substrate Product List and Ranking from 41 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. 電研精機研究所 Tokyo//others
  2. 東西電気産業 本店(大阪)、東京店 Osaka//Interior Design
  3. 太洋テクノレックス 本社　和歌山 Wakayama//others
  4. 4 三和電子サーキット Osaka//others
  5. 5 デンカ Tokyo//others
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substrate Product ranking

Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.

  1. Ideal for UV-C sterilization devices! Inverter (board type) 東西電気産業 本店(大阪)、東京店
  2. Transparent FPC (Transparent Flexible Printed Circuit Board) 太洋テクノレックス 本社　和歌山
  3. Noise Cut Transformer NCT-R5-J2 電研精機研究所
  4. 4 Noise Cut Transformer NCT-I3 電研精機研究所
  5. 4 JL Irregular Insert Series S Insert ジャパンライフ

substrate Product List

271～285 item / All 378 items

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Printed circuit board "Single-sided board"

Printed circuit board "Single-sided board"

We respond to requests for short delivery times! We provide circuit boards tailored to various applications.

A "single-sided board" is a printed circuit board that has circuits formed on only one side of the substrate. Our company offers various types of boards tailored to different applications, including high-density single-sided boards that enhance miniaturization and component mounting density, as well as power boards that support high current. We can also accommodate single-sided boards that excel in soldering using special molds. Additionally, we respond to requests for small lot sizes, router-processed products, and short delivery times. 【Features】 ■ The substrate mainly uses FR-4, CEM-3, and FR-1 materials. ■ We can also accommodate single-sided boards that excel in soldering using special molds. ■ We respond to requests for small lot sizes, router-processed products, and short delivery times. *For more details, please refer to the PDF document or feel free to contact us.

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Build-up substrate

Build-up substrate

Mounting of narrow-pitch electronic components due to the build-up structure! Compatible with chip-on-hole.

We would like to introduce our "Build-Up Boards." We can accommodate layer counts from 4 to 16 layers, and the VIA structure can support various interlayer connections through laser or drill processing. Additionally, we can handle narrow pitch BGA/CSP mounting, impedance control, and a variety of substrate materials tailored to different applications. 【Features】 ■ Layer count: Supports from 4 to 16 layers ■ VIA structure: Supports various interlayer connections through laser or drill processing ■ Compatible with narrow pitch BGA/CSP mounting ■ Supports impedance control ■ Accommodates various substrate materials for different applications ■ Chip-on-hole compatible *For more details, please refer to the PDF document or feel free to contact us.

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IVH substrate

IVH substrate

By using various VIA structures, we provide circuit boards tailored to your needs!

We would like to introduce the "IVH substrate" that we handle. It supports layer counts from 4 layers to 20 layers, and the VIA structure can accommodate various interlayer connections. It also supports ultra-small diameter VIAs. Additionally, it is compatible with impedance control and chip-on-hole, and we can provide various substrate materials tailored to different applications. 【Features】 ■ Layer count: Supports from 4 layers to 20 layers ■ VIA structure: Accommodates various interlayer connections ■ Supports ultra-small diameter VIAs ■ Supports impedance control ■ Various substrate materials available for different applications ■ Supports chip-on-hole *For more details, please refer to the PDF document or feel free to contact us.

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End face through-hole substrate

End face through-hole substrate

Contributing to the miniaturization of device substrates and module substrates, as well as the improvement of implementation density on motherboards!

We would like to introduce our "Edge Through-Hole PCB" that we handle. It enables high-density mounting, significantly contributing to the miniaturization of device boards and module boards, as well as improving the mounting density of motherboards. Additionally, we have established mass production technology for narrow-pitch edge through-holes. Please feel free to contact us when you need assistance. 【Features】 ■ Enables high-density mounting ■ Allows for miniaturization of device boards and module boards ■ Significantly contributes to improving the mounting density of motherboards *For more details, please refer to the PDF document or feel free to contact us.

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Aluminum base substrate

Aluminum base substrate

We offer substrates tailored for various applications that require heat dissipation! Aluminum thickness can be accommodated up to 2.00mm.

The "aluminum base substrate" we handle is a high heat dissipation substrate that utilizes the heat dissipation properties of aluminum. We provide substrates tailored to various applications that require heat dissipation, with aluminum thicknesses of 1.00mm, 1.50mm, 2.00mm, and a special specification of 0.30mm. For other specifications such as insulation layer thickness, thermal conductivity, and copper foil thickness, please feel free to consult us. 【Features】 ■ High heat dissipation substrate that utilizes the heat dissipation properties of aluminum ■ Substrates provided for various applications that require heat dissipation *For more details, please refer to the PDF materials or feel free to contact us.

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Multilayer substrate

Multilayer substrate

From 4 layers to 36 layers! We provide high-precision multilayer PCBs tailored to the needs of high multilayer/high density.

We would like to introduce the "multilayer boards" that we handle. We can accommodate layer counts from 4 layers to 36 layers, with board thicknesses ranging from thin boards to a maximum of 8mm. We also support micro-diameter vias and impedance control. Additionally, we offer various substrate materials tailored to different applications, and we can accommodate chip-on-hole configurations as well. 【Features】 ■ Layer count: Supports from 4 layers to 36 layers ■ Board thickness: Supports from thin boards to a maximum of 8mm ■ Supports micro-diameter vias ■ Supports impedance control ■ Various substrate materials available for different applications ■ Supports chip-on-hole configurations *For more details, please refer to the PDF document or feel free to contact us.

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High-heat dissipation substrate "Bending Aluminum Base Substrate"

High-heat dissipation substrate "Bending Aluminum Base Substrate"

The intended use is for automotive decorative accessories, etc.! A thin aluminum base substrate with a thickness of 0.40mm.

We would like to introduce our high thermal conductivity substrate, the "Bendable Aluminum Base Substrate." Its features include flexibility similar to that of a flexible circuit, while also being able to maintain a bent shape, which is a significant advantage. It also possesses thermal conductivity as an aluminum base substrate. Please feel free to consult us when you need assistance. 【Features】 ■ Thickness: 0.40mm ■ Flexibility similar to that of a flexible circuit ■ Ability to maintain a bent shape ■ Possesses thermal conductivity *For more details, please refer to the PDF document or feel free to contact us.

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High-speed signal, high-density substrate 'IVH substrate'

High-speed signal, high-density substrate 'IVH substrate'

Supports IVH substrates from 4 layers to 20 layers! Component mounting on the surface of the IVH section is also possible.

We would like to introduce our high-speed signal and high-density substrate, the "IVH substrate." By using the IVH structure, we can achieve high density tailored to our customers' needs. Additionally, we can accommodate low dielectric materials for high-frequency applications. Please feel free to consult us when needed. 【Features】 ■ Supports IVH substrates from 4 layers to 20 layers ■ High density tailored to customer needs ■ Component mounting on the surface of the IVH part is possible, compatible with chip-on-hole ■ Impedance control is possible ■ Can accommodate low dielectric materials for high-frequency applications *For more details, please refer to the PDF document or feel free to contact us.

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Bonded substrate

Bonded substrate

Miniaturization of devices, heat dissipation applications, and printed circuit boards tailored to individual product implementations!

Our company is capable of providing printed circuit boards with special structures tailored to your requirements, thanks to our unique three-layer substrates and the bonding structures of materials and copper foil. Applications include device substrates and substrates with bonded structures of metals (such as copper foil and aluminum) or materials. Printed circuit boards for devices require structures that accommodate miniaturization, heat dissipation, and the specific implementation needs of individual products. 【Applications】 ■ Device substrates ■ Substrates with bonded structures of metals (such as copper foil and aluminum) or materials *For more details, please refer to the PDF document or feel free to contact us.

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End face electrode substrate "End face through-hole substrate"

End face electrode substrate "End face through-hole substrate"

Cutting the through holes at the edge of the substrate with contour processing! Suitable for mounting holes and power supply units, etc.

The "end face through-hole substrate" is created by cutting the through-holes at the edge of the substrate using contour processing. In conventional end face through-holes, copper burrs were generated during cutting, but thanks to our unique process, we can provide end face through-holes without burrs even with router processing. Please feel free to contact us when you need our services. 【Applications】 ■ Mounting holes ■ Power supply units ■ Converter substrates ■ Module substrates, etc. *For more details, please refer to the PDF materials or feel free to contact us.

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End face electrode substrate "Narrow Pitch End Face Through Hole Substrate"

End face electrode substrate "Narrow Pitch End Face Through Hole Substrate"

We can also accommodate a pitch of 0.6mm and a hole diameter of φ0.15mm! We provide through holes with burr-free end faces.

We would like to introduce our "Narrow Pitch Edge Through-Hole Board." Thanks to our unique process, we can form edge through-holes with a narrow pitch. We can provide edge through-holes without burrs, regardless of the cutting method used, even for copper burrs generated during cutting. 【Applications】 ■ Mounting holes ■ Power supply units ■ Converter boards ■ Module boards, etc. *For more details, please refer to the PDF document or feel free to contact us.

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End face electrode substrate "Partial etching through-hole substrate"

End face electrode substrate "Partial etching through-hole substrate"

Only the copper in the cut section of the through hole is removed by etching! We can accommodate board thicknesses from 0.04 to 0.3 mm.

We would like to introduce our "Partial Etching Through-Hole Substrate." In printed circuit boards used as substrate for devices, after component mounting, through-holes may be diced and used as soldering electrodes. However, cutting the copper plating of the through-holes inevitably leads to burr formation. Our company enables the production of cut through-hole substrates without burrs by selectively etching away only the copper at the cut portions of the through-holes. [Applications] ■ Substrate boards for devices with through-hole electrodes, etc. *For more details, please refer to the PDF document or feel free to contact us.

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Resistor hole filling board

Resistor hole filling board

By embedding solder resist ink in the through-hole section, it is possible to cover it!

We would like to introduce our "Solder Mask Plugging Board." By embedding solder mask ink into the through-hole sections, it is possible to cover them. This prevents flux and solder from wicking up to the surface during assembly. Please feel free to contact us if you have any inquiries. 【Applications】 ■ Device boards, etc. *For more details, please refer to the PDF document or feel free to contact us.

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Silicone printed circuit board

Silicone printed circuit board

Support for metal-based substrates is also possible! Suitable for applications such as heat resistance and UV equipment.

We would like to introduce our "Silicone Printed Circuit Board." Our silicone ink has high weather resistance against heat and the recently noted UV-C, as well as a high reflectivity. Due to its tendency to bleed, it is necessary to maintain a larger clearance with the circuit. However, thanks to our unique technology, we can provide silicone ink-coated boards with a minimum clearance of 0.2mm from the edges of the mounted circuit. 【Applications】 ■ Heat-resistant, UV equipment-related, etc. *For more details, please refer to the PDF document or feel free to contact us.

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Flexible substrate

Flexible substrate

Impedance accuracy is within standard ±10% and high precision ±5%! Available for small quantities.

"Flexible printed circuit boards" are printed circuit boards formed on an insulating film that is flexible and can be significantly deformed, such as being bent. Impedance control is also available, and we can provide them in small quantities. They are used in a wide variety of electronic devices and precision instruments, including mobile devices, wearable devices, and medical equipment. 【Specifications】 ■ Number of layers: Single-sided, double-sided ■ Board thickness: Base thickness 25μm, 50μm ■ Surface treatment: Heat-resistant preflux, electrolytic and electroless gold plating ■ Impedance accuracy: Standard ±10% or less, high precision ±5% or less *For more details, please refer to the PDF document or feel free to contact us.

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