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Analysis of electronic components and materials using TEM.

TEM (Transmission Electron Microscope) meets a wide range of requirements for observing failure sites of electronic components, length measurements, elemental analysis, crystal structure analysis, and material evaluation.

TEM can perform not only high-magnification observation but also elemental analysis using EDS and EELS, as well as analysis of crystal structure, surface orientation, lattice constants, and more through electron diffraction.

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Analysis of the assembly joint of the component.

By applying chemical etching, ion milling, and FIB processing to mechanical polishing methods, we will analyze various metal joints, starting with lead-free solder.

The joints of electronic components have a significant impact on the overall reliability of the circuit board. Particularly at solder joints, not only the shape but also the observation of the metal structure becomes important.

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Attention those struggling with material properties in the manufacturing process at the Institute of Chemical Reaction Mechanisms!

What is the reason for this discoloration on the surface? Why is there a crack in such a place? These issues will be resolved from the perspectives of electrons, atoms, molecules, and chemical reaction mechanisms!

Many defects occur during the manufacturing process of products and during their use. Among these, there are challenges related to material properties, and for those who are wondering, "It’s probably due to the material, but what should I do about it?", we propose suitable solutions from the perspectives of electronics, atoms, molecules, and chemical reaction mechanisms. ■Examples of Issues - What is causing this discoloration? - Why did it crack so quickly? - What is the reason it tears immediately during a tensile test? *For more details, please refer to the PDF document or feel free to contact us.

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EBSD analysis

Changes in crystal orientation and crystal grain size can be analyzed! We introduce the EBSD (Electron Backscatter Diffraction) method.

The EBSD method is a technique for analyzing the distribution of crystal grains, microstructure, and crystal phase distribution by calculating the crystal orientation of patterns continuously captured based on the information of the crystal structure of the sample. Materials such as metals and ceramics, which are crystalline, are thought to be composed of numerous crystal lattices like cubes, and this analysis method examines the orientation of these lattices (crystal orientation). Various maps are used, including the IQ map (Image Quality Map), IPF map, GROD map, and pole figures. 【Features】 ■ The EBSD method is a technique for analyzing the distribution of crystal grains, microstructure, and crystal phase distribution. ■ Uses the TSL Solutions OIM7.0 crystal orientation analysis device. ■ Analyzes the orientation of the crystal lattice (crystal orientation). ■ Changes in crystal orientation and grain size due to different processing conditions (such as rolling and extrusion) can be analyzed. *For more details, please refer to the PDF document or feel free to contact us.

  • Electrical Equipment Testing
  • Other analytical equipment

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Failure analysis of IC (integrated circuit)

By combining various methods suitable for failure modes, we can consistently address everything from the identification of defective nodes to physical analysis.

We would like to introduce Aites Inc.'s "Defect Analysis of ICs." Our company provides a comprehensive approach to ICs by combining methods suitable for different failure modes, from identifying defective nodes to physical analysis. We offer various analysis techniques, starting with "Luminescence Analysis/OBIRCH Analysis," which allows for layout verification using a Layout Viewer, as well as "Layer Delamination/Sample Processing," "PVC Analysis," "Diffusion Layer Etching," and "sMIM Analysis." 【Methods】 ■ Luminescence Analysis/OBIRCH Analysis ■ Layer Delamination/Sample Processing ■ Micro Probe ■ PVC Analysis ■ EBAC Analysis ■ Physical Analysis (FIB-SEM, TEM) *For more details, please refer to the PDF document or feel free to contact us.

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OBIRCH analysis of SiC devices using short-wavelength lasers.

Since semiconductors have different physical properties, new methods are required for failure analysis!

Our company conducts OBIRCH analysis of SiC devices using short-wavelength lasers. SiC is a power device with lower energy loss compared to conventional Si semiconductors and is attracting attention. However, since its physical properties differ from those of Si semiconductors, new methods are required for failure analysis. In the backside OBIRCH analysis of SiC-SBD using short-wavelength lasers, localized melting damage was induced in the SiC Schottky barrier diode, resulting in the generation of a pseudo-leak. Locations of pseudo-leaks that could not be confirmed in the IR-OBIRCH analysis were clearly observed in the GL-OBIRCH analysis. *For more details, please refer to the PDF materials or feel free to contact us.

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Failure analysis of electrostatic discharge damaged orange LED.

We will introduce a comparison of the brightness and characteristics of good products and electrostatic discharge (ESD) damaged products, along with examples of luminescence analysis using EMS microscopy!

We conduct failure analysis of orange LEDs that have been damaged by electrostatic discharge (ESD). LEDs that have been destroyed during ESD testing and show a decrease in luminous intensity can be analyzed using emission photometry and the IR-OBIRCH method, allowing us to clarify the failure phenomena. We have examples such as "Comparison of brightness and characteristics between good products and ESD-damaged products" and "Emission analysis using an emission microscope." [Analysis Examples] ■ Comparison of brightness and characteristics between good products and ESD-damaged products - By polishing the lens part of a bullet-type LED to flatten it, a brightness comparison was conducted, revealing dark areas. ■ Emission analysis using an emission microscope - In the ESD-damaged products, dark areas were observed under forward bias, while only the damaged areas emitted light under reverse bias. ■ IR-OBIRCH and SEI analysis - Detailed damage locations were identified through IR-OBIRCH analysis of ESD-damaged products. *For more details, please refer to the PDF document or feel free to contact us.

  • Other analytical equipment

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Analysis of good LCD panels

Check the quality status of LCD components and products! We will analyze the structures of the LCD panel using our analytical methods and expertise!

At AITES, we conduct quality analysis of LCD components/products, confirming the quality status of products based on our expertise in LCD technology. The target panels include SEG-LCD, AM-LCD (a-Si TFT / LTPS TFT), OLED for automotive, monitors, mobile devices, and more. We perform quality analysis using our analytical methods on the various structures of liquid crystal panels. 【Analysis Details (Excerpt)】 <Reliability/Lighting Tests> ■ Classification - Reliability Testing - Lighting Inspection ■ Analytical Methods - Oven Drive Testing - Visual Inspection *For more details, please refer to the PDF document or feel free to contact us.

  • Other analytical equipment

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Power semiconductor analysis service

We will handle everything from the evaluation of the diffusion layer to physical analysis/chemical analysis for the faulty area!

At Aites Co., Ltd., we offer analysis services for power semiconductors. Since our separation and independence from the Quality Assurance Department of IBM Japan's Yasu Office in 1993, we have cultivated our own unique analysis and analytical techniques. We can handle not only Si semiconductors but also the trending wide bandgap semiconductors. 【Features】 - OBIRCH analysis supports not only Si but also SiC and GaN devices. - FIB processing is possible from either side. - Visualization of the depletion layer formed at the PN junction. - Elemental analysis such as EDS and EELS is also supported. *For more details, please refer to the PDF document or feel free to contact us.

  • Other analytical equipment

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Defective analysis of liquid crystal panels

We will narrow down the defective areas through lighting confirmation, panel disassembly, and optical microscope observation!

We provide a defect diagnosis menu for LCD panels, from confirming defects to identifying causes and conducting detailed defect analysis. In the initial analysis, we perform a status check (lighting test), panel disassembly, and optical microscope observation, tailored to the defect symptoms. In the detailed analysis, we propose suitable methods such as surface analysis, cross-sectional analysis, and component analysis based on the diagnosis results from the initial analysis. It is also possible to speculate on the defect occurrence mechanism, including narrowing down the production processes that caused the defects. 【Analysis Content】 ■ Initial Analysis - Conducted based on the status check (lighting test), panel disassembly, and optical microscope observation, tailored to the defect symptoms. - Narrowing down from broad areas such as cell panels and surrounding circuits to finer details. ■ Detailed Analysis (additional analysis fees apply) - Proposing suitable methods such as surface analysis, cross-sectional analysis, and component analysis based on the diagnosis results from the initial analysis. - Speculating on the defect occurrence mechanism, including narrowing down the production processes that caused the defects. *For more details, please refer to the PDF document or feel free to contact us.

  • Other analytical equipment

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Research Institute of Chemical Reaction Mechanisms, Material Degradation Analysis (Decomposition and Deterioration of PET)

We will suggest appropriate analysis methods based on the condition of polymer materials and samples!

At Aites Co., Ltd., we conduct material degradation analysis. We propose appropriate analytical methods based on the condition of polymer materials and samples. By analyzing the degradation process that the material has undergone and optimizing the polymer materials and usage environment, it is possible to extend the product's lifespan. *For more details, please refer to the PDF document or feel free to contact us.

  • Other services and technologies
  • Non-destructive testing

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Panel Polarizer Degradation Analysis

Example of degradation analysis of panel polarizers published! We conducted degradation analysis through reliability testing and outgassing analysis using HS-GCMS.

The polarizers used in LCD panels are made of multilayer films laminated with materials such as triacetyl cellulose, polyvinyl alcohol, and polyethylene terephthalate. This document presents a case study of the degradation analysis of panel polarizers after reliability testing, conducted through HS-GCMS analysis and thermal desorption GCMS analysis. Even invisible degradation might be detected with this analysis?! Please take a moment to read it. [Contents] ■ Reliability Testing ■ Outgassing Analysis via HS-GCMS ■ Low Boiling Point Component Analysis via Thermal Desorption GCMS *For more details, please refer to the PDF document or feel free to contact us.

  • Other analytical equipment
  • Other services and technologies

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Analysis of film property changes due to UV irradiation

Investigating how the light transmittance of blue light cut film changes using a spectrophotometer!

The blue light cut film has the effect of suppressing the transmission of visible light, especially light with wavelengths below 500nm, compared to regular PET film. Using a spectrophotometer, we examined how the light transmission properties of the blue light cut film change under UV irradiation. The transmission of light in the wavelength range of 350 to 400nm further decreased due to UV irradiation. Additionally, we conducted an analysis of the reactions occurring within the film using GC-MS. [Analysis Content] - Light transmission characteristics of regular PET film and blue light cut film - UV irradiation on blue light cut film - GC-MS analysis of components within the film *For more details, please refer to the PDF document or feel free to contact us.

  • Other analytical equipment

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Analysis of quality products of overseas manufactured LCD displays.

If any issues arise, detailed analysis will be provided! A simplified analysis for customers considering the introduction of overseas LCDs.

We would like to introduce the analysis of good quality liquid crystal displays by Aites Co., Ltd. First, as part of the visual inspection, we conduct optical microscope observations focusing on the FPC, FOG, COG, and sealing materials in the cell panel state. Next, we dismantle the cell panel to check the sealing materials, PI film, and TFT shape. If any defects are found during the good quality analysis, we will propose additional analyses such as cross-sectional observation of the wiring and foreign matter analysis to investigate the cause. Please feel free to consult us when needed. [Contents of Visual Inspection] ■ Are there any corrosion or foreign matter on the FPC wiring? ■ Is there any issue with the FOG bonding? ■ Is there any issue with the COG bonding? ■ Are there any breaks or defects in the sealing materials? *For more details, please refer to the PDF document or feel free to contact us.

  • Structural Survey

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Failure analysis of power devices

We will identify and observe the defective areas of power devices such as diodes, MOS-FETs, and IGBTs.

We perform optimal preprocessing for power devices such as diodes, MOS FETs, and IGBTs of all sizes and shapes, and identify and observe defective areas through backside IR-OBIRCH analysis and backside emission analysis. ■ Preprocessing for Analysis - Backside Polishing - Supports various sample forms. Si chip size: 200um to 15mm square ■ Defective Area Identification - Backside IR-OBIRCH Analysis / Backside Emission Analysis - IR-OBIRCH Analysis: Supports up to 100mA/10V and 100uA/25V Emission Analysis: Supports up to 2kV * Covers a wide range of defect characteristics such as low-resistance shorts, micro-leaks, and high-voltage breakdown failures. ■ Pinpoint Cross-Section Observation of Leak Areas - SEM/TEM - Select SEM or TEM observation based on the predicted defects, allowing for pinpoint physical observation and elemental analysis of leak defect areas.

  • Other analytical equipment

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