Tohoku University Technology: Nanosheet and its manufacturing method: T19-821
Possible to integrate into small electronic device and to control heat flow
Actually, the waste heat below 200℃ emitted by electronic device, etc., is difficult to control and therefore, it is not effectively reused. This heat reduces performance and lifespan of electronic device. A heat engine that uses MEMS to control the heat flow has been developed, but it requires a relatively large space to house the drive unit, making it difficult to integrate into small electronic device. This invention is able to provide nanosheet and nanosheet manufacturing method. This nanosheet can be easily integrated into small electronic device, etc. which can control heat flow. It has a copper oxide layer with Cu and O bonded in a chain forming a ladder pattern, and its thickness is less than 100 nm. Due to this thinness, the nanosheet can be easily integrated into electronic devices that are becoming smaller, and the thermal conductivity can be controlled easily.
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The revenue generated from technology transfer is reinvested into universities and researchers as new research funding, which is used to create further research outcomes. To ensure the smooth operation of this cycle, known as the "Intellectual Creation Cycle," we will actively promote technology transfer. The types of seeds we handle include patents, know-how, databases, and programs. We have established a collaborative framework by concluding basic technology transfer agreements with the following universities (as of April 1, 2026): - Tohoku University - Hirosaki University - Iwate University - Akita University - Fukushima University - Yamagata University - Tohoku Gakuin University - Iwate Medical University - Fukushima Medical University - Aizu University - Miyagi University - Hokkaido University - Muroran Institute of Technology - Showa Medical University - Asahikawa Medical University
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