In the first process, it is possible to have a thickness difference in Sn plating (reel to reel)! The amount of tin shavings during insertion and secondary pressing can be significantly reduced!
**[Previous Issues]** In conventional tin plating, it has been difficult to maximize the characteristics of both the press-fit and soldering areas, and the issue of tin shavings after secondary processing has been a concern. **[Effects]** - Plating of varying thicknesses has become possible. - By reducing the thickness of the film on the press-fit area, we can suppress tin shavings during insertion, while increasing the thickness of the soldering area helps maintain solderability. - When secondary processing is performed, exposing the underlying nickel in the bent area significantly reduces the occurrence of tin shavings. - By conducting reflow treatment, we suppress the occurrence of whiskers. Additionally, by performing it at an optimal temperature specified by the customer, we can prevent the formation of wrinkles and rough surfaces in the plating film. Please feel free to contact us with any questions, no matter how trivial!
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basic information
Differential thickness Sn reflow hoop plating is a plating process that allows for the differentiation of the thickness of the tin plating between thicker and thinner areas. Since tin plating is prone to whisker formation, it is often subjected to reflow treatment after plating. This reflow treatment helps suppress the occurrence of whiskers. Mitsuya's reflow line enables the thickness of the plating at the press-fit area and the soldering area to be varied by processing the tin plating twice, thereby allowing each characteristic to be utilized effectively. In the case of full tin plating, there may be instances where tin shavings adhere to the mold during secondary processing after plating. However, Mitsuya's differential thickness Sn reflow hoop plating has made it possible to expose the underlying nickel in the areas that contact the mold, preventing the adhesion of shavings. *The underlying layer is fully nickel-plated. *If there is bending involved, separate consultation is required.
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Applications/Examples of results
【Application】Automobiles - IGBT, electronic components, electrical and electronic - busbars, etc. 【Issues that can be addressed】Whisker generation countermeasures, good soldering and good joint quality.
Detailed information
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New method: Differential thickness Sn reflow hoop plating
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Conventional: Sn full plating
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Company information
Mitsuya is a company that specializes in metal surface treatment and plating, founded in 1931. We focus not only on general plating but also on plating for difficult materials, offering around 90 types of plating solutions. Currently, plating has become an essential part of advanced technologies such as IT, electronic devices, ubiquitous computing, next-generation energy, next-generation motorization, and environmental technology. In this context, Mitsuya Co., Ltd. responds to customer needs with a spirit of "let's give it a try" to meet stringent requirements, earning a reputation for being the go-to solution provider, especially among electronic and electrical equipment manufacturers and automotive and transportation equipment manufacturers. We will propose the most suitable plating technology based on your consultation needs. We also accommodate small-scale prototypes starting from just one piece, so please feel free to contact us for any inquiries, no matter how trivial.