富山技販 List of Products and Services

The "S-WAVE301" is a 3D local heating device that complies with various regulations such as ICNRP and the Radio Law. It maintains features such as low power consumption and high heating efficiency while achieving high continuous operation performance. It allows for shorter heating intervals and reduced cycle times. Additionally, it has achieved miniaturization of the head unit, which is effective for improving solder joint quality and addressing red-eye issues. 【Features】 ■ Maintains characteristics such as low power consumption and high heating efficiency ■ Increased cooling capacity extends heating time at high output ■ Shorter heating intervals reduce cycle times ■ Achieved miniaturization of the head unit ■ Effective for improving solder joint quality and addressing red-eye issues ■ Complies with various regulations such as ICNRP and the Radio Law *For more details, please refer to the PDF document or feel free to contact us.

• Work tools

The "S-WAVE301A" is a 3D local heating device that achieves high heating efficiency with low power consumption. It is suitable for soldering snow hole terminals. It supports double-sided boards, single-sided boards, flexible boards, and low heat-resistant components. Additionally, it suppresses radiant heat, minimizing the impact on surrounding components. Please feel free to contact us when you need assistance. 【Features】 ■ Achieves high heating efficiency with low power consumption ■ Suitable for soldering snow hole terminals ■ Preheats pad surfaces of printed circuit boards, etc. ■ Utilized for spot heating of low heat-resistant components ■ Suppresses radiant heat to minimize impact on surrounding components ■ Complies with various regulations such as ICNRP and the Radio Law *For more details, please refer to the PDF document or feel free to contact us.

• Work tools

The "S-WAVE FBA Series" is a product designed to suppress solder balls during low-temperature soldering at 250°C. It allows for non-contact tool changes that are not needed for an extended period. It is applicable to general through-hole mounting of electronic components, terminals with insufficient solder, and areas with heat-sensitive components or surrounding parts. Additionally, it reduces solder material consumption through wire solder supply, and the power consumption during soldering is less than 300W. 【Features】 ■ Suppresses solder balls during low-temperature soldering at 250°C ■ Non-contact tool changes are not needed for an extended period ■ Daily maintenance is automated with a temperature checker/cleaning device (optional) ■ Reduces solder material consumption through wire solder supply ■ Power consumption is less than 300W (during soldering) *For more details, please refer to the PDF document or feel free to contact us.

• Work tools

The "S-WAVE" is a 3D localized heating device that accommodates a range of materials from metal-based substrates to ceramic substrates and low-heat-resistant components. The "S-WAVE301A" rapidly heats narrow spots to 300°C, the "S-WAVE301" achieves high continuous operation performance, and the "S-WAVE301H" realizes double the heating power compared to conventional models. We offer three evolving lineups that respond to the needs of the times. 【Features】 <S-WAVE301A> ■ Achieves high heating efficiency with low power consumption ■ Suitable for soldering through-hole terminals ■ Preheats pad surfaces of printed circuit boards, etc. ■ Reduces radiant heat and minimizes impact on surrounding components ■ Complies with various regulations such as ICNIRP and radio wave laws *For more details, please refer to the PDF materials or feel free to contact us.

• Work tools

The "S-WAVE301H" is a product designed for spot heating printed circuit boards that require a large amount of heat. It is compatible with distinctive substrates such as busbars, power semiconductors, 4-layer boards, high multilayer boards, thick copper boards, ceramic substrates, and metal base substrates. It retains features such as low power consumption and high heating efficiency. Please feel free to contact us when you need assistance. 【Features】 ■ Low power consumption, high heating efficiency ■ Spot heating for printed circuit boards requiring a large amount of heat ■ Improvement of solder joint quality for power semiconductors ■ Improvement of solder joint quality for busbars ■ Compliance with various regulations such as ICNIRP and the Radio Law ■ Compatibility with distinctive substrates such as busbars and metal base substrates *For more details, please feel free to contact us.

• Other services and technologies

We would like to introduce a case of IH soldering performed on the edge terminals of automotive products. When the resin part is close to the terminals, the soldering iron method can cause issues with radiant heat, and the laser method can have problems with reflected light, often resulting in the melting of the resin part. In the case of the IH method, the magnetic concentration head tip has the characteristic of raising the terminal temperature to 250°C while remaining below 100°C for the surrounding resin, allowing for soldering without any issues even when resin is nearby. [Case Summary] ■ Issues - The soldering iron method can cause problems with radiant heat, and the laser method can have issues with reflected light, often melting the resin part. ■ Results - In the case of the IH method, soldering can be performed without issues even when resin is nearby. *For more details, please refer to the PDF document or feel free to contact us.

• others

We would like to introduce a case of IH soldering on a large thermal capacity substrate for automotive products. With the rise of electric vehicles (EVs), the use of large thermal capacity substrates in automotive components has increased. In the IH method, not only the terminals but also the large patterns and solder are heated, significantly improving solder joint quality. IH soldering is a strong area for large thermal capacity substrates. 【Case Overview】 ■ Heating Targets ・6-layer thick copper substrate ・□0.64 *For more details, please refer to the PDF document or feel free to contact us.

• others

The IH soldering device "S-WAVE" has a magnetic concentration head tip that operates below 100°C, while the terminals can rise to 250°C. This allows for soldering without issues even when resin is nearby. Thanks to EV adoption, even large heat capacity substrates that have become more common in automotive components can be effectively soldered with S-WAVE, as it heats not only the terminals but also the flat patterns and solder, significantly improving solder joint quality. The "Introduction of Wall-Mounted Terminal Examples" section features common examples of automotive substrates and heating conditions. The "Introduction of Large Heat Capacity Substrate Examples" section includes examples of large heat capacity substrates and thermographic results. Additionally, we explain the benefits of the WAVE series IH soldering, making it easy to reference when considering implementation. **Benefits of IH Soldering in the S-WAVE Series** - In addition to terminals, pads and solder also generate heat, which shortens the cycle time for soldering medium to large heat capacity terminals. - Non-contact operation means there are no replacement parts. - Non-contact operation ensures stable quality. - This method minimizes the occurrence of solder balls. *For more details, please refer to the PDF materials or feel free to contact us.*

• Water heater Cooker IH

The IH soldering device "S-WAVE" was born as a device that allows for soldering that is "tool exchange-free" and "fast and beautiful with high thermal capacity." This document introduces the improvement in production capacity resulting from the above two features. It provides detailed explanations on "changes in the soldering process flow with S-WAVE" and "improvements in production capacity with S-WAVE = improvements in OEE and reductions in CT." *We have summarized technical information and case studies in an easy-to-understand manner, so please take a moment to read it! [Contents] ■ Changes in the soldering process flow with S-WAVE ■ Improvements in production capacity with S-WAVE = improvements in OEE and reductions in CT ■ Preliminary examination of the introduction effects of S-WAVE ■ Competitiveness we aim for with our customers *For more details, please refer to the PDF document or feel free to contact us.

• others

The IH soldering device "S-WAVE" enables non-contact and localized heating in confined spaces through heating technology. It eliminates the risk of re-melting surrounding solder areas, allowing for high-quality and efficient soldering of high-density printed circuit boards. It excels in production processes with high quality demands and is suitable for mass production. *Compatible with terminals ranging from φ0.3 to 1.5mm. ～ Documents summarizing case studies and technical information are currently available! ～ You can view them immediately from the [PDF Download] below. ＜ Common issues with soldering ＞ ◎ The running costs of adjusting or replacing consumable parts are burdensome... ◎ There are quality issues due to variability and burdens from rework processes... ◎ We want to improve yield... ◎ We want to solder in narrow areas that cannot be done manually... ◎ We want to switch from batch soldering to inline production... ◎ It is difficult to balance skill development and quality... ⇒ These concerns can be resolved with the "IH Soldering Device S-WAVE"! ★ If you would like to request sample processing or a demonstration with a demo machine, please feel free to contact us.

• others

Introducing the IH soldering equipment handled by Toyama Gihan. Equipped with non-contact localized heating that allows for soldering without contact. It does not re-melt the surrounding solder areas. Additionally, it supports automatic alignment, rapid heating of large and small terminals, and post-heating treatment. Currently, it accommodates terminals ranging from φ0.3 to φ1.5. 【Features】 ■ Non-contact localized heating ■ Does not re-melt the surrounding solder areas ■ Achieves precise soldering ■ Realizes localized heating ■ Supports automatic alignment, rapid heating of large and small terminals, and post-heating treatment ■ Almost no consumable parts ■ Compatible with terminals from φ0.3 to φ1.5 ■ Reduction of solder balls possible (achieved through precise feeding) *For more details, please refer to the PDF document.

• others

The IH soldering device 'S-WAVE' enables non-contact, pinpoint heating, allowing for soldering in narrow areas that cannot be addressed by manual methods. There is no concern about the surrounding solder areas re-melting, making it possible to achieve high-quality and efficient soldering even on high-density printed circuit boards. Since solder heating can be done non-contact, it achieves zero waste solder (free from residual solder on tips or in tanks). This contributes to environmental issues by reducing CO2 emissions and lowering costs (as a significant amount of CO2 is emitted during the recycling process of waste solder). <Features> ■ Energy-saving due to fewer consumables ■ Non-contact localized heating ■ Soldering possible from below ■ Low maintenance and low running costs ■ Rapid heating with high output even in hard-to-heat areas ■ High precision and high-speed soldering is achievable *For more details, please refer to the PDF materials.

• others

The IH soldering device 'S-WAVE' allows for non-contact, pinpoint heating, making it possible to solder in narrow areas that cannot be addressed by manual methods. There is no concern about the surrounding solder areas re-melting, enabling high-quality and high-efficiency soldering even on high-density printed circuit boards. Even on boards with components that have a large difference in thermal capacity, it can be completed in one process, leading to improved productivity. 【Features】 ■ Compatible with terminals from φ0.3 to 1.5mm ■ Contributes to the automation of manual soldering and reduction of cycle time ■ Minimal consumables, low maintenance, and low running costs ■ Rapid heating with high output even in hard-to-heat areas ■ Achieves high-precision and high-speed soldering *For more details, please refer to the PDF document. If you would like to request sample processing or a demonstration with a demo unit, please contact us through the inquiry form.

• others

The IH soldering device 'S-WAVE' enables non-contact and pinpoint heating, making it possible to solder in narrow areas that are difficult to reach by hand. There is no concern about the surrounding solder areas re-melting, allowing for high-quality and efficient soldering even on high-density printed circuit boards. Even on boards with components that have a large difference in thermal capacity, it can be completed in one process, leading to improved productivity. 【Features】 ■ Compatible with terminals from φ0.3 to 1.5mm ■ Contributes to the automation of hand soldering and reduction of cycle time ■ Minimal consumables, low maintenance, and low running costs ■ Rapid heating with high output even in hard-to-warm areas ■ Achieves high-precision and high-speed soldering ■ Significantly reduces waste solder Please take the opportunity to see this device with your own eyes.

• others

Our company is engaged in the design and manufacturing of various production equipment and labor-saving machines, as well as the production of various molds and machining of various mechanical parts. With the motto "from materials to finished products," we have provided a variety of unique multi-skilled techniques. As the flow of the times has changed significantly and is accelerating, we will fully utilize the required technologies to face each customer directly and swiftly solve their challenges. 【Business Activities】 ■ Design and manufacturing of various production equipment and labor-saving machines ■ Production of various molds ■ Machining of various mechanical parts *For more details, please refer to the PDF document or feel free to contact us.

• others

We respond to various requests. Application development in multiple directions from packaging machines is, of course, possible.

• Automatic Packaging Machine

It is a packaging machine that puts elongated products into elongated cases and covers them with elongated lids.

• Packaging Machines