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  6. [IH Soldering Example] Large Heat Capacity Substrate

[IH Soldering Example] Large Heat Capacity Substrate

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last updated:May 23, 2024

富山技販
富山技販
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A field where the IH method excels! Introducing a case study that achieved soldering on a 6-layer thick copper substrate.

We would like to introduce a case of IH soldering on a large thermal capacity substrate for automotive products. With the rise of electric vehicles (EVs), the use of large thermal capacity substrates in automotive components has increased. In the IH method, not only the terminals but also the large patterns and solder are heated, significantly improving solder joint quality. IH soldering is a strong area for large thermal capacity substrates. 【Case Overview】 ■ Heating Targets ・6-layer thick copper substrate ・□0.64 *For more details, please refer to the PDF document or feel free to contact us.

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【IHはんだ付け事例】大熱容量基板1.PNG

[IH Soldering Example] Large Heat Capacity Substrate

【IHはんだ付け事例】大熱容量基板1.PNG
【IHはんだ付け事例】大熱容量基板1.PNG
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[Information] IH Soldering for Automotive Products <Introduction of "Large Heat Capacity Substrate" Case>

[Information] IH Soldering for Automotive Products <Introduction of "Large Heat Capacity Substrate" Case>

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