Precision parts storage/transportation supplies

We are pleased to announce that we will be exhibiting at the 40th Internepcon Japan. Event Dates: January 19 (Wednesday) - 21 (Friday), 2011 Venue: Tokyo Big Sight Booth Number: 33-29 We will showcase products that enhance productivity and contribute to improved operational efficiency! Our exhibition will feature a variety of semiconductor/electronic components, precision parts, storage and transport solutions, protection, and retention tools. We cater to a wide range of needs from research/development/evaluation departments to manufacturing/inspection processes and shipping. As a new product, we will display items that are ideal for transporting fragile materials and ultra-thin precision parts, including strong adhesive-related products that facilitate easy pickup (removal of mounted items) and a wafer case that enables the transport of ultra-thin wafers through a unique cushioning mechanism.

Tack Carrier (with strong adhesion & weak release adhesive sheet, precision parts transport case) This is a precision parts storage/transport case with a strong adhesive sheet that makes pickup easy. It holds the mounted items securely with a special sheet that has high adhesive properties, without vacuum adhesion, while allowing for easy pickup (removal of mounted items).

The 25th Nano Micro Business Exhibition/ROBOTECH will be held at Pacifico Yokohama from April 23 (Wednesday) to April 25 (Friday). In conjunction with the 25th Nano Micro Business Exhibition/ROBOTECH, we would like to introduce the highlights of the Sakase booth.

Recently, from April 23 (Wednesday) to 25 (Friday), the "Nano-Micro Business Exhibition / ROBOTECH" was held at Pacifico Yokohama. At the Sakase booth, we introduced a wide range of products useful in various fields, from "research and development to production processes and inter-company transportation," including sensors, IC chips, MEMS, semiconductors, and substrates! This time, we would like to share an overview of the exhibition.