MES2024 34th Microelectronics Symposium Invitation to Exhibit at Corporate Booths

It is a board inspection device capable of ultra-fast in-circuit testing at a top-class level in the industry.

We have completely revamped the platform compared to the conventional model, increasing the probe movement speed by up to 50% and dramatically improving contact position accuracy. Our new high-precision, wide-range measurement system, along with the groundbreaking 4-head 6-flying probe mechanism, significantly reduces inspection costs and enhances quality in the assembly process, regardless of substrate variety or production volume. ★You can bring your own substrates for evaluation tests at our demo rooms in Okayama headquarters and Tokyo branch★ We can conduct a series of tests including the creation of inspection programs, inspections using actual substrates, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below.

• Measurement and Inspection

It is a board inspection device capable of ultra-fast in-circuit testing at a top-class level in the industry. (Supported board size for inspection: up to 985×610)

The APT-1340J maintains its basic performance while expanding the compatible board size to W635×D610mm. Additionally, by adding an optional split inspection function, it can inspect long boards up to W985×D610mm. It can accommodate components with a height of 60mm and board weights of up to 10kg, making it suitable for inspecting boards used in automotive, aerospace, and medical devices, as well as power supply boards and probe cards, which are larger and heavier. ★You can bring your boards to our demonstration room at our Okayama headquarters for evaluation testing★ We can conduct a series of tests, including creating inspection programs, inspecting actual boards, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below. *For product information, please download the PDF or feel free to contact us.*

• Measurement and Inspection

This is a flagship model that arranges probe heads above and below, enabling simultaneous in-circuit testing of both sides of the substrate.

Four probes are arranged on the top side of the substrate and two on the bottom side. Each probe can move freely and at high speed, achieving an astonishing inspection speed that is world-class in standard. By using the upper and lower flying probes simultaneously, a combination inspection of up to six probes allows for simultaneous contact inspection at both points on the top and bottom sides of the substrate. This significantly expands the inspection range and further accelerates inspection time. It is equipped with a wealth of features and boasts world-class standards in speed and positioning accuracy. ★You can bring your substrate to our demo room at our Okayama headquarters for evaluation testing★ We can conduct a series of tests including the creation of inspection programs, inspections using actual substrates, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below.

• Measurement and Inspection

The probe heads are arranged above and below, allowing for simultaneous in-circuit testing of both sides of the substrate. (Supported substrate size for inspection: up to 985×610)

The simultaneous use of upper and lower flying probes allows for a combination inspection of up to 6 probes, enabling the inspection of components that can make contact at both points on the top and bottom of the substrate. This model boasts world-class standards in speed and positioning accuracy while expanding the compatible substrate size to W635×D610mm. Additionally, by adding an optional split inspection function, it can also inspect long substrates up to W985×D610mm. It can accommodate component heights of up to 60mm and substrate weights of up to 10kg, making it suitable for inspecting substrates used in automotive, aerospace, and medical devices, as well as power boards and probe cards, which are larger and heavier. ★Evaluation tests can be conducted by bringing in substrates to the demo room at our Okayama headquarters★ A complete testing process is possible, including the creation of inspection programs, testing using actual substrates, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below.

• Measurement and Inspection

We will create new value through the mutual complementarity of ICT and BST.

In-circuit testing with flying probe testers excels at inspecting the electrical characteristics of implemented electronic components in analog circuits. However, components that cannot be probed make electrical testing difficult, and functional testing of digital circuits is challenging. On the other hand, boundary scan testing allows for quick interconnection testing between LSI pins and on-board programming for FPGAs, but it can only test digital circuits around ICs that comply with the boundary scan standard, and it also requires dedicated fixtures for connections. At Takaya Corporation, we possess technology that uses flying probes instead of fixtures that connect 4 to 5 scan-compatible pins and measuring instruments required for boundary scan testing. This allows for boundary scan testing even when the counterpart of a boundary scan-compliant IC is a non-boundary scan-compliant IC or passive components (such as connectors), by enabling the flying probe to function as a virtual boundary scan cell. With a single flying probe tester, it is possible to conduct comprehensive testing of both digital and analog circuits, thereby significantly enhancing testing efficiency compared to before.

• Measurement and Inspection

The housing industry is currently facing a significant turning point due to factors such as population decline, a reduction in demand for new construction, and intensified price competition. This seminar will clearly explain the "business model transformation strategies" necessary for construction companies to survive and continue to grow in such a challenging environment. We will introduce specific approaches that can be immediately applied on-site, along with a roadmap to success.

Nitto Kohki will hold the "2025 Attack Fair in Meiko" for two days from July 23 (Wednesday) to July 24 (Thursday), 2025, at the "Kowa Seminar Plaza 2F Training Room No. 12 (inside Kowa Sports Land)." The Attack Fair is an exhibition where you can actually "see, touch, and operate" Nitto Kohki's products. Additionally, there will be wonderful souvenirs for attendees and many fun activities prepared. We look forward to welcoming everyone!

ODS Corporation, a manufacturer of business information terminals (headquartered in Chiyoda-ku, Tokyo, President: Kiyoshi Sunanaga), in collaboration with Magconn Corporation (headquartered in Kokubunji City, Tokyo, President: Satoshi Inoue), will showcase its business tablets at the "HCJ2026 International Hotel and Restaurant Show" to be held at Tokyo Big Sight from February 17 (Tuesday) to 20 (Friday), 2026. We will present the Android model "TA2C-NF8" equipped with an NFC reader/writer, which can be utilized in restaurants and hotels, as well as the Windows model "TW2A-NF9LTA" with an NFC reader/writer, which will be unveiled for the first time at this exhibition and is scheduled for release in March. By combining these products with Magconn's charging system, which allows for stable charging with a one-touch magnetic attachment, we aim to propose improvements in operational efficiency and the creation of new business opportunities utilizing NFC solutions.

The Practical Solution Fair is one of Japan's largest IT comprehensive exhibitions, hosted by Otsuka Shokai, held once a year. This year's theme is "Expanding with AI! Complete DX." The venue will showcase the latest business efficiency tools utilizing AI, and Paperlogic will exhibit "Electronic Contracts" and "Construction Document DX Pocket." ■ Date February 18, 2026 (Wednesday) 10:00 AM - 5:00 PM (last entry) February 19, 2026 (Thursday) 9:30 AM - 5:00 PM (last entry) Applications for attendance are accepted until 5 PM on each day. ■ Venue Grand Cube Osaka (Osaka Prefectural International Conference Hall): 5-3-51 Nakanoshima, Kita Ward, Osaka City, Osaka Prefecture ■ Participation method: Free, registration required https://it-event.otsuka-shokai.co.jp/osaka/ ▼ For details on the Tokyo venue, click here https://note.com/paperlogic/n/nb096d59149dc

We will be exhibiting at "JAPAN SHOP 2026," which will be held at Tokyo Big Sight from March 3 (Tuesday) to March 6 (Friday), 2026.