Heat sink(CPU) - List of Manufacturers, Suppliers, Companies and Products

Last Updated： Aggregation Period:Nov 19, 2025～Dec 16, 2025
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Heat sink Product List

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Heat sink for high-performance forced air cooling "YK/YU/YX series"

Heat sink for high-performance forced air cooling "YK/YU/YX series"

The YK/YU/YX series is a high-performance forced air cooling type with a comb fit design.

We are pursuing high performance for heat sinks and radiators. The semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated from the devices if cooling is not performed during operation. 【Features】 〇 A radiator for electronic components that prevents device destruction → Quickly transfers heat for cooling 〇 Composed of a base plate for mounting heat-generating devices and fins for dissipating heat from the base plate 〇 High-performance forced air cooling 〇 Comb-fit type 〇 YK series → Fin-joint type single-sided base 〇 YU series → Fin-joint type single-sided base (narrow pitch) 〇 YX series → Fin-laminated hollow double-sided base type *Online meetings are also possible, so please feel free to contact us.

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Heat Sink for Stud-Type Devices S Series

Heat Sink for Stud-Type Devices S Series

The S series is a heat sink for stud-type devices with aluminum extrusion.

We are pursuing high performance for heat sinks and radiators. The semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most of them consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to force air convection or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat processing with heat sinks. The S series heat sink for stud-type devices is an aluminum extruded type heat sink designed for stud-type devices. *Online meetings are also possible, so please feel free to contact us.

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Aluminum Water-Cooled Heat Sink "YC Series"

Aluminum Water-Cooled Heat Sink "YC Series"

Since it is shaped using aluminum profiles, it achieves a cost reduction of 30-40% compared to copper! It is a water-cooled heat sink that uses forced cooling with water.

Semiconductor devices (transistors, CPUs, IGBTs, etc.) used in electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves forcing air to circulate using a fan or using cooling media such as water. This product employs forced cooling using water, achieving a simple and low-cost water-cooled heat sink made from aluminum profiles and copper pipes. 【Features】 ■ Formed from profiles (custom options and pipe embedding specifications are possible) ■ Low cost ■ Specification verification is supported by simulation software → If you provide the loss power (W) and the model name of the FAN to be used, we can present it in a graph, which can be used as evidence when conducting prototypes. *If you wish to request a simulation, please contact us via the inquiry button. *Online meetings are also possible, so feel free to reach out to us.

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Free comprehensive catalog available! Electronic component radiator "heat sink"

Free comprehensive catalog available! Electronic component radiator "heat sink"

Utilizing the excellent thermal conductivity of aluminum for heat dissipation and heat absorption! Preventing reliability and performance degradation or failure due to temperature rise in semiconductor devices.

Heat sinks are utilized as practical and economical cooling methods in various industries. This method is adopted in the semiconductor industry as the most practical and economical cooling solution to prevent reliability and performance degradation, as well as destruction due to temperature rise in semiconductor devices. Additionally, the "heat sink" of LSI coolers is characterized by its resistance to vibration, which can also help reduce initial costs. [Contents] - V Series: Hollow type (for medium power forced air cooling) - M Series: Multipurpose, general-purpose fin type heat sink - H Series: Multipurpose, general-purpose fin type heat sink *This download is a digest version. If you would like the complete version, please contact us. *Online meetings are also possible, so feel free to reach out.

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Heat Sink Hollow Type (Medium Power Forced Air Cooling) V Series

Heat Sink Hollow Type (Medium Power Forced Air Cooling) V Series

The V series is an aluminum extruded type hollow fin heat sink designed for forced air cooling.

We are pursuing high performance in heat sinks and radiators. Semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to forcibly circulate air or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat treatment with heat sinks. The hollow type heat sink (for medium power forced air cooling) V series is an aluminum extruded type hollow fin heat sink for forced air cooling. *Online meetings are also possible, so please feel free to contact us.

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Heat sink for pin-mounted devices P/FP/U series

Heat sink for pin-mounted devices P/FP/U series

The P/FP series is of the aluminum extrusion type, while the U series is of the plate type.

We are pursuing high performance for heat sinks and radiators. The semiconductor devices (transistors, CPUs, IGBTs, etc.) used in current electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Most heat sinks consist of a base plate to which the heat-generating device is attached and fins that dissipate heat from the base plate. The cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves using a fan to forcibly circulate air or using cooling media such as water. In LSI coolers, we continue to pursue high performance supported by thermal theory to achieve efficient heat processing with heat sinks. The P/FP/U series of heat sinks for pin-mounted devices consists of the P/FP series, which is an aluminum extrusion type, and the U series, which is a plate type. *Online meetings are also possible, so please feel free to contact us.

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