Tohoku University Technology: Nanosheet and its manufacturing method: T19-821
Possible to integrate into small electronic device and to control heat flow
Actually, the waste heat below 200℃ emitted by electronic device, etc., is difficult to control and therefore, it is not effectively reused. This heat reduces performance and lifespan of electronic device. A heat engine that uses MEMS to control the heat flow has been developed, but it requires a relatively large space to house the drive unit, making it difficult to integrate into small electronic device. This invention is able to provide nanosheet and nanosheet manufacturing method. This nanosheet can be easily integrated into small electronic device, etc. which can control heat flow. It has a copper oxide layer with Cu and O bonded in a chain forming a ladder pattern, and its thickness is less than 100 nm. Due to this thinness, the nanosheet can be easily integrated into electronic devices that are becoming smaller, and the thermal conductivity can be controlled easily.
- Company：Tohoku Techno Arch Co., Ltd.
- Price：Other
