[UHS_X-ray CT System Imaging Case] CT Cross-section of Solder Crack
XVA-160RZ Microfocus X-ray CT System
This is a case where a micro-focus X-ray CT system XVA-160RZ was used to perform CT imaging of an interposer substrate, detecting solder cracks.
The XVA-160RZ is a versatile 3D X-ray CT system that can be used for quality assurance, failure analysis, and inspection of semiconductors, electronic components, and electronic modules. By utilizing functions such as real-time observation, 3D oblique CT, and orthogonal CT according to the application, it not only facilitates efficient analysis work but also dramatically improves the success rate of analyses. Additionally, by using the standard program operation function, it can also be employed for product sorting and sampling inspection purposes.
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basic information
This is a case where the solder bumps of a CPU mounted on a smartphone's circuit board were captured using 3D oblique CT. By performing CT imaging, we were able to detect solder cracks that could not be found through visual observation. The CT imaging was conducted with the circuit board removed from the smartphone. The underside of the CPU is populated with countless chip components, and the CPU itself has a three-dimensional structure, making non-destructive analysis generally very difficult. The XVA-160RZ allows for the specification of the imaging area during the visual observation phase through its user-centric function, enabling a transition to 3D oblique CT imaging without removing the sample, thus ensuring that no observation areas are missed even in complex structures like a smartphone's circuit board.
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The XVA series has been our best-selling model since its launch in 2000, widely adopted by major domestic semiconductor manufacturers, electronic component manufacturers, and EMS manufacturers. By adding orthogonal CT functionality to our core technologies, the user-centric function*1 and 3D oblique CT function, it has become versatile for a wide range of applications. #X-ray #oblique CT #transmission #non-destructive #orthogonal CT #crack #defect #void #foreign object #solder *1 User-centric function A feature that automatically follows the point of interest when performing operations such as detector tilt, stage rotation, and magnification changes during fluoroscopic observation. This is our patented technology.
Company information
Our company develops and manufactures non-destructive testing equipment centered around advanced X-ray devices, high-precision stages, and image processing technology. The XVA series, which utilizes a user-centric stage capable of rotational observation around any focal point, accurately meets the needs of customers seeking advanced quality assurance in manufacturing lines and implementation analysis at the nano level. Additionally, we support research, development, and manufacturing across a wide range of fields, including not only the inspection of printed circuit board soldering implementations but also semiconductor products, various electronic devices, automotive components and related industries, materials, composite materials, and medical-related applications.
![[UHS_X-ray CT System Imaging Case] Smartphone (2018)](https://image.www.ipros.com/public/product/image/441/2000978034/IPROS51671232964310511760.jpeg?w=280&h=280)
![[UHS_X-ray CT System Imaging Example] Smartphone Internal Circuit Board](https://image.www.ipros.com/public/product/image/02e/2000999324/IPROS78601748669565101722.jpeg?w=280&h=280)