Three evolving lineups that meet the needs of the times! Introducing the 3D local heating device.
The "S-WAVE" is a 3D localized heating device that accommodates a range of materials from metal-based substrates to ceramic substrates and low-heat-resistant components. The "S-WAVE301A" rapidly heats narrow spots to 300°C, the "S-WAVE301" achieves high continuous operation performance, and the "S-WAVE301H" realizes double the heating power compared to conventional models. We offer three evolving lineups that respond to the needs of the times. 【Features】 <S-WAVE301A> ■ Achieves high heating efficiency with low power consumption ■ Suitable for soldering through-hole terminals ■ Preheats pad surfaces of printed circuit boards, etc. ■ Reduces radiant heat and minimizes impact on surrounding components ■ Complies with various regulations such as ICNIRP and radio wave laws *For more details, please refer to the PDF materials or feel free to contact us.
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【Other Features】 <S-WAVE301> ■ Increased cooling power extends heating time during high output ■ Shortened heating intervals reduce cycle time ■ Achieved miniaturization of the head unit ■ Effective in improving solder rise and addressing red eye issues <S-WAVE301H> ■ Spot heating for printed circuit boards requiring large amounts of heat ■ Improves solder rise for power semiconductors ■ Improves solder rise for bus bars *For more details, please refer to the PDF document or feel free to contact us.
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【Applications】 ■ Metal base substrates, ceramic substrates, thick copper substrates, high multilayer substrates, 4-layer substrates ■ Power semiconductors, bus bars, double-sided substrates, single-sided substrates, general electronic components ■ Flexible substrates, low heat-resistant components *For more details, please refer to the PDF document or feel free to contact us.
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We leverage cutting-edge technology and cross-disciplinary information and know-how to create added value for our customers' businesses. From raw materials to finished products, we will do our utmost to address any challenges.
