Short pulse laser processing machine [for drilling and cutting silicon wafers, etc.!]
A short-pulse laser processing machine used for drilling and cutting silicon wafers!
The "Short Pulse Laser Processing Machine" is a processing machine that is applied to drilling, cutting of silicon wafers, and laser patterning of thin-film solar cell materials due to its features such as high output and fine processing. Additionally, it is used for cutting and drilling of lithium battery metal films, substrate cutting, and sapphire cutting. 【Features】 ■ Output: 20W, Pulse Width: 100ps ■ Peak Power Output: 300kW ■ Frequency: Adjustable from 30kHz to 1000kHz ■ Pulse Energy: 300μJ@1ns ■ Beam Quality: M2 < 1.3 *For more details, please request materials or view the PDF data available for download.
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basic information
【Application Areas】 ■ Drilling and cutting of silicon wafers, laser patterning of thin-film solar cell materials, cutting and drilling of lithium battery metal films, substrate cutting, sapphire cutting, etc. *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
Detailed information
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Processing examples Battery manufacturing field
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Processing example Wafer cutting
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Processing examples: Sapphire cutting and drilling.
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Processing example: Silicon cutting
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Company information
We handle UV (ultraviolet) laser markers, MOPA laser markers, YAG laser welding machines, and fiber laser welding machines. Please consult us for fine processing of new materials and metals, as well as welding of dissimilar metals. We can provide equipment that supports laser applications such as laser welding, laser marking, laser surface treatment, peening, and laser rust removal (cleaning devices). We particularly excel in the fields of precision welding and UV laser processing. We are skilled at proposing systems tailored to customer needs. Even in areas where laser processing is not yet common, we make the impossible possible using our own processes. If you have any ideas like "It would be nice if this existed" or "It would be convenient to have that," please feel free to consult us. 1. We can propose and provide laser-related equipment compatible with various wavelengths, especially with expertise in welding-related and UV laser-related technologies! 2. We can propose not only standalone lasers but also systems (including design and manufacturing of transport systems, jigs, and provision of inspection units). 3. Our equipment is offered at lower prices and shorter delivery times compared to competitors. 4. We provide prompt after-sales service and can arrange replacement parts through our global procurement network, including aftercare with repairs by domestic technicians.
![[Information] Dramatically Changing Tribological Properties through Ultrafast Pulse Laser Processing](https://image.www.ipros.com/public/product/image/f30/2001455984/IPROS87401530065225676596.png?w=280&h=280)
