and "Nature" 14:45 Break 15:00 Part 2: The "Present" and "Future" of Biodiversity 16:00 Part 3: Q&A Session 16:30 Closing Remarks

We are pleased to announce the archive distribution of our seminar titled "Easily Create User-Friendly Manuals for Both People and Generative AI with StockNaut." We will provide a clear explanation of the kintone plugin "StockNaut," which allows you to write text while pasting multiple images into a multi-line text field. The "Markdown syntax" adopted by StockNaut enables the creation of text that is easy for both people and generative AI to read. By combining generative AI, you can experience the benefits of StockNaut at 120%! If you are having trouble with document creation, including manuals, we look forward to your participation. 【Timetable】 - Introduction to StockNaut - Introduction of internal use cases at FCS - Demonstration of the combined use of StockNaut and generative AI - Q&A session We look forward to your applications.

Silex will exhibit at the "Embedded Edge IoT Development EXPO [Spring]" held at Tokyo Big Sight from April 8 (Wednesday) to April 10 (Friday), 2026, showcasing next-generation wireless and edge AI solutions that integrate our long-developed connectivity technology with the latest edge AI, under the theme of "Uninterrupted Wireless + Edge AI Technology."

Nitto Kohki will exhibit at the "Data Center EXPO" held at Makuhari Messe Hall 1 from Wednesday, October 23 to Friday, October 25. [Booth Number: A6-23] At this exhibition, we will showcase the "Compact Zero Spill Coupler," which is specifically designed for data centers, including supercomputers. We will also present the "Blind Mate Type," a fitting exclusively for server cooling piping, as a reference exhibit.