It performs chuck surface cleaning, rough grinding, finishing grinding, and polishing fully automatically with one machine!
The "CMG-802XJ" is a fully automated wafer grinding and polishing composite device that arranges four vacuum chucks on a indexing table and processes in sequence through chuck surface cleaning, rough grinding, finishing grinding, and polishing using a rotary transfer type. It was newly developed in response to the high-precision downsizing demands of various IC cards and SiP products. With an integrated mechanism with the MDS (Tape Mounting and Peeling Device), it can provide a total solution for damage-free processing and ultra-thin wafer thickness. 【Features】 ■ Supports 300mm ultra-thin wafers ■ Integrated mechanism with MDS (Tape Mounting and Peeling Device) ■ Provides total solutions for damage-free processing and ultra-thin wafer thickness ■ Capable of grinding 8-inch/12-inch wafers down to a thickness of 30μm ■ Automatically performs chuck surface cleaning, rough grinding, finishing grinding, and polishing all in one machine *For more details, please refer to the PDF document or feel free to contact us.
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Micron Technology Co., Ltd. has been engaged in the manufacturing and sales of manufacturing equipment for electronic components and chemical products that support science and technology since its establishment. Moving forward, we aim to continue refining new technologies through collaboration among industry, academia, and government, with a focus on the environment, creating new value, leveraging our overseas networks, promoting global standards, and contributing, even in a small way, to the improvement of living culture.
