New Technology | IH Soldering Equipment Achieves Soldering Through Non-Contact and Induction Heating

Non-contact and localized heating suppresses temperature rise in surrounding components. Parts that are difficult to heat and parts that are sensitive to heat can be joined with a single unit.

The IH soldering device 'S-WAVE' allows for non-contact, pinpoint heating, making it possible to solder in narrow areas that cannot be addressed by manual methods. There is no concern about the surrounding solder areas re-melting, enabling high-quality and high-efficiency soldering even on high-density printed circuit boards. Even on boards with components that have a large difference in thermal capacity, it can be completed in one process, leading to improved productivity. 【Features】 ■ Compatible with terminals from φ0.3 to 1.5mm ■ Contributes to the automation of manual soldering and reduction of cycle time ■ Minimal consumables, low maintenance, and low running costs ■ Rapid heating with high output even in hard-to-heat areas ■ Achieves high-precision and high-speed soldering *For more details, please refer to the PDF document. If you would like to request sample processing or a demonstration with a demo unit, please contact us through the inquiry form.

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