Nano Incoater (Release Agent Coating Device) NIC-1103
Release Type Processing Device (Nano Coater: NIC-1103)
6 to 8 inch board compatible, versatile medium-sized nano coater (release agent application device)
This device is designed to apply a release agent to a maximum 8-inch wafer through the processes of coating, rinsing, and drying, thereby ensuring the release agent adheres to the work surface. The processing is done one workpiece at a time. It is a dip coater-type device that reflects the dip coating technology owned by SDI. It has a stroke of 250mm and is compatible with sizes ranging from 6 to 8 inches. It can uniformly coat medium-sized substrates and is suitable for small lot production and prototyping processes. It achieves high-quality film formation and allows for highly reproducible processing. *For more details, please download the catalog or contact us.*
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basic information
【Main Specifications】 1. Stroke: 250mm 2. Target Size: 6inch, 8inch 3. Target Material: Wafer 4. Dip Speed: From 0.1mm/sec to 10mm/sec 5. Coating Liquid Circulation: Yes 6. Coating Liquid Temperature Control: No 7. Filter Mesh: 0.05μm 8. Drying Section: No 9. Drying Temperature: No 10. HEPA Unit: Yes 11. Device Size (Approximate): W: 904×D: 840×H: 1070mm
Price range
P5
Delivery Time
Applications/Examples of results
By applying a release agent to a maximum 8-inch wafer and processing it through the steps of coating, rinsing, and drying, the release agent is fixed onto the work surface. It is used for small-scale production and prototyping in electronic components, optical device substrates, and semiconductor processes. In research applications, it has a track record of being used for new material evaluation and release agent coating tests.
Line up(18)
Model number | overview |
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NIC-1106 | A desktop model that achieves high-precision and stable release agent application for small substrates. |
NIC-1103 | 6 to 8 inch board compatible, versatile medium-sized nano coater. |
NIC-0809 | Nano coater optimized for φ200mm substrates, suitable for a wide range of research and development. |
NIC-1109G | Box-integrated design that achieves high-precision coating in an inert gas environment. |
NIC-1208 | High-power model compatible with 600mm square substrates, achieving uniform coating of large samples. |
NIC-1410-S1 | High-precision dip coater for small cubic samples, compatible with thicknesses up to 1.5mm. |
NIC-1308 | Dedicated nano coater compatible with roll materials, capable of continuous coating. |
DT-1104 | A dedicated device for achieving uniform coating on disk media. |
MD-1501-S1 | Dip coating device with a circulation mechanism that enhances liquid stability and has high chemical resistance. |
SA-1109 | High-precision cleaning of substrates and samples is possible with ultrasonic cleaning. |
SA-1202 | An efficient cleaning and drying integrated device that combines warm water drying. |
NIC-1510 | A high-performance model that balances tank replacement and cleaning, accommodating multiple uses. |
MD-1802 | High-efficiency model enabling multilayer film formation and continuous processing with an 8-slot configuration. |
LD-1811 | Linear type that achieves oxidation prevention and stable film formation through nitrogen purge. |
NIC-2003 | Supports a maximum stroke of 1.3m, an ideal model for handling large circuit boards. |
DT-1812 | Ideal for continuous process handling, flexible support for various prototypes with an 8-tank system. |
DT-2002 | Specialized dip coater for cylindrical materials, compatible with diameters of φ20 to 60mm. |
NIC-2409 | Nano coater for large cylindrical materials compatible with Φ200 to 700mm sleeves. |
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