substrate Product List and Ranking from 22 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. 三和電子サーキット Osaka//others
  2. サクサテクノ Tokyo//Building materials, supplies and fixtures manufacturers
  3. null/null
  4. 4 カネテック 東日本営業部　東京営業所 Tokyo//Building materials, supplies and fixtures manufacturers
  5. 5 モリシン工業 本社 Gifu//Building materials, supplies and fixtures manufacturers
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substrate Product ranking

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. Piezoelectric Buzzer (DC) 'ESZ-25C/ESZ-26B' サクサテクノ
  2. [Case Study 3] High-Precision Porous Ceramic Vacuum Chuck
  3. Auto Valve Type Vacuum Chuck 'KVR-AV' カネテック 東日本営業部　東京営業所
  4. End face electrode substrate "End face through-hole substrate" 三和電子サーキット
  5. 4 End face electrode substrate "Narrow Pitch End Face Through Hole Substrate" 三和電子サーキット

substrate Product List

31～45 item / All 53 items

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[Data] Shirutoku Report No. 13 # Characteristic Impedance

[Data] Shirutoku Report No. 13 # Characteristic Impedance

The concept of distributed constant circuits is becoming necessary! An explanation of characteristic impedance and substrate design.

★★Shirutoku Report: Useful Information You Should Know★★ In this report, we will introduce the "characteristic impedance (wiring impedance)" of printed circuit boards. With the recent increase in the speed of digital signals, the design of digital circuit boards now requires the concept of distributed constant circuits rather than lumped constant circuits, making it necessary to consider the characteristic impedance of the board in the design. So, how do we determine the characteristic impedance of a printed circuit board? [Contents] ■ Characteristic Impedance of Printed Circuit Boards *For more details, please refer to the PDF document or feel free to contact us.*

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Vacuum chuck (made of aluminum honeycomb panel)

Vacuum chuck (made of aluminum honeycomb panel)

By converting conventional vacuum chucks, such as porous types, into aluminum honeycomb panels, significant cost reductions can be achieved!

Morishin's adsorption aluminum honeycomb panels have a simpler structure compared to conventional adsorption panels (such as porous or cast products), and they allow for cost reduction through lightweight materials, making them a very popular product. We can manufacture a wide range of sizes from approximately 100mm x 100mm to about 2000mm x 4000mm, and it is also possible to set multiple adsorption areas on a single adsorption panel. We can accommodate everything from custom-made products starting from one piece to mass-produced items, so please feel free to contact us. For requests for quotes, inquiries about products, or to request catalogs, case studies, or cut samples, please visit our website (http://www.morishin.com/). You can view the PDF data of the case studies from the "Download" section.

  • Aluminum alloy door

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High-speed signal, high-density substrate 'IVH substrate'

High-speed signal, high-density substrate 'IVH substrate'

Supports IVH substrates from 4 layers to 20 layers! Component mounting on the surface of the IVH section is also possible.

We would like to introduce our high-speed signal and high-density substrate, the "IVH substrate." By using the IVH structure, we can achieve high density tailored to our customers' needs. Additionally, we can accommodate low dielectric materials for high-frequency applications. Please feel free to consult us when needed. 【Features】 ■ Supports IVH substrates from 4 layers to 20 layers ■ High density tailored to customer needs ■ Component mounting on the surface of the IVH part is possible, compatible with chip-on-hole ■ Impedance control is possible ■ Can accommodate low dielectric materials for high-frequency applications *For more details, please refer to the PDF document or feel free to contact us.

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Bonded substrate

Bonded substrate

Miniaturization of devices, heat dissipation applications, and printed circuit boards tailored to individual product implementations!

Our company is capable of providing printed circuit boards with special structures tailored to your requirements, thanks to our unique three-layer substrates and the bonding structures of materials and copper foil. Applications include device substrates and substrates with bonded structures of metals (such as copper foil and aluminum) or materials. Printed circuit boards for devices require structures that accommodate miniaturization, heat dissipation, and the specific implementation needs of individual products. 【Applications】 ■ Device substrates ■ Substrates with bonded structures of metals (such as copper foil and aluminum) or materials *For more details, please refer to the PDF document or feel free to contact us.

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End face electrode substrate "End face through-hole substrate"

End face electrode substrate "End face through-hole substrate"

Cutting the through holes at the edge of the substrate with contour processing! Suitable for mounting holes and power supply units, etc.

The "end face through-hole substrate" is created by cutting the through-holes at the edge of the substrate using contour processing. In conventional end face through-holes, copper burrs were generated during cutting, but thanks to our unique process, we can provide end face through-holes without burrs even with router processing. Please feel free to contact us when you need our services. 【Applications】 ■ Mounting holes ■ Power supply units ■ Converter substrates ■ Module substrates, etc. *For more details, please refer to the PDF materials or feel free to contact us.

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End face electrode substrate "Narrow Pitch End Face Through Hole Substrate"

End face electrode substrate "Narrow Pitch End Face Through Hole Substrate"

We can also accommodate a pitch of 0.6mm and a hole diameter of φ0.15mm! We provide through holes with burr-free end faces.

We would like to introduce our "Narrow Pitch Edge Through-Hole Board." Thanks to our unique process, we can form edge through-holes with a narrow pitch. We can provide edge through-holes without burrs, regardless of the cutting method used, even for copper burrs generated during cutting. 【Applications】 ■ Mounting holes ■ Power supply units ■ Converter boards ■ Module boards, etc. *For more details, please refer to the PDF document or feel free to contact us.

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End face electrode substrate "Partial etching through-hole substrate"

End face electrode substrate "Partial etching through-hole substrate"

Only the copper in the cut section of the through hole is removed by etching! We can accommodate board thicknesses from 0.04 to 0.3 mm.

We would like to introduce our "Partial Etching Through-Hole Substrate." In printed circuit boards used as substrate for devices, after component mounting, through-holes may be diced and used as soldering electrodes. However, cutting the copper plating of the through-holes inevitably leads to burr formation. Our company enables the production of cut through-hole substrates without burrs by selectively etching away only the copper at the cut portions of the through-holes. [Applications] ■ Substrate boards for devices with through-hole electrodes, etc. *For more details, please refer to the PDF document or feel free to contact us.

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CAD design and prototype implementation

CAD design and prototype implementation

We provide support from CAD design of printed circuit boards and various analyses to prototype implementation.

We would like to introduce our "Pattern Design (CAD Design) and Prototype Implementation." By conducting transmission line analysis, it is possible to implement countermeasures from the design stage. Additionally, "Prototype Implementation" allows for the direct output of the bill of materials from CAD, enabling the arrangement of components and other tasks in parallel with PCB design and manufacturing, thereby reducing the total lead time. 【CAD Software】 Zuken: CR-8000/Design Force, CR-5000/Board Designer, CR-5000/PWS Cadence: Allegro X Designer, OrCAD(R) PCB Designer Professional 【Analysis Software Used】 ■ SI Analysis - Siemens: Hyper Lynx SI - Cadence: Allegro PCB SI ■ EMI Countermeasures and PI Analysis - NEC: DEMITASNX *For more details, please refer to the PDF document or feel free to contact us.

  • Drawing, tracing, CAD

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[Thin Plate Bending Circuit Board] A substrate with a thickness of 0.1mm or less can be used by bending!

[Thin Plate Bending Circuit Board] A substrate with a thickness of 0.1mm or less can be used by bending!

Using FR-4 material with a thickness of 0.1mm or less, it can be bent and used like a flexible circuit board. Initial costs can be addressed at a low price.

Our "Thin Plate Bending Circuit Board" uses glass epoxy substrates (FR-4) with a thickness of 0.1mm or less, making it suitable for applications that require several bending actions during bending and assembly. Thanks to router processing, there is no need for coverlay processing molds or outline processing molds. This helps keep initial costs low from prototyping to mass production, allowing for inexpensive product manufacturing. It is suitable for circuit boards that require component mounting and bending, and can be used in industrial equipment, LED lighting, and wearable devices (such as VR headsets and controllers). 【Features】 ■ Ideal for applications that require several bending actions during bending and assembly ■ More cost-effective for products and initial costs compared to flexible circuit boards (compared to our offerings) ■ No need for coverlay processing molds or outline processing molds ■ Capable of handling small to medium production volumes *For more details, please refer to the documentation. Feel free to contact us with any inquiries. *Documentation for special circuit boards other than thin plate bending circuit boards is also available for download.

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Substrate "HIGH POWER LED PWB"

Substrate "HIGH POWER LED PWB"

Covers a wide range from near ultraviolet 360 to 740 nm! Uses light-resistant white ink!

The "HIGH POWER LED PWB" is a product of Shirato Print Wiring Manufacturing Co., Ltd., which engages in the manufacturing of various printed circuit boards, circuit design of printed circuit boards, and assembly of electronic components. It has excellent light resistance, showing no degradation even after 2000 hours of exposure to deep ultraviolet light at 254nm. Due to its inorganic materials, it can withstand temperatures above 350°C. The base material can be selected from aluminum or copper. 【Features】 ■ The COB mounting section has an insulation withstand voltage of 2kV at 80μm ■ White ink with light resistance and reflectivity of over 90% ■ Covers a wide range in the near-ultraviolet region from 360 to 740nm ■ Withstands temperatures above 350°C due to inorganic materials ■ Patent pending *For more details, please request materials or view the PDF data available for download.

  • Safety and consumables

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Precision vice and vacuum chuck

Precision vice and vacuum chuck

A lineup of high-precision finishing ultra-precision machining vices and vacuum generators with built-in pressure reducing valves and check valves!

Super Tool offers "Precision Vices and Vacuum Chucks." We have a wide range of products including high-precision finishing ultra-precision machining vices such as "SPV30H" and "SPV165H," as well as vacuum chucks like "SVA2025" and "SVA2540" that do not require a dedicated vacuum pump. Additionally, the vacuum generator "SVAG12" features an adjustable air pressure type that can be used with the factory's compressor. 【Product Lineup】 ■ Precision Vices - SPV 30H - SPV 80H - SPV120H - SPV165H, etc. *For more details, please refer to the PDF document or feel free to contact us.

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  • Prime movers, torque converters, hydraulic equipment, generators

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Planning/Design

Planning/Design

Japtech will continue to evolve in response to the ever-changing needs of its customers.

Our company actively participates in the development proposals for pachinko machines, which require diverse gameplay and production, as well as in planning and development projects, creating new products with free-thinking ideas. We quickly capture various information and consistently leverage unique ideas and concepts for groundbreaking product development. The design work that produces hit products is carried out in 2D and 3D using advanced computers. *For more details, please feel free to contact us.

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  • Drawing, tracing, CAD

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