Support yield improvement through pressure management!
◆ We prepare sensor sheets according to the size of the silicon wafer. ◆ We support both batch and individual sheet processing. ◆ The sensor sheets are ultra-thin, with a thickness of about 0.1mm, allowing measurements in conditions very close to actual use. ◆ Measurement data can be displayed in 2D and 3D screens. Additionally, the captured data can be replayed, and the analysis functions are well-equipped (please contact us for compatible computer models).
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basic information
◆ We provide sensor sheets according to the size of the silicon wafer. ◆ We support both batch and individual sheet processing. ◆ The sensor sheets are ultra-thin, approximately 0.1mm thick, allowing measurements in conditions very close to actual use. ◆ Measurement data can be displayed in 2D and 3D screens. Additionally, captured data can be replayed, and the analysis features are comprehensive (please contact us for compatible computer models).
Price information
-
Delivery Time
※45 days
Applications/Examples of results
◆Silicon wafer polishing contact pressure distribution ◆CMP
Company information
In the current situation where advanced technological capabilities are required of Japanese companies as a whole, we aim to be a trading company that not only possesses "integrity" and "technology," but also explores our customers' needs and responds to their requests.
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