Please utilize Takaya's flying probe tester for the inspection of large substrates for medical devices (in conjunction with boundary scan).
By combining visual inspection, non-contact scanning, and physical probing, we meet the stringent reliability standards in the medical device field, achieving both quality improvement and cost reduction. 【Implementation Achievements】 - Achieved 100% inspection in inline testing, ensuring product quality. - Enhanced defect detection capabilities for large substrates and complex design boards through collaboration with boundary scan technology. 【Challenges Faced by Customers】 Limitations of APT alone: Flying probe testers excel in electrical characteristic testing, but physical access for probing is difficult with components like BGAs and QFPs where pin connections are hidden. In high-density boards, there are areas that cannot be fully covered by probing alone. Constraints of AOI: Cannot detect defects (such as solder bridges or connection failures) located beneath BGAs or large components. Internal connections and micro-short circuits in multilayer boards cannot be detected. In large substrates, there are areas that exceed the field of view, making it difficult to efficiently inspect the entire area. Challenges with large substrates and complex designs: In large substrates, inspection time tends to increase for both AOI and APT, leading to decreased productivity. Efficient inspection systems combining physical probing and non-contact inspection are necessary for 100% inspection of high-density mounted boards.
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**Benefits of Introducing Flying Probe Tester + Boundary Scan Integration** **Collaboration with Boundary Scan Technology:** By incorporating boundary scan technology into the APT inspection flow, it enables non-contact detection of BGA bottom and internal wiring defects that are difficult to detect with AOI or APT. It verifies the connection status between JTAG-compliant devices and detects wiring breaks and shorts with high precision. **Complementing AOI:** APT and boundary scan complement internal wiring and hidden connection defects that are often overlooked by AOI. It rechecks the appearance defects detected by AOI using APT and boundary scan to prevent false positives and omissions. **Support for Large Boards and High Component Boards:** By using APT and boundary scan technology together, it efficiently covers the entire area of large boards by leveraging the characteristics of physical probing and non-contact scanning. It achieves flexible inspection that is not affected by component height or the internal characteristics of multilayer boards. **Cost Reduction and Efficiency:** The collaboration of APT and boundary scan, which does not require fixtures, reduces the costs of fixture production and storage. By dividing the visual inspection performed by AOI and the electrical characteristic inspection by APT/boundary scan, it improves inspection efficiency.
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**Effects of Implementation** High Inspection Coverage: By integrating AOI, APT, and boundary scan, comprehensive inspection from appearance to internal wiring is possible. This reduces the chances of missing defects and false reports, thereby improving quality. Flexible Design Support: Supports designs with reduced test points and boards with many BGA components. Can be quickly operated even in low-volume, high-variety production or during design changes. Improved Inspection Efficiency: Establishes an efficient inspection process with screening by AOI, connection verification by boundary scan, and detailed inspection by APT. Reduces inspection time for large and complex design boards. Cost Reduction: Optimizes inspection costs by combining jig-less APT and non-contact boundary scan technology. **Application Examples** Surgical Robot Control Board: Detects appearance defects with AOI, and complements internal connections and electrical characteristics with APT and boundary scan. Diagnostic Device Board: Conducts detailed inspections of defects on large boards by combining AOI and electrical testing. Biological Monitoring Board: Efficiently detects internal wiring defects specific to fine signal lines and multilayer boards.
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![[Press Release] Takaya Corporation Announces New Models of Flying Probe Tester "APT-2400F/APT-2600FD Series"](https://image.www.ipros.com/public/catalog/image/01/ff3/783618/IPROS14580097868979274668.jpeg?w=120&h=170)
Company information
Founded in 1894 as a textile company, Takaya Textile expanded and established its electronics division in 1966, starting the assembly of transistor radios. Today, in addition to contract manufacturing services (EMS) related to electronic devices, the company actively manufactures and sells various electronics, including in-circuit testers (printed circuit board inspection devices) and RFID (a technology that enables information exchange through short-range wireless communication from tags containing IC information), as well as IT consulting and system solutions, both domestically and internationally. We continue to evolve as a corporate group that contributes to societal development, with textiles and electronics as our dual pillars.
![[Case Study] Electrical Testing of Inserted Implementation Boards (Discrete Components)](https://image.www.ipros.com/public/product/image/fec/2000708036/IPROS70997628607265953707.jpeg?w=280&h=280)
