大日商事 List of Products and Services

We would like to introduce the "Wafer Processing Equipment" handled by Dai Nichi Shoji Co., Ltd. The "Laser Scriber" is a scribing tool for wafers such as sapphire, GaN, SiC, and quartz. The "High-Speed Chip Transfer Device" achieves a high-speed transfer of 0.2 seconds per piece from sheet to sheet and is also compatible with sheet to tray transport. Additionally, we handle products such as the "Atmospheric Plasma/Vacuum Plasma Device," which allows for surface modification before printing, and "Shipping Adhesive Trays" for the storage and transport of precision parts compatible with LEDs and LDs. 【Laser Scriber Features】 - High-speed throughput: Achieves 800 mm/sec - Debris-free processing - Accommodates wafer warping and thickness variations - Compatible with φ2 to φ6 inches - Patent pending *For more details, please refer to the PDF document or feel free to contact us.

• Measurement and Inspection

We would like to introduce the "Cleaning Equipment" handled by Dai Nichi Shoji Co., Ltd. The "Pure Water and Semi-Pure Water Inline Cleaning Equipment" includes nine types of cleaning devices, such as cleaning equipment for photochemical components and glass substrates, as well as NC spray cleaning devices. The "Flux Cleaning Device" is a compact shower-type device capable of powerful cleaning with upper and lower pure water showers, while the "Hydrocarbon and Organic Solvent Vacuum Cleaner" is a product with a proven track record in cleaning sealed press components. We also handle the "PC Board Cleaner," which removes debris and burrs from printed circuit boards. 【Pure Water and Semi-Pure Water Inline Cleaning Equipment Lineup】 ■ Cleaning equipment for photochemical components and glass substrates ■ NC spray cleaning device ■ Semiconductor package cleaning device (direct path cleaning device) ■ Inline glass substrate cleaning device (counter ultrasonic and brush cleaning process) ■ Wafer cleaning device *For more details, please refer to the PDF document or feel free to contact us.

• Measurement and Inspection

We would like to introduce the "joining materials" handled by Dai Nichi Shoji Co., Ltd. The "Pb-free solder paste" comes in two types: water-washable and no-clean, with the viscosity of the water-washable type being 160 Pa.s and the no-clean type being 180 Pa.s. The "BGA balls" are available in two types: low melting point and high melting point, and we offer three types of "flux" with different viscosities. 【Main compositions (Pb-free solder paste)】 ■Sn-Ag-Cu ■Sn-Zn-Al(Bi) ■Sn-Ag-Cu-Co ■High melting point options are also available *For more details, please refer to the PDF materials or feel free to contact us.

• Measurement and Inspection

We would like to introduce the "Reflow Equipment" handled by Dai Nichi Shoji Co., Ltd. The "N2 Compact Size Reflow" is a product that achieves a compact size with a total length of 2.5m and 6 zones, suitable for packages such as BGA/CSP. The "φ6-8 Inch Wafer BUMP Reflow" can be used as a wet back device for bump formation after solder plating, while the "φ8-12 Inch Wafer BUMP Reflow" is suitable for reflow after ball mounting and bump printing. Additionally, we also handle "Vacuum Reflow Equipment" and "Tabletop Reflow Equipment." [N2 Compact Size Reflow Features] ■ Max 350℃ (±2.5℃) ■ Compatible Size: Max 250×230mm ■ Oxygen Concentration in Furnace: 50ppm and above ■ 3-phase 200V 20kW ■ Combination of hot air circulation and far infrared is possible *For more details, please refer to the PDF materials or feel free to contact us.

• Measurement and Inspection

Dainichi Shoji Co., Ltd. introduces the "Inspection Equipment" it handles. The "Wafer and Chip Appearance Inspection Equipment" achieves labor-saving with high-speed throughput and is capable of inspecting micro-cracks, foreign substances, and pattern defects. The "Small Glass Substrate Appearance Inspection Equipment" can detect minute scratches and dirt on small glass substrates such as those used in smartphones. Additionally, we also handle the "Electronic Component 6-Surface Appearance Inspection Equipment," which can perform high-speed inspection of chip components on six surfaces, processing approximately 1,500 units per minute. 【Wafer and Chip Appearance Inspection Equipment Features】 ■ Compatible with 2-inch to 12-inch sizes ■ Supports Si wafers, compounds, glass, etc. ■ Inspection of warped wafers and chips after dicing ■ Automatic discrimination function / Map data storage function ■ Resolution: 1.5μm *For more details, please refer to the PDF document or feel free to contact us.

• Measurement and Inspection

This catalog features the product lineup handled by the post-process department. We offer a wide range of products, including the "Wafer and Chip Appearance Inspection Equipment" compatible with 2-inch to 12-inch sizes, as well as "N2 Compact Size Reflow" and "Solder Paste." 【Featured Products (Excerpt)】 ■ Inspection Equipment ■ Reflow Equipment ■ Bonding Materials ■ Cleaning Equipment ■ Wafer Process Equipment ■ Others *For more details, please refer to the PDF document or feel free to contact us.

• Joining and fastening materials
• others

The vacuum tweezers, Conductive C Series / Chemical Resistant F Series, demonstrate excellent airtightness and durability by having the interior of the tweezers valve finished to a mirror surface. Additionally, dust generation during button operation has been minimized. The uniquely precision-engineered valve structure ensures stable performance for long-term repetitive tasks of wafer adhesion and instant release. The exposure of metal parts has been kept to a minimum, allowing for safe handling. 【Features】 - The suction tip has a highly polished mirror finish on the suction surface. - Prevents particle generation and maintains stable suction surface accuracy for long-term use. - The tweezers body is connected to the tube via a connector. - The body can be easily detached from the tube. - The suction tips come in a variety of sizes, accommodating a wide range of wafer sizes. For more details, please contact us or download the catalog.

• Transportation System
• Other elevators and transport systems

The Bernoulli chuck generates a stronger suction force by utilizing Bernoulli's principle to expel air. The transported object makes point contact with the edge of the Bernoulli chuck's surface, allowing it to be transported with stable holding power in a non-contact state at the center of the wafer, without any rotation. The main body is designed to accommodate various wafer sizes with just one unit. 【Features】 - The main body can be selected from three angles of use: 20 degrees, 45 degrees, and 90 degrees. - By changing the guide ring compatible with different inch sizes, it can be used for wafers ranging from 2 to 12 inches. - The use of conductive nylon resin for the main body reduces weight. - There is pattern printing on both sides, accommodating wafers that are thin and difficult to handle, down to 50µm. - Custom designs tailored to specific objects, such as square shapes, are also available. For more details, please contact us or download the catalog.

• Transportation System
• Other elevators and transport systems

At Dai Nichi Shoji Co., Ltd., we offer a variety of cleaning systems optimized for different environments, ranging from water-based and semi-water-based to organic solvent-based and hydrocarbon-based. Our "water-based and semi-water-based cleaning devices" cater to all types of cleaning, from general cleaning to precision cleaning for electronic components and LCD-related items, using "water." Our "organic solvent-based cleaning devices" accommodate traditional chlorine-based organic solvents as well as various alternative fluorocarbons and bromine-based solvents. We also provide "hydrocarbon-based cleaning devices" that support new hydrocarbon cleaning agents, with a particular focus on "rapid drying" after cleaning. Additionally, we handle "drying devices" and "ancillary devices for cleaning" that accompany the cleaning equipment. For more details, please contact us or refer to our catalog.

• others

□ By extracting chips for each rank, continuous high-speed operation is possible. □ By partially modifying the mechanism as an option, it is also possible to change from tray arrangement to sheet arrangement. □ By installing an optional wafer loader, full automation is possible.

• others

The "Tack Sheet" is a sheet that securely holds precision parts, various assembly components, jigs, tools, and more with its versatile adhesive strength. We offer three types: the low outgassing "non-silicone type," the heat-resistant and chemical-resistant "silicone type," and the "conductive silicone type" that excels in conductivity, heat resistance, and chemical resistance. The adhesive strength can also be adjusted according to the application and target objects. 【Features】 ■ Three types of sheet materials are available according to the application ■ The non-silicone type has low outgassing ■ The conductive silicone type is conductive and excels in heat resistance and chemical resistance ■ The silicone type excels in heat resistance and chemical resistance *For more details, please refer to the PDF document or feel free to contact us.

• others
• Safety and consumables

The "Tact Tray" is a tray that alleviates impact with the adhesive strength and elasticity of the sheet, safely protecting and holding mounted items without any rattling. The special sheet, which has a high adhesive effect without vacuum adhesion, holds mounted items firmly while allowing for easy pickup (removal of mounted items), making it suitable for transporting delicate materials and precision parts with extremely thin shapes. Additionally, there is no need to change the tray based on the shape or size of the mounted items. 【Features】 ■ Uses low outgassing conductive resin (main body) ■ Low outgassing adhesive sheet is non-silicone ■ No vacuum devices or vacuum equipment needed for pickup ■ Can be stacked, effectively utilizing workspace ■ Registered as a utility model *For more details, please refer to the PDF document or feel free to contact us.

• Safety and consumables

We propose environmentally friendly lead-free solder backed by experience and technology!

• others

□ The BGA package is compact yet features a 6-zone specification. □ Achieves an oxygen concentration in the furnace of below 100 ppm. □ In-plane temperature distribution: ±2℃. □ Built-in catalytic device effective for purification within the furnace. □ Wafer transport uses a uniquely developed walking beam method.

• others

The "Tack Carrier" is a tray with an adhesive sheet that mitigates shock with the adhesive strength and elasticity of the sheet, safely protecting and holding the mounted items. It uses low outgassing conductive resin (body) and transparent static-resistant resin (lid). The adhesive sheet is non-silicone. The adhesive strength type 51 has a strong holding power for mounted items while allowing for easy pickup (removal of mounted items). 【Features】 ■ The adhesive sheet is non-silicone ■ The lid can be easily opened and closed, allowing for easy handling of mounted items ■ Can be stacked, effectively utilizing workspace ■ Size changes for printed patterns (frames, text) and printing of company logos are also possible (consult separately) *For more details, please refer to the PDF materials or feel free to contact us.

• Safety and consumables

Not only can we detect minute defects (foreign substances, scratches, etc.) that occur on transparent substrates such as sapphire, which have traditionally been difficult to inspect, but we can also automate and standardize the inspection process that has previously shown significant variability when done by the naked eye.

• Non-destructive testing

Easy to use! Easy to hold! For universities, research institutes, and researchers.

• others