Introducing wafer bump reflow, vacuum reflow equipment, and tabletop reflow equipment.
We would like to introduce the "Reflow Equipment" handled by Dai Nichi Shoji Co., Ltd. The "N2 Compact Size Reflow" is a product that achieves a compact size with a total length of 2.5m and 6 zones, suitable for packages such as BGA/CSP. The "φ6-8 Inch Wafer BUMP Reflow" can be used as a wet back device for bump formation after solder plating, while the "φ8-12 Inch Wafer BUMP Reflow" is suitable for reflow after ball mounting and bump printing. Additionally, we also handle "Vacuum Reflow Equipment" and "Tabletop Reflow Equipment." [N2 Compact Size Reflow Features] ■ Max 350℃ (±2.5℃) ■ Compatible Size: Max 250×230mm ■ Oxygen Concentration in Furnace: 50ppm and above ■ 3-phase 200V 20kW ■ Combination of hot air circulation and far infrared is possible *For more details, please refer to the PDF materials or feel free to contact us.
Inquire About This Product
basic information
【Other Features (Excerpt)】 ■ φ6-8 inch wafer BUMP reflow - Heating method: Combination of hot plate and upper infrared heater - Integrated design of loader and unloader - Handling within the furnace equipped with a 3-axis clean robot ■ φ8-12 inch wafer BUMP reflow - Heating method: Combination of hot plate and upper infrared heater - Hot plate: Bin heating adapted to wafer warpage - Equipped with two 3-axis clean robots ■ Vacuum reflow device - Maximum φ12 inches (single chamber) - Vacuum level: Below 10 kPa - Hot plate & infrared - Cooling: N2 nozzle (inside the furnace) / water-cooled plate (outside the furnace) ■ Tabletop reflow device - Conveyor type & batch type heating furnace - Supports up to 400°C and a maximum width of 340mm - Equipped with a side window for internal observation *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
Download All Catalogs
Company information
Dai Nichi Shoji Co., Ltd. was founded in 1959 as an import trading company and has been providing products such as temperature sensors, plastic products, consumable materials, and equipment for the electronics (semiconductor and LCD) industry. In 1997, we established a plastic molding factory in Yonezawa City, Yamagata Prefecture, and established a corporate structure that combines trading and manufacturing functions. At the core of our operations is our "spirit of challenge" to respond quickly to customer needs and problem-solving, as well as our commitment to manufacturing. To survive in the rapidly changing electronics industry, we will continuously anticipate market demands and diligently strive to provide excellent technology and high-quality products, aiming to be a company trusted by society.