Notice of Participation in Internepcon Japan 2011

We are pleased to announce that we will be exhibiting at the 40th Internepcon Japan.
Event Dates: January 19 (Wednesday) - 21 (Friday), 2011
Venue: Tokyo Big Sight
Booth Number: 33-29
We will showcase products that enhance productivity and contribute to improved operational efficiency!
Our exhibition will feature a variety of semiconductor/electronic components, precision parts, storage and transport solutions, protection, and retention tools.
We cater to a wide range of needs from research/development/evaluation departments to manufacturing/inspection processes and shipping.
As a new product, we will display items that are ideal for transporting fragile materials and ultra-thin precision parts, including strong adhesive-related products that facilitate easy pickup (removal of mounted items) and a wafer case that enables the transport of ultra-thin wafers through a unique cushioning mechanism.

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