Conductor Resistance Automatic Monitoring System / Continuity Resistance Monitoring System
A monitoring system that allows testing independent of the test tank manufacturer. It will be an original collection/analysis software that reflects the voices of our customers.
- A monitoring system that allows testing independent of the test chamber manufacturer. - An original data collection/analysis software that reflects the voice of our customers. We are utilized by many customers, including various manufacturers (semiconductors, electrical components, materials, resins), private and national research institutions, and contract testing companies.
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basic information
This is a system that can measure and collect data on the resistance of solder joints and conductive parts of mounted components in real-time during accelerated tests (such as heat cycle tests) to evaluate the implementation reliability lifespan of IC packages. In conventional methods, measuring conductivity before and after tests could sometimes show temporary recovery of conductivity at the point of failure, making it difficult to accurately confirm lifespan. This system allows for real-time monitoring and data collection of line resistance values, enabling immediate detection and recording of abnormalities that occur during testing. [Features] - Achieves lightweight and compact equipment with high reliability through a system configuration centered on the latest modular hardware. - Standard channel count is 192 channels (expandable up to 2048 channels with optional additions). - Improves heat resistance and handling by using high-heat-resistant custom cables for signal connections between the system and devices. - Comes with a VIEWER that allows real-time confirmation of collected data during testing.
Price information
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Delivery Time
Applications/Examples of results
- Various reliability tests, long-term durability tests - Collection of durability test data for lead-free solder materials - Measurement of contact resistance and conductor resistance for high-density packaging - Evaluation of contact performance for sockets, connectors, etc.
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Company information
As a development and design company, we promote the development, design, and evaluation of semiconductor peripheral circuits and application products through simulation technology.