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Probe Tester Product List

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Dual Side Flying Probe Tester: APT-1600FD

This is a flagship model that arranges probe heads above and below, enabling simultaneous in-circuit testing of both sides of the substrate.

Four probes are arranged on the top side of the substrate and two on the bottom side. Each probe can move freely and at high speed, achieving an astonishing inspection speed that is world-class in standard. By using the upper and lower flying probes simultaneously, a combination inspection of up to six probes allows for simultaneous contact inspection at both points on the top and bottom sides of the substrate. This significantly expands the inspection range and further accelerates inspection time. It is equipped with a wealth of features and boasts world-class standards in speed and positioning accuracy. ★You can bring your substrate to our demo room at our Okayama headquarters for evaluation testing★ We can conduct a series of tests including the creation of inspection programs, inspections using actual substrates, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below.

  • Measurement and Inspection
  • Probe Tester

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Dual Side Flying Probe Tester APT-1600FD-SL

The probe heads are arranged above and below, allowing for simultaneous in-circuit testing of both sides of the substrate. (Supported substrate size for inspection: up to 985×610)

The simultaneous use of upper and lower flying probes allows for a combination inspection of up to 6 probes, enabling the inspection of components that can make contact at both points on the top and bottom of the substrate. This model boasts world-class standards in speed and positioning accuracy while expanding the compatible substrate size to W635×D610mm. Additionally, by adding an optional split inspection function, it can also inspect long substrates up to W985×D610mm. It can accommodate component heights of up to 60mm and substrate weights of up to 10kg, making it suitable for inspecting substrates used in automotive, aerospace, and medical devices, as well as power boards and probe cards, which are larger and heavier. ★Evaluation tests can be conducted by bringing in substrates to the demo room at our Okayama headquarters★ A complete testing process is possible, including the creation of inspection programs, testing using actual substrates, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below.

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The fastest in-circuit test! What are the features of a flying probe tester?

The Takaya APT series is a board inspection device capable of ultra-fast in-circuit testing at an industry-leading level.

The Takaya APT series is a flying probe in-circuit tester that boasts overwhelming performance with the world's top market share, capable of detecting all defects in assembled boards through ultra-fast inspection. An in-circuit tester is a device that inspects the reliability of electrical connections between components and the board. By applying signals smaller than the operating current, it can identify defective areas and detect incorrect constants without damaging the components or the board. It is characterized by its ability to discover electrical defects that cannot be found through visual inspection (AOI), thereby enhancing quality assurance levels and making it easier to gain customer trust. The latest APT series has achieved a maximum probe movement speed increase of up to 1.5 times compared to previous models, thanks to improvements in high-speed drive motors and communication control, enabling high-speed inspections with a fastest step of 0.02 seconds. This reduces inspection time by more than 30% compared to previous models, contributing to further reductions in inspection costs. We welcome inquiries for trials/tests. If you have any issues with inspecting assembled boards, please feel free to contact us. *For detailed information, please refer to the catalog.*

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  • Probe Tester

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Basic Knowledge of In-Circuit Testing: What is the Difference Between Fixture-Based and Flying Probe Testing?

*Free materials are currently available. A must-see for those who don't know the basics of in-circuit testers, which you can't ask about now!

There are two probing methods for in-circuit testing (electrical inspection of printed circuit boards): fixture-based and flying probe. **Fixture-based** A test fixture with embedded contact probes makes contact with the test board, allowing all probes to simultaneously touch designated test points on the board. In this state, inspections of each electronic component are performed while switching the measurement lines with relays. The boards to be inspected require a program that combines each inspection and the production of a dedicated fixture, which presents challenges in terms of cost, speed, and storage space. **Flying Probe** Multiple arms holding probes perform probing at any point on the board. While probe movement time is required, resulting in longer inspection times compared to the fixture-based method, it does not require a fixture and can be set up simply by changing the program. This leads to time and cost savings when viewed from an overall process perspective. It is also suitable for inspecting boards in low-volume, high-variety production. The coordinates of the test points can be arbitrarily changed, making it easy to accommodate partial design changes to the board. It is also used for prototype board inspections and failure analysis.

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[Case Study] Replacement of Fixture-type In-Circuit Tester

No need for jig creation, reducing running costs by over 90%!

We would like to introduce a case where a flying probe tester was implemented as a replacement for a fixture-type (press-type) tester. *Challenges* - In the case of high-density mounted circuit boards, there were components that could not be inspected with a fixture-type tester due to the difficulty of creating fixtures in narrow areas. - For low-volume production, such as maintenance parts after mass production, the cost of fixtures became high, increasing the overall maintenance costs. - There was a need to secure storage space for fixtures, which also added management burdens. *Implementation Effects* - Components with narrow pitch that could not be inspected with fixtures can now be tested, enhancing reliability. - The need for fixture production has been eliminated, and there are no longer any running costs associated with maintenance. - Warehouse space for fixture storage is no longer required, eliminating management burdens. For more details about the flying probe tester, please download the PDF catalog or feel free to contact us.

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Are you having trouble with automatic LED light emission inspection?

Measure the emission color/brightness of LEDs quantitatively with a unique color sensor!! 【LED Color Test System】

Are you struggling with the labor involved in inspecting the LED's emission color and brightness? Takahashi's flying probe tester has an optional feature that allows for the measurement of LED emission color and brightness using a color sensor. There are cases where this feature has been used to switch from visual inspection to inspection using the flying probe tester. We would like to introduce the actual benefits of implementation. 1: Zero burden on visual inspectors Directly looking at the LED emission color can damage the eyes of the operator, but by switching to the flying probe tester, the burden can be reduced to zero. 2: Clarification of measurement standards Visual inspection can lead to variations in judgment criteria among inspectors, posing a risk of inconsistency. The inspection using a color sensor has clear judgment criteria based on numerical comparison, allowing for stable inspections. 3: No need for jig manufacturing costs In the case of LED inspection with the flying probe tester, there is no need to create dedicated jigs. We welcome inquiries for trials/tests as well. If you have any concerns, please feel free to contact us.

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Leave the introduction of flying probe testers to overseas markets to us!!

Introduced in over 46 countries!! Takaya's tester is recognized worldwide.

Introducing flying probe testers to overseas locations / Please leave the local setup to Takaya. Takaya has a distribution agreement with Itochu Corporation for overseas sales, and we have established sales/service locations in the United States, Europe, China, and Southeast Asia, with numerous sales achievements in over 46 countries. Please make use of Takaya's flying probe testers, which are recognized by companies and industries around the world, not just in Japan. *For more detailed information, please see the related link page below.

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Introducing the history of Takaya Flying Probe Testers that are active around the world.

Implemented in numerous global EMS companies and manufacturers in over 46 countries!!

Takaya is a leading company in the implementation board inspection machine industry, boasting the world's top market share in flying probe testers. After developing the world's first flying probe tester in 1987, it was showcased at a technology exhibition in Germany the following year, receiving high praise from the local electronics industry and starting the expansion into the European market. In 1990, sales began in the United States, another industrially advanced country. In 1995, it received the award for "TEST INNOVATION OF THE YEAR," given to the most innovative inspection machines, widely recognizing its performance around the world. Currently, sales and service bases are established in the United States, Europe, China, and Southeast Asia, with numerous sales achievements in over 46 countries. To meet the high demands from various manufacturers, new models and groundbreaking new features are being added daily, and the sales network continues to expand. If you have any issues with electrical testing of implementation boards, please feel free to contact Takaya.

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Fastest in-circuit test! Case studies of flying probe testers.

The Takaya APT series is a board inspection device capable of industry-leading ultra-fast in-circuit testing. Here are some examples of its applications.

■ Inspection of mass-produced products By connecting to loaders/unloaders, automated and unmanned inspections are possible even for large lots. ■ Inspection of multi-variety small quantity substrates There is no need for dedicated fixture manufacturing costs. It is difficult to identify defective areas in function tests, but it can be identified in in-circuit tests. ■ Inspection of prototype substrates We can respond immediately to design changes. Function tests are also possible, such as applying voltage to the substrate and confirming circuit operation (ON/OFF) or measuring direct current. ■ Implementation confirmation inspection during model switching We can reliably and quickly confirm the mounting program of the first lot and check for incorrect component sets on the mounter during model switching. ■ Defect analysis inspection It can be used for inspecting substrates that failed functional tests or for defect analysis of substrates that failed in the market. This allows for significant reductions in repair time and a decrease in discarded substrates. Additionally, there are various other applications where Takaya testers have been utilized successfully. For more details, please contact your sales representative.

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Integration with boundary scan testing using a flying probe tester.

We will create new value through the mutual complementarity of ICT and BST.

In-circuit testing with flying probe testers excels at inspecting the electrical characteristics of implemented electronic components in analog circuits. However, components that cannot be probed make electrical testing difficult, and functional testing of digital circuits is challenging. On the other hand, boundary scan testing allows for quick interconnection testing between LSI pins and on-board programming for FPGAs, but it can only test digital circuits around ICs that comply with the boundary scan standard, and it also requires dedicated fixtures for connections. At Takaya Corporation, we possess technology that uses flying probes instead of fixtures that connect 4 to 5 scan-compatible pins and measuring instruments required for boundary scan testing. This allows for boundary scan testing even when the counterpart of a boundary scan-compliant IC is a non-boundary scan-compliant IC or passive components (such as connectors), by enabling the flying probe to function as a virtual boundary scan cell. With a single flying probe tester, it is possible to conduct comprehensive testing of both digital and analog circuits, thereby significantly enhancing testing efficiency compared to before.

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Introduction to the feature article of the European electronics industry magazine "EPP"

The European electronics industry magazine "EPP" has featured an article on Takaya's flying probe tester.

In the October 2023 issue of the European electronics industry magazine "EPP," an article introducing Takaya's flying probe testers has been published. Takaya Corporation and its European distributor, Cystec Europe, have maintained a long-standing partnership with Siemens in Germany. At Siemens' global flagship factory "SIEMENS Karlsruhe," 12 Takaya flying probe testers are currently in operation, ensuring the reliability of assembled circuit boards. The APT-1600FD-A achieves fully unmanned inspection 24 hours a day, 5 days a week through simultaneous inspection of both sides, automatic setup of inspection programs using new software, and automatic transport of circuit boards using an Autonomous Mobile Robot (AMR). Additionally, it supports the latest interface standards such as OPC UA, enabling integration with MES systems, as well as the establishment of an environment for monitoring operating rates and automatic switching of inspection programs based on defect statistics. Please check the related links and download page for more information.

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Low resistance measurement mode (0.1mΩ~) [Under development]

Introducing the Takaya Flying Probe Tester. We are challenging the measurement of low resistance (0.1mΩ and below).

At Takaya, in order to respond to further requests from our customers, we are advancing the development of a unique mode for the flying probe tester that adjusts the application parameters to measure lower resistances (0.1 mΩ and below). *Resolution: 0.001 mΩ Compared to handheld low-resistance meters, the flying probe tester has longer measurement lines (about 5 meters) from the measurement probes to the main unit, which necessitates machine design that considers external noise. We have expertise in this area. Additionally, when measuring with handheld probes, the force, angle, and position of the probe contact with the measurement target are not constant, which can lead to variations in measurement results and potential dents or damage to the object being measured. However, our probe system is well-regarded for its damage-free contact and high-precision contact. If you have concerns about the uncertainty of manual measurements or if the measurement process is too cumbersome, please feel free to reach out to us. We would be happy to accept test trials.

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38th Electronics Packaging Society Spring Conference Presentation Materials Released

The presentation materials for the 38th Electronics Packaging Society Spring Conference are now available.

The 38th Electronics Packaging Society Spring Conference was held from March 13 (Wednesday) to 15 (Friday), 2024, at the Noda Campus of Tokyo University of Science. At this conference, Mr. Yanagida, the Technical Department Manager of Takaya Corporation's Industrial Equipment Division, gave a presentation on "Latest Trends in Hybrid Testing Systems Combining JTAG Testing and Flying Probe Testers." The presentation materials from that session have been made available, so please take a look at the related catalog page below. -------- Content -------- To ensure reliable assembly guarantees for printed circuit boards, electrical testing is essential. However, a single testing method alone does not provide sufficient test coverage. To address this issue, we introduce a hybrid testing system that integrates flying probe testers with JTAG boundary scan testing. By complementing each testing method, we can maximize the test coverage for high-density printed circuit boards, enabling more accurate fault diagnosis.

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Dual Side Flying Probe Tester APT-2600FD

A new innovation in substrate manufacturing. Achieving improved production efficiency and inspection accuracy!

The APT-2600FD is a next-generation dual-side flying probe tester that can perform combination testing with up to 6 probes using both upper and lower flying probes simultaneously. It improves test coverage while reducing the risk of product damage due to board flipping operations, significantly shortening inspection time. Equipped with a high-performance measurement system and a variety of features, it contributes to quality improvement from prototype to mass production. We accept evaluation tests at our demonstration rooms in Okayama headquarters and Tokyo branch, where you can bring in your boards. A complete testing process is possible, including the creation of inspection programs, testing using actual boards, and summarizing evaluation results. *For more details, please feel free to contact us.

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Flying Probe Tester APT-2400F / 2600FD

[39th NePCON Japan Domestic Debut] Supports inspection of high-density printed circuit boards with industry-leading accuracy! New model of flying probe tester.

Takaya Corporation announces the new model of its flying probe tester, "APT-2400F/APT-2600FD series," which reliably detects various defects in printed circuit boards through ultra-fast inspection. Equipped with cutting-edge inspection technology that can check fine component placements and connections with high precision, it ensures that even minor defects and risks are not overlooked, strongly supporting product quality improvement. Additionally, thanks to our unique control mechanisms and sensing technology, reliable inspections can be achieved even in fluctuating environments, contributing to quality management by reducing recall risks. Furthermore, the user-friendly interface allows anyone to operate it intuitively, helping to alleviate burdens in workplaces where labor shortages are becoming serious, while still ensuring high inspection accuracy and contributing to increased productivity. *For more details, please download the PDF document or feel free to contact us.*

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[Case Study] The Importance of Electrical Testing in EMS Companies

Takahashi's flying probe tester solves the challenges faced by EMS companies.

【Implementation Results for EMS Companies】 - By conducting electrical inspections from the prototype stage of the circuit board, we achieve quality assurance before mass production. - Early optimization of circuit board design and component selection contributes to reducing defects in later processes. 【Challenges Faced by Our Customers】 Cost of Recreating Jigs: With jig-based testers, it is necessary to recreate dedicated jigs every time there is a prototype or design change. Each design change requires modifications to the jigs, significantly increasing costs and time. Insufficient Response Capability to Design Changes: Conventional inspection methods make it difficult to respond flexibly to design changes. There were instances where long lead times made rapid verification at the prototype stage challenging.

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[Case Study] Inspection of Large PCBs for Medical Devices

Please utilize Takaya's flying probe tester for the inspection of large substrates for medical devices (in conjunction with boundary scan).

By combining visual inspection, non-contact scanning, and physical probing, we meet the stringent reliability standards in the medical device field, achieving both quality improvement and cost reduction. 【Implementation Achievements】 - Achieved 100% inspection in inline testing, ensuring product quality. - Enhanced defect detection capabilities for large substrates and complex design boards through collaboration with boundary scan technology. 【Challenges Faced by Customers】 Limitations of APT alone: Flying probe testers excel in electrical characteristic testing, but physical access for probing is difficult with components like BGAs and QFPs where pin connections are hidden. In high-density boards, there are areas that cannot be fully covered by probing alone. Constraints of AOI: Cannot detect defects (such as solder bridges or connection failures) located beneath BGAs or large components. Internal connections and micro-short circuits in multilayer boards cannot be detected. In large substrates, there are areas that exceed the field of view, making it difficult to efficiently inspect the entire area. Challenges with large substrates and complex designs: In large substrates, inspection time tends to increase for both AOI and APT, leading to decreased productivity. Efficient inspection systems combining physical probing and non-contact inspection are necessary for 100% inspection of high-density mounted boards.

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[Case Study] Circuit Board Inspection for Lighting (LED Lighting)

Please utilize Takaya's flying probe tester for substrate inspection for lighting (LED lighting).

By utilizing color sensors for automated inspection, we overcome the limitations of visual inspection, achieving quality stabilization and increased efficiency. Automation reduces the burden on operators and establishes consistent inspection standards, balancing improved product reliability with cost reduction. 【Implementation Achievements】 - Transition from visual inspection to automated inspection. - Achieved quality stabilization through precise automated inspection using color sensors. 【Challenges Faced by Customers】 Operator Burden: Visual inspection relies on the skills and experience of operators, leading to issues such as fatigue and decreased concentration during long hours of work. As the burden on operators increases, the risk of reduced inspection accuracy rises. Variability in Judgment Criteria: Visual inspection involves subjective judgments from individuals, resulting in variability in quality standards. Inconsistent judgments can lead to the outflow of defective products and excessive inspections. Difficulty in Confirming LED Characteristics: Determining subtle characteristics such as the color and brightness of LEDs is challenging through visual inspection. Inspections based on accurate numerical standards are required.

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[Exhibition] Introduction of Exhibited Products at the 37th Nepcon Japan

[Exhibition Panel Release] Flying Probe Tester (PCB Inspection Equipment) that detects defects in implemented circuit boards with ultra-fast inspection; RFID products that contribute to business reform.

Thank you to everyone who visited our booth at the "37th Internepcon Japan," held at Tokyo Big Sight from January 25 (Wednesday) to 27 (Friday), 2023. We have made the materials and display panels of our exhibited products available. Even those who could not attend the venue during the event can register on this page to view the materials, so please take advantage of this opportunity. This time, our Industrial Equipment Division, in collaboration with Andor System Support Co., Ltd., conducted a demonstration of boundary scan testing using a flying probe tester, and we are pleased that many customers showed interest in this. Additionally, this was the first collaborative exhibition between our Industrial Equipment Division and RF Division, and we believe many people were able to learn about our products. Moving forward, Takaya Corporation will continue to strive to meet our customers' expectations. We sincerely appreciate your continued support.

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We also accept special custom requests for flying probe testers.

We manufacture original units capable of automatically transporting large heavy substrates weighing up to 30 kg. Please feel free to entrust us with custom specifications as well.

At Takaya, we also accept special custom requests for flying probe testers to meet our customers' diverse needs. For example, in response to a request to "automatically transport large and heavy PCBs weighing up to 30kg," we created a dedicated automatic transport unit. This allows for the safe and accurate handling of very heavy PCBs that are difficult to carry manually. Additionally, to conduct special inspections alongside in-circuit testing, we have made space within the tester body to accommodate special inspection equipment, enabling flexible customization. Even for inspections of special products that do not conform to standard specifications, we can provide solutions through custom support. Please consult with our sales representative for more information.

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Leakage current measurement function

This is an introduction to the Takaya Flying Probe Tester option. It also supports leakage current measurement.

This is an optional feature for measuring the following using a flying probe tester with a maximum DC constant voltage of ±110V applied: - Leakage current between arbitrarily specified nets - Leakage current (leakage current) of semiconductor devices such as MOS-FETs and photo MOS relays - Reverse current of diodes By contacting other probes to the same net as the measurement probe and measuring the resistance value, a check function is provided to prevent misjudgment. Trial/testing consultations are also welcome. If you have any concerns, please feel free to contact us.

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Integration function with MES systems compatible with the international standard OPC UA.

Exhibiting at Nepcon 2024 from January 24! Achieving interoperability between industrial equipment and MES systems!

OPC UA (OPC Unified Architecture) is an open international standard developed for safe and reliable data exchange in industries such as industrial automation. It was announced by the OPC Foundation in 2008 and later standardized as IEC62541. It enables secure and highly reliable data exchange across various types of devices, operating systems, and manufacturers, making it recommended as the standard communication for Industrie 4.0 and increasingly adopted worldwide. Additionally, it is aligned with the international standard for PLCs, IEC61131-3, providing the advantage of high reliability in exchanging information from the manufacturing site with higher-level monitoring control systems and Manufacturing Execution Systems (MES). In response to this trend, Takaya has prepared an option to equip the APT series of flying probe testers with an OPC UA server. We are working to promote the adoption of industrial IoT standards that bridge FA equipment and IT.

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[Video] Introduction to HF/UHF Band Detacollect Terminals

Utilization of Manufacturing DX Management System/Scheduler / Reliable collection of progress and performance data / Support for data collection with RFID + edge devices

【Features】 - Reliable data collection (easy operation and confirmation of system-side reception) - No interruption of manufacturing operations (retransmission function) - Flexible response to layout changes and equipment replacement - Simultaneous use of multiple units - Time synchronization (when using WiFi)

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Flying Probe Tester APT-2400F-SL

Equipped with a high-performance measurement system and a variety of functions, it contributes to quality improvement from prototype to mass production!

The APT-2400F-SL is a large model that retains the basic performance of the APT-2400F while expanding the compatible board size to W635×D610mm. Additionally, by adding an optional split inspection function, it can inspect long boards up to W985×D610mm. It can accommodate component heights of 60mm on the top and 120mm on the bottom, and can handle board weights of up to 15kg, making it suitable for inspecting large and heavy boards such as those used in automotive, aerospace, medical devices, power supply boards, and probe cards. We accept evaluation tests at our demo rooms in Okayama headquarters and Tokyo branch, where you can bring your boards for testing. A complete testing process is possible, including the creation of inspection programs, inspection using actual boards, and summarizing evaluation results. *For more details, please feel free to contact us.

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[Case Study] High-Density Substrate Inspection in Semiconductor Manufacturing Equipment

Please utilize Takaya's flying probe tester in the high-density substrate inspection process for semiconductor manufacturing equipment.

High-precision inspections compliant with IEC60384-1 are possible. The characteristics of electronic components such as fixed capacitors are guaranteed according to international standards, achieving improved quality for high-density circuit boards. We provide flexible responses to design changes and prototypes, offering cost-effective inspection solutions. 【Implementation Achievements】 - Conducted inspections of high-density mounted circuit boards, achieving quality assurance tailored to precision boards. - Enabled inspections compliant with the IEC60384-1 standard (performance criteria for fixed capacitors), ensuring product quality that meets international standards. 【Customer Challenges】 Narrow Pitch Between Components: In high-density circuit boards, the space between components is extremely narrow, making physical contact difficult with traditional jig-based inspections. There is a risk of reduced inspection accuracy, especially in narrow pitch areas below 0.2mm and for components with a high number of pins. Need for Compliance with Standards: As compliance with international standards represented by IEC60384-1 is required, a system that reliably implements inspection items based on these standards is necessary. It is particularly important to measure the characteristics of fixed capacitors and special components with precision and speed. Limitations of Inspection Coverage: In designs where the number of test points has decreased, there is a risk of reduced inspection coverage due to insufficient physical access.

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[Case Study] Inspection of Large PCBs for Communication Infrastructure and Servers

Please utilize Takaya's flying probe tester for the inspection of large circuit boards for communication infrastructure and servers.

In large-scale board inspections for communication infrastructure and servers, jig-less inspection is particularly effective. Even with large board sizes, it can be handled efficiently, and this inspection method, which combines flexibility and precision, contributes to quality improvement and cost reduction. This greatly contributes to ensuring reliability in the fields of communication infrastructure and servers. 【Implementation Results】 - Established inspection technology tailored to the quality requirements specific to large boards. - Guaranteed the reliability of high-precision boards used in communication infrastructure devices and server products. 【Challenges Faced by Customers】 Handling of large boards: With jig-based testers, designing and manufacturing jigs for large boards is difficult. Due to weight and handling constraints, setup times become longer. Response to design changes: Large boards have many test points, and the cost of modifying jigs increases during design changes. The flexibility of the inspection process is low, making it unsuitable for low-volume, high-variety production. Cost and storage space: Jigs for large boards are expensive to manufacture and take up storage space. When operating multiple product lines, managing jigs becomes complicated.

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[Case Study] Board Inspection for Power Generation and Power Systems

Please utilize Takaya's flying probe tester for substrate inspection in power generation and power systems.

By combining electrical testing using APT with AOI, which is challenging for discrete components and hand-inserted parts, we achieve the high quality standards required for power generation and power system boards, providing an efficient inspection system. 【Implementation Results】 - Conducted implementation verification focused on discrete components, achieving quality assurance for power system boards that require high reliability. - Realized 100% inspection on boards including power lines and hand-inserted components. 【Challenges Faced by Customers】 Limitations of AOI Inspection: While AOI (Automated Optical Inspection) excels in inspecting surface-mounted components, it has limitations in the following areas: - Difficulty in inspecting hand-inserted components: It cannot adequately verify the quality of the implementation of power lines and large discrete components. - Insufficient confirmation of component position and polarity: AOI cannot confirm accurate electrical characteristics, leading to the risk of missing incorrect insertions or polarity issues. Risks During Power Supply: Defective components or miswiring in power lines can lead to damage to the board or destruction of components. Particularly, if the quality assurance for discrete components is insufficient, the risk of overheating or short circuits increases. Generation of Waste Boards: If a board is damaged during power-on testing, the disposal of defective boards occurs, leading to increased costs.

  • Measurement and Inspection
  • Probe Tester

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[Case Study] Circuit Board Inspection for Consumer Products

Please utilize Takaya's flying probe tester for circuit board inspection for consumer products.

In the mass production process of circuit boards for consumer products, conducting constant inspections of chip components and verifying the mounter program before assembly helps prevent lot outs and defective products from being released, thereby achieving both efficiency in the manufacturing process and improved quality. 【Implementation Results】 - In the process of switching models for mass-produced high-density assembly boards, program verification of the mounter and constant inspections of chip components were carried out. - Efficient manufacturing processes were realized through short-duration and high-precision inspections. 【Challenges Faced by Customers】 Component Set Errors: The risk of component set errors during the assembly process or the installation of non-specified components. Particularly in mass production, if mistakes are discovered late, it can lead to a large number of lot outs. Program Errors: Due to errors in the mounter program settings, there is a possibility that incorrect components are installed on the circuit board. If a setting error is discovered in a later process, the costs for rework or disposal increase. Limitations of Visual Inspection: Manual and visual checks depend on the skills and fatigue of the workers, making it easy for inspection omissions and false detections to occur.

  • Measurement and Inspection
  • Probe Tester

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[Case Study] Defect Analysis of Automotive PCBs and In-Vehicle PCBs

Please utilize Takaya's flying probe tester for failure analysis of automotive substrates and in-vehicle substrates.

In the analysis of defective automotive circuit boards, utilizing a flying probe tester enables rapid identification of defective areas and improves repairability. By shortening analysis time and reducing the number of discarded boards, we aim to achieve both quality enhancement and cost efficiency, contributing to increased reliability in the automotive industry. 【Implementation Results】 - Analyzed defective areas of boards judged faulty during function tests or returned from the market due to failures. - Contributed to product improvement and defect reduction through quick identification of causes. 【Challenges Faced by Customers】 Need for Advanced Knowledge: Defect analysis requires knowledge of circuit design, assembly technology, and operational characteristics. In complex automotive circuit boards, the causes can be diverse, making analysis challenging. Prolonged Analysis Time: Manual analysis and visual inspections can be time-consuming and may fail to identify defective areas. This is particularly true for multilayer boards, where detecting internal connection failures or fine short circuits is difficult. Generation of Discarded Boards: If defective areas cannot be identified, the entire board may have to be discarded, leading to increased costs.

  • Measurement and Inspection
  • Probe Tester

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[Case Study] PCB Inspection for Aerospace and Defense Sector

Please utilize Takaya's flying probe tester for substrate inspection in the aerospace and defense sectors.

In the aerospace and defense sectors, where high quality standards are required, the use of flying probe testers streamlines the inspection of low-volume production boards. The flexible inspection flow, which does not require fixtures, enables quick turnaround times and ensures traceability, achieving both quality improvement and cost reduction. 【Implementation Results】 - Conducted full inspection of low-volume production boards, achieving quality assurance for products that require high reliability. - Responded to the stringent demands specific to the aerospace and defense sectors through a high-precision inspection flow. 【Challenges Faced by Customers】 Burden of Fixture Creation: Fixture-based testers require dedicated fixtures for each board, leading to excessive costs for low-volume production. The design and manufacturing of fixtures take time, making quick turnaround difficult. Difficulty in Defect Detection: There is a risk of missing fine defects (hidden shorts, internal wiring issues) that are difficult to detect with only AOI or functional testing. Particularly for multilayer boards, visual inspections and standard power-on tests are insufficient for quality assurance. Traceability Requirements: For aerospace and defense products, it is necessary to meticulously record measurement results and inspection data to ensure future traceability.

  • Measurement and Inspection
  • Probe Tester

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