Introducing Pb-free solder paste, BGA balls, and flux.
We would like to introduce the "joining materials" handled by Dai Nichi Shoji Co., Ltd. The "Pb-free solder paste" comes in two types: water-washable and no-clean, with the viscosity of the water-washable type being 160 Pa.s and the no-clean type being 180 Pa.s. The "BGA balls" are available in two types: low melting point and high melting point, and we offer three types of "flux" with different viscosities. 【Main compositions (Pb-free solder paste)】 ■Sn-Ag-Cu ■Sn-Zn-Al(Bi) ■Sn-Ag-Cu-Co ■High melting point options are also available *For more details, please refer to the PDF materials or feel free to contact us.
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basic information
【Lineup】 ■Pb-Free Solder Paste ・Water Washable Type: PBF111-WA10.5-MK1127 ・No Clean Type: PBF111-RAA11.5-G052 ■BGA Balls ・Low Melting Point Type: L-M-P Type ・High Melting Point Type: H-M-P Type ■Flux ・FW-4025S ・FW-2800 ・FW-259 (for Flip Chip) *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Company information
Dai Nichi Shoji Co., Ltd. was founded in 1959 as an import trading company and has been providing products such as temperature sensors, plastic products, consumable materials, and equipment for the electronics (semiconductor and LCD) industry. In 1997, we established a plastic molding factory in Yonezawa City, Yamagata Prefecture, and established a corporate structure that combines trading and manufacturing functions. At the core of our operations is our "spirit of challenge" to respond quickly to customer needs and problem-solving, as well as our commitment to manufacturing. To survive in the rapidly changing electronics industry, we will continuously anticipate market demands and diligently strive to provide excellent technology and high-quality products, aiming to be a company trusted by society.