A desktop model that achieves high-precision and stable release agent application for small substrates.
This device is designed to apply a release agent to the surface of a workpiece by processing a maximum 4-inch wafer substrate through the steps of release agent application, rinse cleaning, and fixation drying. The processing is done one workpiece at a time. It is a dip coater-type device that reflects the dip coating technology owned by SDI. With a stroke of 140mm, it is a compact nano coater that accommodates a target size of 4 inches. Despite its tabletop design and space-saving features, it achieves high-precision control, enabling uniform and highly reproducible application of the release agent. It is designed for research and development or small-scale production, supporting stable thin film formation.
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basic information
【Main Specifications】 1. Stroke: 140mm 2. Target Size: 4 inch 3. Target Material: Wafer 4. Dip Speed: From 0.1mm/sec to 10mm/sec 5. Coating Liquid Circulation: None 6. Coating Liquid Temperature Control: None 7. Filter Mesh: None 8. Drying Section: None 9. Drying Temperature: None 10. HEPA Unit: None 11. Device Size (Approximate): W:450×D:670×H:685mm
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Applications/Examples of results
Application of release agent to 4-inch wafer substrates. It is used for applying release agents to semiconductor wafers and small optical substrates, as well as in biochip research. It is suitable for small lot prototypes and experimental purposes, and is widely adopted in laboratories and development departments.
Line up（18）
| Model number | overview |
|---|---|
| NIC-1106 | A desktop model that achieves high-precision and stable release agent application for small-sized substrates. |
| NIC-1103 | 6 to 8 inch board compatible, highly versatile medium-sized nano coater. |
| NIC-0809 | Ideal for φ200mm substrates, a nano coater that supports a wide range of research and development. |
| NIC-1109G | Box-integrated design that achieves high-precision coating in an inert gas environment. |
| NIC-1208 | High-power model compatible with 600mm square substrates, achieving uniform coating of large samples. |
| NIC-1410-S1 | High-precision dip coater for small cubic samples, compatible with thicknesses up to 1.5mm. |
| NIC-1308 | Dedicated nano coater compatible with roll materials, capable of continuous coating. |
| DT-1104 | A dedicated device for achieving uniform coating on disk media. |
| MD-1501-S1 | Dip coating device with a circulation mechanism that enhances liquid stability and has high chemical resistance. |
| SA-1109 | High-precision cleaning of substrates and samples is possible with ultrasonic cleaning. |
| SA-1202 | An efficient cleaning and drying integrated device that combines warm water drying. |
| NIC-1510 | A high-performance model that balances tank replacement and cleaning, suitable for multiple purposes. |
| MD-1802 | High-efficiency model enabling multilayer film formation and continuous processing with an 8-slot configuration. |
| LD-1811 | Linear type that achieves oxidation prevention and stable film formation through nitrogen purge. |
| NIC-2003 | Supports a maximum stroke of 1.3m, an ideal model for handling large circuit boards. |
| DT-1812 | Ideal for continuous process handling, flexible support for various prototypes with an 8-tank system. |
| DT-2002 | Specialized dip coater for cylindrical materials, compatible with diameters of φ20 to 60mm. |
| NIC-2409 | Nano coater for large cylindrical materials compatible with Φ200 to 700mm sleeves. |
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