ミクロ技研 List of Products and Services

"CIRCULA" is a suction-type hand dryer that minimizes the scattering of water droplets and bacteria. It suppresses 99.9% of collected bacteria using a HEPA filter combined with the effect of copper ions. The blown air is suctioned back in, preventing water droplets from scattering and allowing for circulation. Additionally, it is equipped with a powerful and quiet motor made by Nidec. 【Features】 ■ Minimizes the scattering of water droplets and bacteria through suction ■ Hygienic with a combination of HEPA filter and copper fibers ■ Equipped with a powerful and quiet motor made by Nidec ■ Uses antibacterial material from Teijin in the main unit *For more details, please refer to the PDF document or feel free to contact us.

• Bathroom, shower, washbasin and toilet equipment

The "CMG-802XJ" is a fully automated wafer grinding and polishing composite device that arranges four vacuum chucks on a indexing table and processes in sequence through chuck surface cleaning, rough grinding, finishing grinding, and polishing using a rotary transfer type. It was newly developed in response to the high-precision downsizing demands of various IC cards and SiP products. With an integrated mechanism with the MDS (Tape Mounting and Peeling Device), it can provide a total solution for damage-free processing and ultra-thin wafer thickness. 【Features】 ■ Supports 300mm ultra-thin wafers ■ Integrated mechanism with MDS (Tape Mounting and Peeling Device) ■ Provides total solutions for damage-free processing and ultra-thin wafer thickness ■ Capable of grinding 8-inch/12-inch wafers down to a thickness of 30μm ■ Automatically performs chuck surface cleaning, rough grinding, finishing grinding, and polishing all in one machine *For more details, please refer to the PDF document or feel free to contact us.

• Manufacturing Equipment

The "MGP-808XJ" is a fully automatic CMP device that is the successor to the Lap Master SFT's "LGP-808XJ." It adopts a newly developed head from our company, achieving improvements in GBIR and SFQR on the wafer surface. The transport method is either edge clamp or edge contact. Additionally, it allows for dry in/dry out capabilities through integration with a cleaning machine. 【Features】 ■ Successor model to the Lap Master SFT's "LGP-808XJ" ■ Achieves improvements in GBIR and SFQR on the wafer surface ■ High throughput with 8 polishing heads and 3 polishing plates ■ All transport systems utilize either edge clamp or edge contact methods ■ Allows for dry in/dry out capabilities through integration with a cleaning machine *For more details, please refer to the PDF document or feel free to contact us.

• Manufacturing Equipment

Micron Technology Co., Ltd. is engaged in the development, manufacturing, and sales of various electronic materials such as silicon wafers, FPD panels, and films, as well as automatic inspection equipment. With core technologies in cleaning, grinding and polishing, roll-to-roll (RtoR), coating, chemical processing, and printing, we support our customers in solving their challenges through a wide range of product offerings. In the future, we will establish new core technologies such as appearance inspection technology, factory automation (FA) technology, and environmental technologies represented by ultra-fine bubbles, and we are advancing further improvements in our technical capabilities and product development. 【Business Objectives】 ■ Development, manufacturing, and sales of manufacturing equipment for various electronic materials (silicon wafers, FPD panels, films, etc.) ■ Development, manufacturing, and sales of automatic inspection equipment *For more details, please download the PDF or contact us.

• Manufacturing Equipment