The presentation materials for the 38th Electronics Packaging Society Spring Conference have been released. "Latest Trends in Hybrid Testing Systems Combining JTAG Testing and Flying Probe Testers."

The 38th Electronics Packaging Society Spring Conference was held from March 13 (Wednesday) to March 15 (Friday), 2024, at the Noda Campus of Tokyo University of Science.
At this conference, Mr. Yanagida, the Technical Department Manager of Takaya Corporation's Industrial Equipment Division, gave a presentation on "Latest Trends in Hybrid Testing Systems Combining JTAG Testing and Flying Probe Testers." The presentation materials from that session have been made available, so please take a look at the related catalog page below.
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To ensure reliable mounting guarantees for printed circuit boards, electrical testing is essential. However, a single testing method alone cannot achieve sufficient test coverage.
To address this challenge, we introduce a hybrid testing system that integrates Flying Probe Testers and JTAG Boundary Scan Testing.
By complementing each testing method, we can maximize the test coverage for high-density mounted circuit boards, enabling more accurate fault diagnosis.


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