Chip coat "First Supply Type Underfill Material (NCP)"
High-purity insulating materials for the purpose of sealing semiconductor chips!
The 'Pre-supply Type Underfill Material (NCP)' is a pre-supply type paste underfill material. After applying it to the substrate or interposer, the chip is thermocompression bonded (TCB) and sealed. This material is capable of improving productivity and controlling fillet width (compatible with KOZ). [Features] ■ Insulating material for encapsulating semiconductor chips ■ Pre-supply type paste ■ Improved productivity ■ Capable of controlling fillet width *For more details, please refer to the PDF document or feel free to contact us.
- 企業:ナミックス
- 価格:Other