Since it is shaped using aluminum profiles, it achieves a cost reduction of 30-40% compared to copper! It is a water-cooled heat sink that uses forced cooling with water.
Semiconductor devices (transistors, CPUs, IGBTs, etc.) used in electrical and electronic equipment can be destroyed by the heat generated during operation if cooling is not performed. A heat sink is an electronic component radiator that prevents the destruction of the device by quickly transferring and cooling this heat. Cooling methods are classified into natural cooling, which utilizes the convection of air generated by the heat produced, and forced cooling, which involves forcing air to circulate using a fan or using cooling media such as water. This product employs forced cooling using water, achieving a simple and low-cost water-cooled heat sink made from aluminum profiles and copper pipes. 【Features】 ■ Formed from profiles (custom options and pipe embedding specifications are possible) ■ Low cost ■ Specification verification is supported by simulation software → If you provide the loss power (W) and the model name of the FAN to be used, we can present it in a graph, which can be used as evidence when conducting prototypes. *If you wish to request a simulation, please contact us via the inquiry button. *Online meetings are also possible, so feel free to reach out to us.
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basic information
【Features】 〇 Pursuit of high performance for heat sinks and radiators 〇 Radiator for electronic components that prevents element destruction → Quickly transfers heat for cooling 〇 Composed of a base plate for mounting heating elements and fins for dissipating heat from the base plate 〇 For water cooling 〇 YC series → Comb-fit type → Copper pipe insert type / Double-sided base type
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One of the problems currently facing the electronics field is the issue of heat. Much of communication and information processing relies on computers, and there is a trend towards larger data volumes and larger systems. The computational power of the CPU, which is the heart of the computer, demands further acceleration, and the faster the processing, the more heat the CPU itself generates. The most effective way to manage this heat currently is through heat sinks. LSI Cooler, which has always considered heat, has developed various heat sinks that efficiently dissipate heat, including a new type of heat sink called "Comb Fit." Utilizing precise heat measurement, development capabilities backed by thermal theory, and aluminum processing technology that enables the mass production of precise heat sinks, we develop and manufacture a variety of heat sinks, ranging from those for computers to large ones for automotive equipment.
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