Case study of drilling into tungsten material: "Contract processing of laser microfabrication"
We accept orders for micro holes and micro cutting processing, from prototype production to mass production.
Material: Tungsten Plate thickness: 50μm / Hole diameter: φ (phi) 300μm At Higashi-Nari Electro Beam Co., Ltd., we utilize precision laser processing for fine drilling, cutting, grooving, and more. Selection of laser wavelengths (IR, SHG, THG) is available. We can accommodate various materials including stainless steel, titanium, molybdenum, tantalum, niobium, aluminum, copper, iron, ceramics, glass, and resins. Please feel free to consult us. 【Features】 ○ Suppression of metal burr generation ○ Suppression of thermal sag in resin materials ○ Drilling of holes less than 100μm For more details, please contact us or download the catalog.
- Company:東成エレクトロビーム 本社工場
- Price:Other