This is a case of CT imaging of a smartphone's internal circuit board. It is possible to observe the patterns and structures of each internal layer.
The "XVA-160αII 'Z'" is a nano-focus X-ray CT system used in applications such as non-destructive testing and material analysis. This system is an ultra-high-resolution model that achieves ultra-high magnification (2000 times) and nano-order sizes (250/800nm). The patterns of each internal layer are captured clearly. The condition of the fillet and the mounting state are also visible in a way unique to CT imaging.
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basic information
The XVA-160αII "Z" is a three-dimensional X-ray CT system capable of high-resolution angled CT imaging for quality assurance, failure analysis, and inspection applications in semiconductors, electronic components, and electronic modules. By utilizing functions such as fluoroscopic observation, three-dimensional angled CT, and orthogonal CT according to the application, it not only efficiently advances analysis tasks but also dramatically improves the success rate of analyses. Additionally, by using the standard program operation function, it can also be employed for product sorting and sampling inspection purposes.
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Applications/Examples of results
The XVA series has been our best-selling model since its launch in 2000, widely adopted by major domestic semiconductor manufacturers, electronic component manufacturers, and EMS manufacturers. By adding orthogonal CT functionality to our core technologies, the user-centric function*1 and 3D oblique CT function, it has become versatile for a wide range of applications. #X-ray #oblique CT #transmission #non-destructive #orthogonal CT #crack #defect #void #foreign matter #solder *1 User-centric function A feature that automatically follows the point of interest when performing operations such as detector tilt, stage rotation, and magnification changes during fluoroscopic observation. This is our patented technology.
Company information
Our company develops and manufactures non-destructive testing equipment centered around advanced X-ray devices, high-precision stages, and image processing technology. The XVA series, which utilizes a user-centric stage capable of rotational observation around any focal point, accurately meets the needs of customers seeking advanced quality assurance in manufacturing lines and implementation analysis at the nano level. Additionally, we support research, development, and manufacturing across a wide range of fields, including not only the inspection of printed circuit board soldering implementations but also semiconductor products, various electronic devices, automotive components and related industries, materials, composite materials, and medical-related applications.
![[UHS_X-ray CT System Imaging Case] CT Cross-section of Solder Crack](https://image.www.ipros.com/public/product/image/6d2/2000883569/IPROS72480323222804342145.jpeg?w=280&h=280)
![[UHS_X-ray CT System Imaging Case] Smartphone (2018)](https://image.www.ipros.com/public/product/image/441/2000978034/IPROS51671232964310511760.jpeg?w=280&h=280)