This is a case of wire bonding imaged using the "NanoFocus X-ray CT System XVA-160αII 'Z'."
This is an example of an image taken with oblique CT of microSD wire bonding. The wire bonding can be clearly observed. The "XVA-160αII 'Z'" is a nano-focus X-ray CT system used in applications such as non-destructive testing and material analysis. This system is a super high-resolution model that achieves ultra-high magnification (2,000 times) and nano-order sizes (250/800nm).
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basic information
The XVA-160αII "Z" is a three-dimensional X-ray CT system capable of high-resolution angled CT imaging for quality assurance, failure analysis, and inspection applications in semiconductors, electronic components, and electronic modules. By utilizing functions such as fluoroscopic observation, three-dimensional angled CT, and orthogonal CT according to the application, it not only facilitates efficient analysis operations but also dramatically improves the success rate of analyses. Additionally, by using the standard program operation function, it can also be employed for product sorting and sampling inspection purposes.
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Applications/Examples of results
The XVA series has been our best-selling model since its launch in 2000, widely adopted by major domestic semiconductor manufacturers, electronic component manufacturers, and EMS manufacturers. By adding orthogonal CT functionality to our core technologies, the user-centric function*1 and 3D oblique CT function, it has become versatile for a wide range of applications. #X-ray #oblique CT #transmission #non-destructive #orthogonal CT #crack #defect #void #foreign matter #solder *1 User-centric function A feature that automatically follows the point of interest when performing operations such as detector tilt, stage rotation, and magnification changes during fluoroscopic observation. This is our patented technology.
Company information
Our company develops and manufactures non-destructive testing equipment centered around advanced X-ray devices, high-precision stages, and image processing technology. The XVA series, which utilizes a user-centric stage capable of rotational observation around any focal point, accurately meets the needs of customers seeking advanced quality assurance in manufacturing lines and implementation analysis at the nano level. Additionally, we support research, development, and manufacturing across a wide range of fields, including not only the inspection of printed circuit board soldering implementations but also semiconductor products, various electronic devices, automotive components and related industries, materials, composite materials, and medical-related applications.
![[UHS_X-ray CT System Imaging Case] CT Cross-section of Solder Crack](https://image.www.ipros.com/public/product/image/6d2/2000883569/IPROS72480323222804342145.jpeg?w=280&h=280)
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