The presentation materials for the 38th Electronics Packaging Society Spring Conference have been released. "Latest Trends in Hybrid Testing Systems Combining JTAG Testing and Flying Probe Testers."

We will create new value through the mutual complementarity of ICT and BST.

In-circuit testing with flying probe testers excels at inspecting the electrical characteristics of implemented electronic components in analog circuits. However, components that cannot be probed make electrical testing difficult, and functional testing of digital circuits is challenging. On the other hand, boundary scan testing allows for quick interconnection testing between LSI pins and on-board programming for FPGAs, but it can only test digital circuits around ICs that comply with the boundary scan standard, and it also requires dedicated fixtures for connections. At Takaya Corporation, we possess technology that uses flying probes instead of fixtures that connect 4 to 5 scan-compatible pins and measuring instruments required for boundary scan testing. This allows for boundary scan testing even when the counterpart of a boundary scan-compliant IC is a non-boundary scan-compliant IC or passive components (such as connectors), by enabling the flying probe to function as a virtual boundary scan cell. With a single flying probe tester, it is possible to conduct comprehensive testing of both digital and analog circuits, thereby significantly enhancing testing efficiency compared to before.

• Measurement and Inspection

It is a board inspection device capable of ultra-fast in-circuit testing at a top-class level in the industry.

We have completely revamped the platform compared to the conventional model, increasing the probe movement speed by up to 50% and dramatically improving contact position accuracy. Our new high-precision, wide-range measurement system, along with the groundbreaking 4-head 6-flying probe mechanism, significantly reduces inspection costs and enhances quality in the assembly process, regardless of substrate variety or production volume. ★You can bring your own substrates for evaluation tests at our demo rooms in Okayama headquarters and Tokyo branch★ We can conduct a series of tests including the creation of inspection programs, inspections using actual substrates, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below.

• Measurement and Inspection

It is a board inspection device capable of ultra-fast in-circuit testing at a top-class level in the industry. (Supported board size for inspection: up to 985×610)

The APT-1340J maintains its basic performance while expanding the compatible board size to W635×D610mm. Additionally, by adding an optional split inspection function, it can inspect long boards up to W985×D610mm. It can accommodate components with a height of 60mm and board weights of up to 10kg, making it suitable for inspecting boards used in automotive, aerospace, and medical devices, as well as power supply boards and probe cards, which are larger and heavier. ★You can bring your boards to our demonstration room at our Okayama headquarters for evaluation testing★ We can conduct a series of tests, including creating inspection programs, inspecting actual boards, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below. *For product information, please download the PDF or feel free to contact us.*

• Measurement and Inspection

This is a flagship model that arranges probe heads above and below, enabling simultaneous in-circuit testing of both sides of the substrate.

Four probes are arranged on the top side of the substrate and two on the bottom side. Each probe can move freely and at high speed, achieving an astonishing inspection speed that is world-class in standard. By using the upper and lower flying probes simultaneously, a combination inspection of up to six probes allows for simultaneous contact inspection at both points on the top and bottom sides of the substrate. This significantly expands the inspection range and further accelerates inspection time. It is equipped with a wealth of features and boasts world-class standards in speed and positioning accuracy. ★You can bring your substrate to our demo room at our Okayama headquarters for evaluation testing★ We can conduct a series of tests including the creation of inspection programs, inspections using actual substrates, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below.

• Measurement and Inspection

The probe heads are arranged above and below, allowing for simultaneous in-circuit testing of both sides of the substrate. (Supported substrate size for inspection: up to 985×610)

The simultaneous use of upper and lower flying probes allows for a combination inspection of up to 6 probes, enabling the inspection of components that can make contact at both points on the top and bottom of the substrate. This model boasts world-class standards in speed and positioning accuracy while expanding the compatible substrate size to W635×D610mm. Additionally, by adding an optional split inspection function, it can also inspect long substrates up to W985×D610mm. It can accommodate component heights of up to 60mm and substrate weights of up to 10kg, making it suitable for inspecting substrates used in automotive, aerospace, and medical devices, as well as power boards and probe cards, which are larger and heavier. ★Evaluation tests can be conducted by bringing in substrates to the demo room at our Okayama headquarters★ A complete testing process is possible, including the creation of inspection programs, testing using actual substrates, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below.

• Measurement and Inspection

Programming for FPGAs and special performance tests such as BST can be handled with a flying probe tester.

This is an option that equips the underside operating axis of the APT-1600FD series with a dedicated fixture lifting mechanism. It allows for special inspections connected to external devices, such as Boundary Scan Testing (BST), as well as writing to and reading logs from ICs, to be performed in parallel with in-circuit testing. *Please refer to the YouTube video for an image of the operation.

• Measurement and Inspection

Kort Valuta Inc. (Head Office: Shibuya, Tokyo; CEO: Hideki Shibata) is pleased to announce that we will hold our next recruitment event, “Kort Valuta Night,” on November 26, 2025. This recurring event offers an opportunity for potential candidates to casually learn about our company culture and team atmosphere before applying. By lowering the barrier to entry and providing authentic insights from current employees, the event helps participants gain a more concrete sense of what it’s like to work at Kort Valuta. Since the event’s launch, approximately ten attendees have gone on to join the company in a range of roles — including marketing, customer support, and backend engineering.

Kort Valuta Inc. (Headquarters: Shibuya-ku, Tokyo; President & CEO: Hideki Shibata; hereinafter “the Company”) announces that it has renewed the user interface (UI) of TwooCa, the Company’s digital employee ID with Visa payment functionality.

Kort Valuta Inc. (Headquarters: Shibuya-ku, Tokyo; CEO: Hideki Shibata) is pleased to announcethat NBS Logisol Co., Ltd. (Headquarters: Hita City, Oita Prefecture; CEO: Itsuro Kono) has introduced “TwooCa,”a Visa-enabled digital employee ID card, for approximately 1,100 employees.

An article about the resin-based lightweight formwork system "PERI DUO" has been published in the "Construction News" (November 7, 2025)! "PERI DUO" is a new system formwork made of resin that can be used for walls. It is made from a newly developed material called "Politec," which is high-strength and lightweight. With fewer components, it is easy to handle. It allows for increased reuse and is an environmentally friendly lightweight formwork that is flexible on the construction site! 【DUO Product Features】 ■ New system formwork made of resin ■ High strength and lightweight ■ Fewer components and easy to handle ■ 100% recyclable *For more details about this product, please feel free to contact us. PERI Japan Co., Ltd.

We are pleased to announce that the "Kuji Regional Renewable Energy Circulation Project" in Kuji City, Iwate Prefecture, has received an Excellence Award at the 2025 Solar Week Awards organized by the Japan Photovoltaic Energy Association. The "Solar Week Awards" recognize initiatives and projects that contribute to the community, are desired by the community, and serve as models for the expansion of solar power generation. On July 24, 2025, NGK Insulators, Ltd. issued a press release titled "Start of Operation of Solar Power Generation Equipment at Hybrid Storage Facility with Sharing Function - Ceremony Held at Solar Power Plant Operated by Iwate Bank Group Company." This demonstration of the hybrid storage facility with sharing function (StorageHub) is being conducted by manorda Iwate, a regional trading company fully funded by Iwate Bank, with development led by NR-Power Lab Co., Ltd. NR-Power Lab Co., Ltd. is leading the design, development, and system operation of the StorageHub in this project. We will continue to collaborate with our partner companies to engage in technological development and the creation of advanced services aimed at realizing a sustainable local community.