Announcement of the Introduction of FIB-SEM Helios 5 UC

The introduction of the "FIB-SEM Helios 5 UC" is scheduled to start service in November. We will provide shorter delivery times and reliable feedback than ever before.
We will achieve high-throughput cross-sectional observation and analysis of a wide range of materials, from semiconductor devices such as power devices, ICs, solar cells, and light-emitting elements, to electronic components like MLCCs and soft materials.
With a high-quality beam of up to 100nA, we can process large areas at high speed, and by finishing the FIB at low acceleration, it is possible to produce high-quality samples with minimal damage layers.
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