Transporting 2 to 12-inch wafers laid flat, gently wrapped in air.
The Bernoulli chuck generates a stronger suction force by utilizing Bernoulli's principle to expel air. The transported object makes point contact with the edge of the Bernoulli chuck's surface, allowing it to be transported with stable holding power in a non-contact state at the center of the wafer, without any rotation. The main body is designed to accommodate various wafer sizes with just one unit. 【Features】 - The main body can be selected from three angles of use: 20 degrees, 45 degrees, and 90 degrees. - By changing the guide ring compatible with different inch sizes, it can be used for wafers ranging from 2 to 12 inches. - The use of conductive nylon resin for the main body reduces weight. - There is pattern printing on both sides, accommodating wafers that are thin and difficult to handle, down to 50µm. - Custom designs tailored to specific objects, such as square shapes, are also available. For more details, please contact us or download the catalog.
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basic information
【Features】 ○ The handle can be selected from three angles: 20 degrees, 45 degrees, and 90 degrees. By changing the guide ring corresponding to the size, it can be used for sizes ranging from 2 to 12 inches. (The usage angle is fixed, and changing the angle requires changing the main body.) ○ The guide stopper has a gentle taper, allowing for point contact with the wafer edge. ○ The guide ring made of transparent acrylic resin for ESD protection allows for visual positioning and confirmation of the suction state. 【Options】 ○ Dedicated stand → Stand for Bernoulli chuck for 6-inch to 2-inch: Code No. 678 → Stand for Bernoulli chuck for 12-inch/8-inch: Code No. 699 ○ For Proto carrier ○ For solar panels ● For more details, please contact us or download the catalog.
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Company information
Dai Nichi Shoji Co., Ltd. was founded in 1959 as an import trading company and has been providing products such as temperature sensors, plastic products, consumable materials, and equipment for the electronics (semiconductor and LCD) industry. In 1997, we established a plastic molding factory in Yonezawa City, Yamagata Prefecture, and established a corporate structure that combines trading and manufacturing functions. At the core of our operations is our "spirit of challenge" to respond quickly to customer needs and problem-solving, as well as our commitment to manufacturing. To survive in the rapidly changing electronics industry, we will continuously anticipate market demands and diligently strive to provide excellent technology and high-quality products, aiming to be a company trusted by society.
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