Substrate Product List and Ranking from 103 Manufacturers, Suppliers and Companies

Last Updated： Aggregation Period:Nov 19, 2025～Dec 16, 2025
This ranking is based on the number of page views on our site.

Substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Nov 19, 2025～Dec 16, 2025
This ranking is based on the number of page views on our site.

  1. 電研精機研究所 Tokyo//others
  2. 共和電子 Tokyo//Trading company/Wholesale
  3. 太洋テクノレックス 本社　和歌山 Wakayama//others
  4. 4 三和電子サーキット Osaka//others
  5. 5 東京電気技術工業 Tokyo//Electrical equipment construction business
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Substrate Product ranking

Last Updated： Aggregation Period:Nov 19, 2025～Dec 16, 2025
This ranking is based on the number of page views on our site.

  1. Kyoei Electronics Co., Ltd. Company Information 共和電子
  2. Transparent FPC (Transparent Flexible Printed Circuit Board) 太洋テクノレックス 本社　和歌山
  3. Noise Cut Transformer NCT-F1 電研精機研究所
  4. Noise Cut Transformer NCT-R5-J2 電研精機研究所
  5. 4 Ideal for UV-C sterilization devices! Inverter (board type) 東西電気産業 本店(大阪)、東京店

Substrate Product List

241～255 item / All 377 items

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IoT-enabled devices with control platform and smartphone app! [Distribution of system case study materials]

IoT-enabled devices with control platform and smartphone app! [Distribution of system case study materials]

Examples of sensor measurement systems using Bluetooth and Wi-Fi! In-house integrated support for circuit board and software development!

At KYOWA Engineering Laboratory, we realize the IoT integration of devices through the collaboration of "control boards" and "smartphone applications." By connecting control boards with communication functions to devices, we enable the transmission of device data to smartphones. The data collected from the devices can be sent to a server using the smartphone's internet communication capabilities, allowing for data viewing and management on servers or PC terminals. [Key Points of Our IoT Development] ★ We handle board and software development consistently in-house. ★ Leveraging our experience in MAC development, we specialize in iOS application development. - Sensor measurement systems using Bluetooth/Wi-Fi - Development of communication control boards - Development of dedicated control/viewing applications - Data transfer to cloud servers, etc. ◇ We also have numerous achievements in in-house and contract development! Please feel free to consult with us! ◇ ★ For more details, please refer to the case materials available for download in the "PDF Download" section below.

  • IoT

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Measurement sensor, iPad and Bluetooth integrated control IoT development case study

Measurement sensor, iPad and Bluetooth integrated control IoT development case study

Consistent support for substrate and software development in-house! For IoT development, please consult KYOWA Engineering Laboratory.

At KYOWA Engineering Laboratory, we realize the IoT integration of devices through the collaboration of "control boards" and "smartphone applications." ■Example: Development of control boards for measuring sensors and Bluetooth integration with tablets (iPads) for measurement applications. 1. Measure the load capacity of transport vehicles using measuring sensors. 2. Share information from the measurement application via Bluetooth through the communication control board. 3. In offices, capture and aggregate vehicle numbers, loading dates, locations, and quantities. Information on work status and movement can be viewed in real-time. ★ We have many other achievements in in-house development and contract development! ★ For more details, please refer to the case materials available for download in the "PDF Download" section below.

  • IoT

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Case Study of IoT Development: Automated Production Line Aggregation Function Using Cloud Servers

Case Study of IoT Development: Automated Production Line Aggregation Function Using Cloud Servers

Consistent support for substrate and software development in-house! For IoT development, please consult KYOWA Engineering Laboratory.

At KYOWA Engineering Laboratory, we realize the IoT transformation of devices through the integration of "control boards" and "smartphone applications." ■ Example: Production Line Automation Features 1. Automatic recognition and transfer of item information using barcodes, etc. 2. Counting production volume using count sensors. 3. Information sharing with each site and factory through an IoT gateway. 【Real-time Aggregation System Using Cloud Server】 ■ Item Information Transfer: Automatically aggregates item information recognized from barcodes to the cloud server. ■ Automation and Real-time Aggregation of Production Volume: Count sensors are installed on packaging band machines and conveyors, enabling automatic aggregation and real-time understanding at each site. ★ We have many other achievements in in-house development and contract development! ★ For more details, please refer to the case study materials available for download in the "PDF Download" section below.

  • IoT

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Production Line Work Record System IoT Development Case Study

Production Line Work Record System IoT Development Case Study

Consistent support for substrate and software development in-house! For IoT development, please consult KYOWA Engineering Laboratory.

At KYOWA Engineering Laboratory, we realize the IoT integration of devices through the collaboration of "control boards" and "smartphone applications." ■Example: Production Line Work Record System 1. Record the work details for factories 1 to 3 individually on each tablet. 2. Save all work records to a single cloud for centralized management of multiple lines. 3. Information from each line can be monitored in real-time. ★ We have many other achievements in in-house development and contract development! ★ For more details, please refer to the case study materials available for download in the "PDF Download" section below.

  • IoT

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Real-time factory operation confirmation system IoT development case study

Real-time factory operation confirmation system IoT development case study

Consistent support for substrate and software development in-house! For IoT development, please consult KYOWA Engineering Laboratory.

At KYOWA Engineering Laboratory, we realize the IoT integration of devices through the collaboration of "control boards" and "smartphone applications." ■ Case Study: Real-Time Factory Operation Monitoring System Enables management of real-time operational status of each factory from PCs at various locations. 1. Record and manage the operational status of each factory on their respective PCs. 2. Collect records from each factory via the cloud for centralized management. 3. As a security measure, restrict access to devices that can access the cloud, preventing information leakage. ★ We also have numerous achievements in both in-house development and contract development! ★ For more details, please refer to the case study materials available for download in the "PDF Download" section below.

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Examples utilizing cloud, control boards, and smartphone applications.

Examples utilizing cloud, control boards, and smartphone applications.

Introduction of examples such as load measurement sensor Bluetooth control systems and remote monitoring systems for gas facilities.

In our IoT development, we realize the IoTization of devices through "control boards" and "smartphone applications." Furthermore, it is possible to manage information using the cloud, link vehicle information, and integrate health management and advisory services. Based on specific examples, we will provide a detailed introduction to the mechanisms in place and how they can be utilized. *Details of the examples can be viewed through the related links. For more information, please feel free to contact us.

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Printed circuit board manufacturing, double-sided through-hole board

Printed circuit board manufacturing, double-sided through-hole board

Galapoe substrate and composite are standard. Other special materials such as BT resin are also regularly stocked.

We standardly use FR-4 (glass epoxy substrate) and CEM-3 (composite), but we also keep special materials such as BT resin in stock. We offer a wide range of thicknesses from 0.06 mm to 3.2 mm. We can ship in as little as 1 business day. For more details, please contact us or refer to our catalog.

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Printed Circuit Board Manufacturing - Multilayer Through-Hole Board

Printed Circuit Board Manufacturing - Multilayer Through-Hole Board

Supports from 4 layers to 24 layers. Also compatible with special substrates such as through-hole resin filling.

We can accommodate from 4 layers to 24 layers. Additionally, we can handle special substrates such as impedance control and through-hole resin filling. We operate three vacuum press machines, allowing for quick turnaround even in mass production. We can ship in as little as 2 working days. For more details, please contact us or refer to our catalog.

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Printed circuit board manufacturing - single-sided flexible board

Printed circuit board manufacturing - single-sided flexible board

By using thin materials, a flexible substrate with a total thickness of 50μ can be achieved.

Single-sided flexible printed circuit boards are available in various material thicknesses. By using thin materials, it is possible to achieve a total thickness of 50μ for the thinnest flexible boards. We can also accommodate fine pattern substrates using thin copper foil materials, as well as halogen-free options. For more details, please contact us or refer to our catalog.

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Printed Circuit Board Manufacturing - Multilayer Flexible Circuit Board

Printed Circuit Board Manufacturing - Multilayer Flexible Circuit Board

Production is possible from 3 layers to 8 layers. Thin materials and thin copper foil are used to ensure bendability.

We can manufacture from 3 to 8 layers. Typically, with multilayer flex circuits, as the number of layers increases, the thickness also increases, which compromises the bendability that is a characteristic of flexible substrates. However, by using thin materials and thin copper foil, we ensure bendability. For more details, please contact us or refer to our catalog.

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Printed circuit board manufacturing - Rigid-flex boards

Printed circuit board manufacturing - Rigid-flex boards

Production possible from 2 layers to 8 layers. Prototyping of rigid-flex PCBs is available with short lead times and low prices.

We can manufacture from 2 layers to 8 layers. When it comes to rigid-flex PCBs, it often requires creating molds, making it very expensive even for prototypes, and the production time can be significantly long. At K2 Co., Ltd., we combine our experience as a rigid PCB manufacturer with our experience as a flexible PCB manufacturer to offer rapid prototyping of rigid-flex PCBs at low prices. We can flexibly accommodate complex shapes and special layer configurations, so please feel free to consult with us. For more details, please contact us or refer to our catalog.

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Special Printed Circuit Board Manufacturing IVH Board

Special Printed Circuit Board Manufacturing IVH Board

A substrate that connects only the necessary interlayers without penetrating the holes in a multilayer substrate.

This is a substrate that connects only the necessary layers without penetrating holes in a multilayer board. As the number of layers in printed circuit boards has increased, the demand for this has grown. It can be manufactured using either blind via holes that connect the outer and inner layers or inner vias that embed through holes in the inner layers. Additionally, it is compatible not only with standard multilayer boards but also with multilayer flexible boards and rigid-flex boards. For more details, please contact us or refer to the catalog.

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New Comprehensive Catalog from a Specialized Substrate Manufacturer [*Low-Cost Solutions for Special Substrates!*]

New Comprehensive Catalog from a Specialized Substrate Manufacturer [*Low-Cost Solutions for Special Substrates!*]

A comprehensive catalog filled with hints for achieving ultra-short delivery times for special substrates is available for free!

At K2, we have all the manufacturing equipment necessary for circuit board production fully in-house, and by operating that equipment at 100%, we achieve shorter lead times and lower costs for special circuit boards and medium-lot products that are difficult for prototype manufacturers to handle. 1. They don't respond to ultra-short lead times... 2. The initial costs for flexible boards are too high... 3. I was turned down when consulting about special circuit board manufacturing... 4. They don't respond to short lead times for medium-lot production... 5. There are concerns about the quality of the circuit boards... We will solve these five issues faced by the circuit board manufacturing industry using our unique know-how. 【Case Studies】 ■ Resin filling (Pad on Via hole) specification ⇒ Instead of the usual 3 extra days required for outsourcing, we can handle it in 1 day! ■ Double-sided flexible circuit boards ⇒ Achieved shorter lead times and reduced initial costs by using laser processing instead of molds for shape processing! ■ 4-layer rigid-flex circuit boards (without reinforcement) ⇒ Normally 7 days, expedited response in 6 days! *For more details, please contact us or download our catalog to view.

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