株式会社三ツ矢 List of Products and Services

Scintillators are essential for CT devices, converting high-energy rays such as X-rays from the radiation source into visible light that can be detected by the detector. We are developing a composite scintillator with a ZnO nanowire guiding layer and an emission layer that can achieve high spatial and temporal resolution as a next-generation scintillator material.

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Tin is a relatively soft metal, which makes it widely used as a material for cans for food and beverages due to its role in improving the familiarity of sliding parts in machinery and protecting iron sacrificially against organic acids contained in food. It has excellent solderability and is also used in functional plating for automotive parts, electronic components, and contacts. It serves as a cost-effective alternative to expensive gold plating and is used in various applications as a long-term reliable plating film.

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It was developed as a light-absorbing film for optical devices. The film is more resistant to scratches than ultra-low-reflection black coatings and is less likely to leave marks even when rubbed with a cotton swab. Black arrow significantly improved the issue of marks appearing during handling processes after treatment. (Note: It is not intended for use on exterior components as it cannot withstand strong friction.) Additionally, it can be applied to most metals (such as iron and copper).

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■Gold-Tin Alloy Plating Gold-tin alloy plating is an optimal alloy plating for high-temperature lead-free solder materials, with a melting point of 280°C, achieved through an 80% gold and 20% tin eutectic composition. ■Tin-Antimony Alloy Plating Compared to regular tin plating, it excels in preventing tin pest and has superior heat cycle durability. ■Indium Plating Indium has a very soft, dull white appearance and is prone to scratching. Its hardness is below Hv5, and its melting point is 156.6°C. It has a proven track record in preventing contact failure as a joining tool for bundling vessels.

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By converting environmentally concerning substances such as cobalt and nickel into iron, which is a non-environmentally harmful iron group element, it can be expected to serve as an environmentally friendly alternative plating.

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This is a black coating developed for UV absorption for JAXA. It has already been mounted on and used in space observation satellites. The coating is fragile, so care is needed during handling.

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This is a black nickel-based alloy plating that is widely used in various fields, including automotive and motorcycle parts, as well as in optical devices such as cameras and anti-reflective applications that dislike light. Our company offers both electrolytic and electroless options. ■ Black Electrolytic Nickel Plating The appearance is a metallic black, and the shade of black varies depending on the material and the gloss of the substrate. The corrosion resistance is not very high, and it does not possess the flexibility typical of regular metals. Typically, black nickel plating is applied over nickel plating. ■ Black Electroless Nickel Plating This process yields a black coating through electroless nickel plating. There are two types: the "deposition type," which deposits the black coating, and the "post-treatment type," which darkens the surface after plating. For more details, please feel free to contact us.

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It is often used as a light-absorbing film for optical devices, excelling in anti-reflective and light-absorbing properties. It is characterized by a low reflectance. Due to the softness of the film, its appearance can change with handling, so care is needed during post-plating handling. 【Features】 ■ Excellent anti-reflective properties ■ Excellent light-absorbing properties

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This is an acidic copper plating used for circuit boards, silicon wafers, etc. (with gloss agent) ■ Platable wafer materials: GaAs, Si, etc. ■ Platable electrode materials: Seed layers of Cu, Au, etc. ■ Mass production wafer sizes: 3 inches, 4 inches ■ Mass production capacity: 1,000 wafers/month ■ Prototype wafer sizes: 3, 4, 8 inches ■ Types of plating: Electrodeposited copper plating, electrolytic and electroless nickel plating, electrolytic and electroless gold plating, electrolytic and electroless palladium plating, electrolytic and electroless tin plating Our achievements: Mounting components for smartphones We will provide proposals that meet your requirements. Please feel free to contact us with any inquiries, no matter how trivial.

• Mobile phones and smartphones
• Tablet PC
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Titanium has a specific gravity between that of iron and aluminum, and is a high-strength, lightweight, non-magnetic metal. Titanium has high corrosion resistance due to the formation of a stable oxide film on its surface, but this oxide film tends to result in a high contact resistance. While it excels in corrosion resistance, it has some weaknesses in wear resistance. 【Features】 - It is possible to apply a coating that adheres well to titanium materials without using heat treatment. - It supports various types of plating, not only precious metal plating but also using a nickel base. - By applying copper or nickel plating, functions such as electrical conductivity and wear resistance can be imparted to titanium materials. - To ensure adhesion without using heat treatment, post-processing using an electric furnace after plating is unnecessary.

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Indium is characterized by its soft material, low melting point, good water resistance, and good alkali resistance. Our indium plating comes in two types: inorganic acid bath and organic acid bath. Both are white, matte, with a hardness of Hv5 or lower, and a melting point within the range of 156.6±1°C.

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Cobalt-nickel alloy plating has good mechanical properties, durability, and heat resistance. [Composition ratio] Co 70wt%: Ni 30wt% each ±5wt% [Film thickness] ~3μm In examples where plating was applied to components of solid oxide fuel cells (SOFC), when used at high temperatures around 800°C, the resistance of typical metal components tends to increase. However, by applying cobalt-nickel alloy plating compared to untreated or nickel-plated components, a lower resistance value can be maintained.

• Fuel Cells
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Among glossy metals, silver plating is considered to have good reflection across a wide range of wavelengths. However, silver plating tarnishes quickly in the air. To solve this problem, Mitsuya developed high-reflective gold plating. Compared to our conventional gold plating, the reflectivity has improved by 4-6%. High-reflective gold plating is widely used in various applications, such as: - Marking on wafers during semiconductor manufacturing processes - Pulse laser welding - Laser cutting machines Astronaut Koichi Wakata conducted experiments to create alloys using an imaging furnace installed on NASA's Space Shuttle. The reflective mirror of this imaging furnace uses the high-reflective gold plating developed by Mitsuya. This mirror is the most critical component for the imaging furnace.

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**[Previous Issues]** In conventional tin plating, it has been difficult to maximize the characteristics of both the press-fit and soldering areas, and the issue of tin shavings after secondary processing has been a concern. **[Effects]** - Plating of varying thicknesses has become possible. - By reducing the thickness of the film on the press-fit area, we can suppress tin shavings during insertion, while increasing the thickness of the soldering area helps maintain solderability. - When secondary processing is performed, exposing the underlying nickel in the bent area significantly reduces the occurrence of tin shavings. - By conducting reflow treatment, we suppress the occurrence of whiskers. Additionally, by performing it at an optimal temperature specified by the customer, we can prevent the formation of wrinkles and rough surfaces in the plating film. Please feel free to contact us with any questions, no matter how trivial!

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Gold-tin alloy plating shows a eutectic point with a composition of gold 80: tin 20, and a melting point of 280°C. 【Points】 - Gold-tin alloy plating does not subject the wafer to high temperatures during the process, preventing thermal degradation. - It can accommodate control of film thickness, allowing for thin film formation (with a proven cost reduction of 33%). - The alloy ratio can be changed arbitrarily, resulting in a wide range of coating compositions (with proven results of Au 70-90 wt%). - Plating on fine patterns is possible. - It has good oxidation resistance and solderability, enabling high-reliability bonding. - There are few voids and impurities, and since no flux is needed, cleaning after reflow is unnecessary. We welcome any questions or consultations. Please feel free to contact us.

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"Au/Au alloy plating" is a material for electronic components that is chemically very stable and has excellent corrosion resistance and electrical conductivity. When used as an electrical contact material, a hard Au alloy plating with additives such as Co, Ni, and Fe is employed. Hard Au plating using Fe is used as an environmentally friendly hard Au plating that does not use allergenic substances. 【Features】 ■ Chemically very stable ■ Excellent corrosion resistance ■ Excellent electrical conductivity *For more details, please refer to the PDF document or feel free to contact us.

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Hard silver plating is a product developed for the charging terminal applications of electric vehicles (EVs) and plug-in hybrid electric vehicles (PHEVs). Compared to conventional silver plating hardness of Hv80-110, it has a high hardness of about Hv155 (+15 -5), and excels in sliding properties and wear resistance. In particular, it is possible to reduce the thickness of the coating with hard silver plating in areas where conventional silver plating was previously applied as a thick film. Compared to silver plating, it tends to have lower friction, and the contact resistance value remains stable even with a high number of insertions and removals. 【Features】 ■ Excellent sliding properties and wear resistance ■ High hardness of about Hv155 ■ Ability to reduce thickness in areas previously addressed with thick conventional silver plating ■ Expected to be applied to connectors for industrial equipment requiring insertion and removal *For more details, please refer to the PDF document or feel free to contact us.

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With the advancement of high technology in devices that are sensitive to magnetism, the density and performance of measuring and analytical instruments are improving. As a result, there is a growing demand for non-magnetic properties not only in the main functional components but also in connectors and contact parts that were previously overlooked. Additionally, with the economic growth of emerging countries, the introduction of the aforementioned measuring and analytical instruments is progressing. However, due to the high cost of the equipment itself, the frequency of updates is much slower than in developed countries, and a longer lifespan is desired. Therefore, we have developed a non-magnetic coating that enhances the longevity of insertion and removal cycles and reduces contact resistance, improving the specifications as outlined below: - Maintains low contact resistance even after 60,000 sliding tests - Solder wetting properties and contact resistance are equivalent to conventional products! - Non-magnetic just like conventional products! *For more details, please download the catalog or contact us.

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