ユー・エイチ・システム List of Products and Services

Our company offers a 3D X-ray CT system that employs our unique technology, the "U-Centric Mechanism," enabling easy and efficient observation at high magnification. In diagonal CT imaging, bringing the target area closer to the X-ray focus allows for high-magnification tomographic imaging. This enables detailed observation and strongly supports the discovery and analysis of defects in printed circuit boards and semiconductor devices. 【Features】 ◎ 'XVA-160RA' ■ A newly revamped model based on the standard model, compatible with high-resolution generators ■ Equipped with a nano-focus X-ray generator (focus size 250/800nm) ■ Allows for clear observation of details at a magnification of 1,600 times ■ Includes visible light mapping function and automatic focus adjustment function ◎ 'XVA-160αII "Z"' ■ A high-end model specialized for even higher magnification, capable of analyzing the internal structure of packages ■ Equipped with a nano-focus X-ray generator (focus size 200nm and above) ■ Allows for precise observation of detailed structures at a magnification of 2,000 times ■ Includes a high-resolution top table, automatic adjustment functions for optical axis, rotation center, and focus ★ Our company will exhibit at "Electrotest Japan," held at Tokyo Big Sight from January 22 (Wednesday).

• Non-destructive testing

The "XVA-160αII 'Z'" is a nano-focus X-ray CT system used in applications such as non-destructive testing and material analysis. This system is an ultra-high-resolution model that achieves ultra-high magnification (2000 times) and nano-order sizes (250/800nm). The patterns of each internal layer are captured clearly. The condition of the fillet and the mounting state are also visible in a way unique to CT imaging.

• Non-destructive testing

The "XVA-160RZ" is a micro-focus X-ray CT system used in applications such as non-destructive testing and material analysis. This system can visualize fine internal structures with high resolution. Additionally, you can choose between a high-resolution type and a wide-field type. This time, we will introduce shooting examples of the micro-focus X-ray CT system "XVA-160RZ"! On a separate page, we have published the first-generation smartphone. Changes in the internal structure can be observed comparatively.

• Non-destructive testing

The "XVA-160RZ" is a micro-focus X-ray CT system used in applications such as non-destructive testing and material analysis. This system can visualize fine internal structures with high resolution. Additionally, you can choose between a high-resolution type and a wide-field type. This time, we will introduce a case study of the micro-focus X-ray CT system "XVA-160RZ"!

• Non-destructive testing

This is an example of a heated tobacco product captured through transmission imaging. It allows for understanding the internal substrate condition and structure. The XVA-160RZ can perform orthogonal CT imaging easily by simply attaching a dedicated unit without changing the stage. Similar to oblique CT, orthogonal CT can also be captured at high magnification.

• Non-destructive testing

This is a case of a conductive polymer aluminum solid electrolytic capacitor imaged using transmission imaging and oblique CT scanning. It allows for the confirmation of internal structures and observation of solder conditions. The XVA-160RZ is a standard model that can widely observe various defects in a diverse range of workpieces. Additionally, it is a device that can contribute to the efficiency of analysis, as it can perform CT scanning in just three and a half minutes.

• Non-destructive testing

This is an example of a QFP (Quad Flat Package) captured using orthogonal CT. It is possible to closely observe even the indentations from the second bonding of the wires. The XVA-160RZ allows for easy orthogonal CT imaging simply by attaching a dedicated unit without the need to change the stage. Similar to oblique CT, orthogonal CT can also be performed at high magnification.

• Non-destructive testing

Our in-house developed software "Jasper" is a multi-device control software that can accommodate various light sources and cameras. Patterns, voids, and wire imprints that were not visible before filter processing can now be clearly seen due to the filter treatment. It can be used not only for post-processing of captured images but also during live observation, contributing to a reduction in labor costs. #Xray #ObliqueCT #Transmission #NonDestructive #OrthogonalCT #Crack #Defect #Void #ForeignObject #Wire #Bonding #Substrate #Semiconductor

• Non-destructive testing

This is an example of a QFP (Quad Flat Package) captured using orthogonal CT. It allows for detailed observation of the internal chip patterns. The XVA-160RZ enables easy orthogonal CT imaging simply by attaching a dedicated unit without the need to change the stage. Similar to oblique CT, orthogonal CT can also be performed at high magnification.

• Non-destructive testing

This is an example of a FET (Field Effect Transistor) captured using 3D oblique CT. In fluoroscopy, it is difficult to distinguish the voids in each layer because the solder at the mounting part overlaps with the solder under the chip. Therefore, by performing CT imaging, it becomes possible to observe the sections separately, as shown in the attached materials. The XVA-160RZ allows for specifying the imaging area during the fluoroscopic observation phase through its user-centric function, enabling a transition to 3D oblique CT imaging without removing the sample, which also contributes to reducing labor costs.

• Non-destructive testing

The XVA-160RZ is a versatile 3D X-ray CT system that can be used for quality assurance, failure analysis, and inspection of semiconductors, electronic components, and electronic modules. By utilizing functions such as real-time observation, 3D oblique CT, and orthogonal CT according to the application, it not only facilitates efficient analysis work but also dramatically improves the success rate of analyses. Additionally, by using the standard program operation function, it can also be employed for product sorting and sampling inspection purposes.

• Non-destructive testing

The "XVA-160RZ" is a micro-focus X-ray CT system used in applications such as non-destructive testing and material analysis. This system can visualize fine internal structures with high resolution. Additionally, users can choose between a high-resolution type and a wide-field type. This time, we would like to introduce a case study of the micro-focus X-ray CT system "XVA-160RZ"! It is a case where a CT scan of a smartphone-mounted CPU was performed. 【Details】 ■ Industry of the company that introduced the system Semiconductor, electronic components, and electronic equipment manufacturing ■ Purpose of introduction Quality assurance, failure analysis ■ Effects of introduction Increased productivity due to improved success rate of failure analysis tasks Improved yield due to faster identification of defect causes *For more details, please check the PDF download.

• Non-destructive testing

The micro-focus X-ray CT system 'XVA-160RZ' is an X-ray CT system that can visualize high-resolution fine internal structures used in applications such as non-destructive testing and material analysis. You can choose between a high-resolution type and a wide-field type. This time, we will introduce a case study of the micro-focus X-ray CT system 'XVA-160RZ'! It is a case where a cross-section of solder cracks inside a semiconductor was captured. 【Details】 ■ Industry of the company that introduced the system Semiconductor, electronic components, and electronic equipment manufacturing ■ Purpose of introduction Quality assurance, failure analysis ■ Effects of introduction Increased productivity due to improved success rate of failure analysis Improved yield due to faster identification of defect causes *For more details, please check the PDF download.

• Non-destructive testing

The "3DCT Series" is a three-dimensional X-ray CT system that utilizes our unique technology, the U-Centric (focus-centered rotation) function, allowing for 360-degree perspective observation and high-magnification CT imaging of the focused point with "microscopic vision" and even "nanoscopic vision." We offer a lineup that includes the ultra-high-resolution model "XVA-160αII," which achieves ultra-high magnification (2,000 times) and a nano-order focus size (250/800nm), as well as the standard model "XVA-160R" and the wide-range model "Si-230/300." These systems are widely adopted for the non-destructive analysis of compact, high-density, and multi-layered high-function electronic components with high precision. 【Features of "XVA-160αII 'Z'】 This ultra-high-resolution model achieves ultra-high magnification (2,000 times) and nano-order size (250/800nm). There are imaging examples such as transmission images and tomographic images of fingerprint sensors, as well as tomographic images of electromigration. It is equipped with numerous features, including the U-Centric function, optical axis, rotation center, and automatic focus adjustment functions. *For more details, please refer to the PDF materials or feel free to contact us.*

• Non-destructive testing