Automatic dip coater for pattern resist application. Achieves precise resist coating on large area substrates with fully automated control.
This device is a fully automatic dip coater (dip coating) that continuously dip coats, dries, and cools a pattern resist as a substitute for dry film on a flat copper plate in the printed circuit board manufacturing process. It is compatible with substrates measuring 650mm in stroke and W620×H510×t1.6mm. With fully automatic control, it achieves uniform and highly reproducible resist application, making it ideal for photolithography processes. The design is optimized to enhance productivity by streamlining the processing of large-area substrates.
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basic information
【Main Specifications】 1. Stroke: 650mm 2. Target Size: W:620×H:510×t1.6 3. Target Material: Copper Plate 4. Dip Speed: 1.0mm–50mm/sec 5. Coating Liquid Circulation: Yes 6. Coating Liquid Temperature Control: Yes 7. Filter Mesh: Yes 8. Drying Section: Yes 9. Drying Temperature: 100℃ 10. HEPA Unit: Yes 11. Device Size (Approximate): W:8500×D:2000×H:2550mm
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Applications/Examples of results
Coating of resist on substrates for printed circuit boards, etc. Introduced in the resist coating process for semiconductor substrates and photomask manufacturing. Used for high-precision pattern formation in mass production lines.
Line up（10）
| Model number | overview |
|---|---|
| HC-1004 | Uniform application of hard coating material achieves excellent durability in film formation. |
| FA-0406 | Achieving precise resist coating on large-area substrates with fully automated control. |
| SA-1210 | Forming a uniform protective film with dedicated design for printed circuit boards. |
| SA-1407-S1 | Supports 2-inch wafer compatibility and precise photolithography processes. |
| SA-1503-S1 | A semi-automatic device that balances operability and precision, excelling in versatility. |
| SA-1509UL | UL-certified device equipped with a rotary mechanism capable of uniformly processing complex shapes. |
| SA-1712 | Achieving high-precision coating while minimizing liquid usage. |
| SA-1801 | Achieving high-precision processing by cleaning the surface of glass materials with ultrasonic cleaning. |
| SA-2203 | 4-inch wafer compatible, high-precision photoresist dip coater |
| SA-2210 | Mass production equipment that streamlines multilayer film formation with high-speed processing at 1000 mm/sec. |
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