From prototype to mass production! We accept plating for various types of wafers!
This is an acidic copper plating used for circuit boards, silicon wafers, etc. (with gloss agent) ■ Platable wafer materials: GaAs, Si, etc. ■ Platable electrode materials: Seed layers of Cu, Au, etc. ■ Mass production wafer sizes: 3 inches, 4 inches ■ Mass production capacity: 1,000 wafers/month ■ Prototype wafer sizes: 3, 4, 8 inches ■ Types of plating: Electrodeposited copper plating, electrolytic and electroless nickel plating, electrolytic and electroless gold plating, electrolytic and electroless palladium plating, electrolytic and electroless tin plating Our achievements: Mounting components for smartphones We will provide proposals that meet your requirements. Please feel free to contact us with any inquiries, no matter how trivial.
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This is an acidic copper plating used for circuit boards, silicon wafers, etc. (with gloss agent). Please refer to the PDF for details.
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Our achievements: Implementation components for smartphones
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Mitsuya is a company that specializes in metal surface treatment and plating, founded in 1931. We focus not only on general plating but also on plating for difficult materials, offering around 90 types of plating solutions. Currently, plating has become an essential part of advanced technologies such as IT, electronic devices, ubiquitous computing, next-generation energy, next-generation motorization, and environmental technology. In this context, Mitsuya Co., Ltd. responds to customer needs with a spirit of "let's give it a try" to meet stringent requirements, earning a reputation for being the go-to solution provider, especially among electronic and electrical equipment manufacturers and automotive and transportation equipment manufacturers. We will propose the most suitable plating technology based on your consultation needs. We also accommodate small-scale prototypes starting from just one piece, so please feel free to contact us for any inquiries, no matter how trivial.